Supply Chain Interdependence — Named-Entity Bilateral Edges Across the AI Compute Supply Chain

Gringras, David

Scrutica

Graph written 2026-09-14

Supply Chain

Supplier–customer relationships between named firms, and the layers with only one supplier.

Supplier–customer relationships

The graph

Search by company; filter by country, category or relationship type; export the whole public-provenance graph, or the one hop of suppliers and customers around a selected company. The canvas and the table beneath it draw that same subset; licensed relationships enter the corpus totals and are not redistributed.

Show top 500 supply-chain relationships as a table (alternative to the interactive graph)

500 public-provenance relationships, recorded single-source dependencies first and then by disclosed annual value; the full corpus holds 14,795, including the licensed-only records this table excludes. One row is one supplier → customer relationship between named companies. Where a source attests the relationship and none of the figures filed alongside it, the criticality and sole-source columns read as unknown; the fiscal-year column is filled where the disclosure states its period.
Supplier	Customer	Category	Product / service	Association evidence	Fiscal year	Criticality	Sole source
ASML	SMIC	semiconductor_equipment	DUV ArF immersion lithography (NXT:2000i). EUV blocked by Dutch export controls.	—	—	10.0	Yes
TSMC	Alibaba	foundry_services	5nm foundry manufacturing for Yitian 710 server CPU (T-Head design)	—	—	10.0	Yes
TSMC	Alphabet	foundry_services	Foundry manufacturing of TPU v4 silicon (process node unverified)	—	—	10.0	Yes
TSMC	Alphabet	foundry_services	Foundry manufacturing of TPU v5e silicon (process node unverified)	—	—	10.0	Yes
TSMC	Alphabet	foundry_services	Foundry manufacturing of TPU v5p silicon on TSMC N5	—	—	10.0	Yes
TSMC	Alphabet	foundry_services	Foundry manufacturing of TPU v6e (Trillium) on TSMC N5	—	—	10.0	Yes
SMIC	HiSilicon	foundry_services	Foundry services — HiSilicon Ascend 910B at SMIC N+2 (~7nm DUV)	—	—	10.0	Yes
TSMC	HiSilicon	foundry_services	Foundry services — HiSilicon Kirin/Ascend 910 at TSMC N7/N5 (TERMINATED May 2020)	—	—	10.0	Yes
AMD	Hygon Information Technology Co., Ltd.	other	AMD Zen x86 architecture license via TISC JV (TERMINATED June 2019)	—	—	10.0	Yes
TSMC	Biren Technology	foundry_services	Foundry services — Biren BR100 at TSMC N7 (TERMINATED Oct 2023)	—	—	10.0	Yes
TSMC	Moore Threads	foundry_services	Foundry services — Moore Threads Chunxiao GPU (in MTT S80) at TSMC N7 (TERMINATED Oct 2023)	—	—	10.0	Yes
TSMC	Apple	foundry_services	Foundry manufacturing of Apple silicon (A-series, M-series processors) at N3/N4 process nodes	—	—	10.0	Yes
Ajinomoto Co., Inc.	Ibiden	substrates	Ajinomoto Build-up Film (ABF) substrate material for FC-BGA packages	—	—	10.0	Yes
Ajinomoto Co., Inc.	Shinko Electric	substrates	Ajinomoto Build-up Film (ABF) substrate material for FC-BGA packages	—	—	10.0	Yes
Ajinomoto Co., Inc.	Unimicron	substrates	Ajinomoto Build-up Film (ABF) substrate material for FC-BGA packages	—	—	10.0	Yes
SMIC	Huawei Technologies	foundry_services	Foundry for Kirin/Ascend chips at N+2 (7nm-class DUV)	—	—	9.0	Yes
TSMC	Alphabet	advanced_packaging	CoWoS advanced packaging for TPU v5p/v6e with HBM stacks	—	—	9.0	Yes
TSMC	Iluvatar CoreX	foundry_services	Foundry services — Iluvatar CoreX TianGai-100 7nm GPGPU (first domestic 7nm GPGPU, released Jan 2021; foundry unverified but TSMC inferred from process node)	—	—	9.0	Yes
GlobalFoundries	Enflame Technology (Suiyuan)	foundry_services	Foundry services — Enflame CloudBlazer DTU at GlobalFoundries 12LP FinFET	—	FY2019	9.0	Yes
Broadcom Inc.	WT Microelectronics	networking	SEC >10% customer disclosure	—	FY2025	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	—	FY2021	—	No
Broadcom Inc.	WT Microelectronics	networking	SEC segment disclosure: BROADCOM INC → WT MICROELECTRONICS CO LTD	—	FY2024	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	—	FY2020	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	—	FY2019	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	—	FY2022	—	No
UNITED PARCEL SERVICE INC	Amazon.com, Inc.	other	SEC segment disclosure: UNITED PARCEL SERVICE INC → AMAZON.COM INC	—	FY2021	—	No
UNITED PARCEL SERVICE INC	Amazon.com, Inc.	other	SEC segment disclosure: UNITED PARCEL SERVICE INC → AMAZON.COM INC	—	FY2022	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	—	FY2018	—	No
UNITED PARCEL SERVICE INC	Amazon.com, Inc.	other	SEC segment disclosure: UNITED PARCEL SERVICE INC → AMAZON.COM INC	—	FY2020	—	No
UNITED PARCEL SERVICE INC	Amazon.com, Inc.	other	SEC segment disclosure: UNITED PARCEL SERVICE INC → AMAZON.COM INC	—	FY2024	—	No
UNITED PARCEL SERVICE INC	Amazon.com, Inc.	other	SEC segment disclosure: UNITED PARCEL SERVICE INC → AMAZON.COM INC	—	FY2023	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	—	FY2023	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	—	FY2011	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	—	FY2024	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	—	FY2014	—	No
Intel	Dell Technologies	gpu_accelerator	SEC >10% customer disclosure	—	FY2025	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	—	FY2017	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	—	FY2012	—	No
Intel	Lenovo Group	gpu_accelerator	SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD	—	FY2021	—	No
Intel	Lenovo Group	gpu_accelerator	SEC >10% customer disclosure	—	FY2019	—	No
Intel	Lenovo Group	gpu_accelerator	SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD	—	FY2020	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	—	FY2010	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	—	FY2013	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	—	FY2014	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	—	FY2016	—	No
UNITED PARCEL SERVICE INC	Amazon.com, Inc.	other	SEC segment disclosure: UNITED PARCEL SERVICE INC → AMAZON.COM INC	—	FY2019	—	No
Intel	Lenovo Group	gpu_accelerator	SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD	—	FY2018	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	—	FY2015	—	No
Intel	Lenovo Group	gpu_accelerator	SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD	—	FY2017	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	—	FY2011	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	—	FY2019	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	—	FY2013	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	—	FY2021	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	—	FY2018	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	—	FY2020	—	No
Intel	Lenovo Group	gpu_accelerator	SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD	—	FY2022	—	No
Broadcom Inc.	WT Microelectronics	networking	SEC segment disclosure: BROADCOM INC → WT MICROELECTRONICS CO LTD	—	FY2023	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	—	FY2008	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	—	FY2012	—	No
Intel	Lenovo Group	gpu_accelerator	SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD	—	FY2024	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	—	FY2010	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	—	FY2009	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	—	FY2005	—	No
Intel	Lenovo Group	gpu_accelerator	SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD	—	FY2015	—	No
Broadcom Inc.	Apple	networking	SEC segment disclosure: BROADCOM INC → APPLE INC	—	FY2023	—	No
TD SYNNEX Corp	Apple	other	SEC segment disclosure: TD SYNNEX CORP → APPLE INC	—	FY2024	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	—	FY2022	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	—	FY2017	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	—	FY2007	—	No
TD SYNNEX Corp	Apple	other	SEC segment disclosure: TD SYNNEX CORPORATION → APPLE INC	—	FY2022	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	—	FY2008	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	—	FY2006	—	No
Intel	Lenovo Group	gpu_accelerator	SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD	—	FY2014	—	No
Broadcom Inc.	Apple	networking	SEC segment disclosure: BROADCOM INC → APPLE INC	—	FY2022	—	No
Broadcom Inc.	WT Microelectronics	networking	SEC segment disclosure: BROADCOM INC → WT MICROELECTRONICS CO LTD	—	FY2022	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	—	FY2007	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	—	FY2004	—	No
Jabil	Apple	other	SEC segment disclosure: JABIL INC → APPLE INC	—	FY2021	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	—	FY2024	—	No
Jabil	Apple	other	SEC segment disclosure: JABIL INC → APPLE INC	—	FY2022	—	No
Intel	Lenovo Group	gpu_accelerator	SEC >10% customer disclosure	—	FY2025	—	No
Intel	HP Inc	gpu_accelerator	SEC >10% customer disclosure	—	FY2025	—	No
TD SYNNEX Corp	Apple	other	SEC segment disclosure: TD SYNNEX CORPORATION → APPLE INC	—	FY2023	—	No
Intel	Lenovo Group	gpu_accelerator	SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD	—	FY2013	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	—	FY2005	—	No
Jabil	Apple	other	SEC segment disclosure: JABIL INC → APPLE INC	—	FY2018	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	—	FY2009	—	No
Intel	Lenovo Group	gpu_accelerator	SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD	—	FY2023	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	—	FY2016	—	No
Jabil	Apple	other	SEC segment disclosure: JABIL INC → APPLE INC	—	FY2023	—	No
Intel	Lenovo Group	gpu_accelerator	SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD	—	FY2012	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	—	FY2003	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	—	FY2006	—	No
Jabil	Apple	other	SEC segment disclosure: JABIL INC → APPLE INC	—	FY2019	—	No
Broadcom Inc.	Apple	networking	SEC segment disclosure: BROADCOM INC → APPLE INC	—	FY2021	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	—	FY2004	—	No
Jabil	Apple	other	SEC segment disclosure: JABIL INC → APPLE INC	—	FY2020	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	—	FY2023	—	No
Micron	HP Inc	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC	—	FY2006	—	No
Broadcom Inc.	Apple	networking	SEC segment disclosure: BROADCOM INC → APPLE INC	—	FY2018	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC >10% customer disclosure	—	FY2022	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	—	FY2022	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC >10% customer disclosure	—	FY2023	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	—	FY2023	—	No
Broadcom Inc.	WT Microelectronics	networking	SEC segment disclosure: BROADCOM INC → WT MICROELECTRONICS CO LTD	—	FY2021	—	No
Microsoft Corporation	Dell Technologies	software_ip	SEC segment disclosure: MICROSOFT CORP → DELL TECHNOLOGIES INC	—	FY2006	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD	—	FY2021	—	No
Jabil	Apple	other	SEC segment disclosure: JABIL INC → APPLE INC	—	FY2017	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	—	FY2003	—	No
Broadcom Inc.	Apple	networking	SEC segment disclosure: BROADCOM INC → APPLE INC	—	FY2019	—	No
Jabil	Apple	other	SEC segment disclosure: JABIL INC → APPLE INC	—	FY2016	—	No
Intel	COMPAQ COMPUTER CORP	gpu_accelerator	SEC segment disclosure: INTEL CORP → COMPAQ COMPUTER CORP	—	FY2000	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	—	FY2000	—	No
Jabil	Apple	other	SEC segment disclosure: JABIL INC → APPLE INC	—	FY2015	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	—	FY2002	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	—	FY2002	—	No
Microsoft Corporation	Dell Technologies	software_ip	SEC segment disclosure: MICROSOFT CORP → DELL TECHNOLOGIES INC	—	FY2005	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC >10% customer disclosure	—	FY2023	—	No
Broadcom Inc.	WT Microelectronics	networking	SEC segment disclosure: BROADCOM INC → WT MICROELECTRONICS CO LTD	—	FY2019	—	No
Intel	COMPAQ COMPUTER CORP	gpu_accelerator	SEC segment disclosure: INTEL CORP → COMPAQ COMPUTER CORP	—	FY1999	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	—	FY1999	—	No
Micron	Kingston Technology Company, Inc.	memory	SEC >10% customer disclosure	—	FY2022	—	No
Microsoft Corporation	Dell Technologies	software_ip	SEC segment disclosure: MICROSOFT CORP → DELL TECHNOLOGIES INC	—	FY2004	—	No
Jabil	Amazon.com, Inc.	other	SEC segment disclosure: JABIL INC → AMAZON.COM INC	—	FY2022	—	No
Micron	WPG Holding	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → WPG HOLDINGS	—	FY2021	—	No
Broadcom Inc.	Apple	networking	SEC segment disclosure: BROADCOM INC → APPLE INC	—	FY2020	—	No
Jabil	Apple	other	SEC segment disclosure: JABIL INC → APPLE INC	—	FY2013	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC >10% customer disclosure	—	FY2021	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	—	FY2021	—	No
Micron	WPG Holding	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → WPG HOLDINGS	—	FY2022	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD	—	FY2017	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD	—	FY2024	—	No
Skyworks Solutions	Apple	other	SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC	—	FY2022	—	No
Jabil	Apple	other	SEC segment disclosure: JABIL INC → APPLE INC	—	FY2024	—	No
Skyworks Solutions	Apple	other	SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC	—	FY2023	—	No
Broadcom Inc.	WT Microelectronics	networking	SEC segment disclosure: BROADCOM INC → WT MICROELECTRONICS CO LTD	—	FY2020	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC >10% customer disclosure	—	FY2020	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD	—	FY2020	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	—	FY2020	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD	—	FY2022	—	No
Skyworks Solutions	Apple	other	SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC	—	FY2021	—	No
Intel	COMPAQ COMPUTER CORP	gpu_accelerator	SEC segment disclosure: INTEL CORP → COMPAQ COMPUTER CORP	—	FY1997	—	No
Jabil	Amazon.com, Inc.	other	SEC segment disclosure: JABIL INC → AMAZON.COM INC	—	FY2020	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC >10% customer disclosure	—	FY2024	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	—	FY2024	—	No
Skyworks Solutions	Apple	other	SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC	—	FY2024	—	No
Jabil	Apple	other	SEC segment disclosure: JABIL INC → APPLE INC	—	FY2014	—	No
Micron	Huawei Technologies	memory	SEC >10% customer disclosure	—	FY2019	—	No
NXP Semiconductors NV	Avnet	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC	—	FY2023	—	No
NXP Semiconductors NV	Avnet	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC	—	FY2024	—	No
Skyworks Solutions	Apple	other	SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC	—	FY2025	—	No
STMicroelectronics	Apple	other	SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC	—	FY2022	—	No
NXP Semiconductors NV	Avnet	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC	—	FY2022	—	No
STMicroelectronics	Apple	other	SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC	—	FY2021	—	No
Applied Materials	Intel	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP	—	FY2022	—	No
Micron	Kingston Technology Company, Inc.	memory	SEC >10% customer disclosure	—	FY2019	—	No
STMicroelectronics	Apple	other	SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC	—	FY2020	—	No
Micron	Kingston Technology Company, Inc.	memory	SEC >10% customer disclosure	—	FY2020	—	No
Arista Networks	Microsoft Corporation	networking	SEC >10% customer disclosure	—	FY2025	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD	—	FY2018	—	No
Jabil	Apple	other	SEC segment disclosure: JABIL INC → APPLE INC	—	FY2012	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	—	FY2017	—	No
Jabil	Cisco	other	SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC	—	FY2011	—	No
STMicroelectronics	Apple	other	SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC	—	FY2023	—	No
NOV INC	Samsung Heavy Industries Co., Ltd.	other	SEC segment disclosure: NOV INC → SAMSUNG HEAVY INDUSTRIES CO	—	FY2010	—	No
NOV INC	Samsung Heavy Industries Co., Ltd.	other	SEC segment disclosure: NOV INC → SAMSUNG HEAVY INDUSTRIES CO	—	FY2013	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC >10% customer disclosure	—	FY2019	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	—	FY2019	—	No
Jabil	Cisco	other	SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC	—	FY2008	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	—	FY2013	—	No
Jabil	Cisco	other	SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC	—	FY2010	—	No
NOV INC	Samsung Heavy Industries Co., Ltd.	other	SEC segment disclosure: NOV INC → SAMSUNG HEAVY INDUSTRIES CO	—	FY2012	—	No
NXP Semiconductors NV	Avnet	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC	—	FY2021	—	No
Marvell Technology	Wintech Digital Systems Technology Corp	networking	SEC >10% customer disclosure	—	FY2025	—	No
Amkor	Apple	other	SEC segment disclosure: AMKOR TECHNOLOGY INC → APPLE INC	—	FY2024	—	No
STMicroelectronics	Apple	other	SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC	—	FY2024	—	No
Qualcomm Inc	Samsung	gpu_accelerator	SEC segment disclosure: QUALCOMM INC → SAMSUNG ELECTRONICS CO LTD	—	FY2012	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	—	FY2014	—	No
Applied Materials	Intel	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP	—	FY2018	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	—	FY2018	—	No
Qualcomm Inc	Samsung	gpu_accelerator	SEC segment disclosure: QUALCOMM INC → SAMSUNG ELECTRONICS CO LTD	—	FY2011	—	No
Qualcomm Inc	HTC	gpu_accelerator	SEC segment disclosure: QUALCOMM INC → HTC CORPORATION	—	FY2011	—	No
Skyworks Solutions	Apple	other	SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC	—	FY2020	—	No
Broadcom Inc.	Foxconn	networking	SEC segment disclosure: BROADCOM INC → FOXCONN TECHNOLOGY CO LTD	—	FY2018	—	No
Qualcomm Inc	LG Electronics	gpu_accelerator	SEC segment disclosure: QUALCOMM INC → LG ELECTRONICS INC	—	FY2009	—	No
Jabil	Cisco	other	SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC	—	FY2007	—	No
Micron	Intel	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP	—	FY2017	—	No
Skyworks Solutions	Apple	other	SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC	—	FY2018	—	No
Amkor	Apple	other	SEC segment disclosure: AMKOR TECHNOLOGY INC → APPLE INC	—	FY2023	—	No
Qualcomm Inc	LG Electronics	gpu_accelerator	SEC segment disclosure: QUALCOMM INC → LG ELECTRONICS INC	—	FY2008	—	No
Applied Materials	Intel	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP	—	FY2019	—	No
Qorvo	Apple	other	SEC segment disclosure: QORVO INC → APPLE INC	—	FY2025	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD	—	FY2012	—	No
Micron	Intel	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP	—	FY2016	—	No
Qorvo	Apple	other	SEC segment disclosure: QORVO INC → APPLE INC	—	FY2024	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	—	FY2016	—	No
Skyworks Solutions	Apple	other	SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC	—	FY2019	—	No
Jabil	Cisco	other	SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC	—	FY2012	—	No
Cirrus Logic	Apple	other	SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC	—	FY2025	—	No
STMicroelectronics	Apple	other	SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC	—	FY2019	—	No
Qualcomm Inc	LG Electronics	gpu_accelerator	SEC segment disclosure: QUALCOMM INC → LG ELECTRONICS INC	—	FY2010	—	No
Cirrus Logic	Apple	other	SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC	—	FY2023	—	No
Qualcomm Inc	Samsung	gpu_accelerator	SEC segment disclosure: QUALCOMM INC → SAMSUNG ELECTRONICS CO LTD	—	FY2008	—	No
Cirrus Logic	Apple	other	SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC	—	FY2024	—	No
Qorvo	Apple	other	SEC segment disclosure: QORVO INC → APPLE INC	—	FY2022	—	No
Jabil	Cisco	other	SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC	—	FY2009	—	No
NOV INC	Samsung Heavy Industries Co., Ltd.	other	SEC segment disclosure: NOV INC → SAMSUNG HEAVY INDUSTRIES CO	—	FY2014	—	No
Match Group	Alphabet	other	SEC segment disclosure: MATCH GROUP INC → ALPHABET INC	—	FY2013	—	No
Micron	HP Inc	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC	—	FY2014	—	No
NXP Semiconductors NV	Avnet	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC	—	FY2020	—	No
Amkor	Apple	other	SEC segment disclosure: AMKOR TECHNOLOGY INC → APPLE INC	—	FY2022	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	—	FY2015	—	No
AMD	HP Inc	gpu_accelerator	SEC segment disclosure: ADVANCED MICRO DEVICES → HP INC	—	FY2011	—	No
Arista Networks	Meta Platforms, Inc.	networking	SEC >10% customer disclosure	—	FY2025	—	No
Texas Instruments	Apple	other	SEC segment disclosure: TEXAS INSTRUMENTS INC → APPLE INC	—	FY2015	—	No
Cirrus Logic	Apple	other	SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC	—	FY2022	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD	—	FY2016	—	No
Arista Networks	Microsoft Corporation	networking	SEC segment disclosure: ARISTA NETWORKS INC → MICROSOFT CORP	—	FY2024	—	No
AMD	HP Inc	gpu_accelerator	SEC segment disclosure: ADVANCED MICRO DEVICES → HP INC	—	FY2010	—	No
Match Group	Alphabet	other	SEC segment disclosure: MATCH GROUP INC → ALPHABET INC	—	FY2012	—	No
Match Group	Alphabet	other	SEC segment disclosure: MATCH GROUP INC → ALPHABET INC	—	FY2014	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	—	FY2012	—	No
NXP Semiconductors NV	Avnet	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC	—	FY2017	—	No
Qualcomm Inc	Samsung	gpu_accelerator	SEC segment disclosure: QUALCOMM INC → SAMSUNG ELECTRONICS CO LTD	—	FY2009	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD	—	FY2010	—	No
GlobalFoundries	Qualcomm Inc	foundry_services	SEC segment disclosure: GLOBALFOUNDRIES INC → QUALCOMM INC	—	FY2022	—	No
Marvell Technology	Wintech Digital Systems Technology Corp	networking	SEC >10% customer disclosure	—	FY2024	—	No
Qorvo	Apple	other	SEC segment disclosure: QORVO INC → APPLE INC	—	FY2023	—	No
NXP Semiconductors NV	Avnet	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC	—	FY2018	—	No
Micron	Intel	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP	—	FY2014	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD	—	FY2008	—	No
Micron	Intel	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP	—	FY2015	—	No
GlobalFoundries	Qualcomm Inc	foundry_services	SEC segment disclosure: GLOBALFOUNDRIES INC → QUALCOMM INC	—	FY2023	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	—	FY2017	—	No
NEWELL BRANDS INC	Amazon.com, Inc.	other	SEC segment disclosure: NEWELL BRANDS INC → AMAZON.COM INC	—	FY2021	—	No
ELECTRONIC ARTS INC	Microsoft Corporation	other	SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP	—	FY2025	—	No
STMicroelectronics	Apple	other	SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC	—	FY2018	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD	—	FY2011	—	No
NXP Semiconductors NV	Avnet	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC	—	FY2019	—	No
Cirrus Logic	Apple	other	SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC	—	FY2018	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	—	FY2015	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	—	FY2022	—	No
NXP Semiconductors NV	Avnet	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC	—	FY2016	—	No
Arista Networks	Meta Platforms, Inc.	networking	SEC segment disclosure: ARISTA NETWORKS INC → META PLATFORMS INC	—	FY2023	—	No
NEWELL BRANDS INC	Amazon.com, Inc.	other	SEC segment disclosure: NEWELL BRANDS INC → AMAZON.COM INC	—	FY2022	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	—	FY2016	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	—	FY2024	—	No
Cirrus Logic	Apple	other	SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC	—	FY2017	—	No
ELECTRONIC ARTS INC	Microsoft Corporation	other	SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP	—	FY2024	—	No
Qorvo	Apple	other	SEC segment disclosure: QORVO INC → APPLE INC	—	FY2021	—	No
NVIDIA	Dell Technologies	gpu_accelerator	SEC segment disclosure: NVIDIA CORP → DELL TECHNOLOGIES INC	—	FY2020	—	No
AMD	HP Inc	gpu_accelerator	SEC segment disclosure: ADVANCED MICRO DEVICES → HP INC	—	FY2012	—	No
Applied Materials	Intel	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP	—	FY2016	—	No
Applied Materials	Micron	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → MICRON TECHNOLOGY INC	—	FY2016	—	No
ELECTRONIC ARTS INC	Microsoft Corporation	other	SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP	—	FY2023	—	No
Marvell Technology	Wintech Digital Systems Technology Corp	networking	SEC >10% customer disclosure	—	FY2023	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	—	FY2014	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD	—	FY2007	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	—	FY2023	—	No
Celestica	Cisco	other	SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC	—	FY2016	—	No
Arista Networks	Meta Platforms, Inc.	networking	SEC >10% customer disclosure	—	FY2022	—	No
NEWELL BRANDS INC	Amazon.com, Inc.	other	SEC segment disclosure: NEWELL BRANDS INC → AMAZON.COM INC	—	FY2024	—	No
Cirrus Logic	Apple	other	SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC	—	FY2021	—	No
Micron	HP Inc	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC	—	FY2015	—	No
Amdocs Ltd.	T-MOBILE US INC	other	SEC segment disclosure: AMDOCS → T-MOBILE US INC	—	FY2024	—	No
Amdocs Ltd.	T-MOBILE US INC	other	SEC segment disclosure: AMDOCS → T-MOBILE US INC	—	FY2023	—	No
NEWELL BRANDS INC	Amazon.com, Inc.	other	SEC segment disclosure: NEWELL BRANDS INC → AMAZON.COM INC	—	FY2020	—	No
Jabil	Cisco	other	SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC	—	FY2004	—	No
ELECTRONIC ARTS INC	Microsoft Corporation	other	SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP	—	FY2022	—	No
Micron	Intel	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP	—	FY2008	—	No
Micron	HP Inc	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC	—	FY2010	—	No
Celestica	Cisco	other	SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC	—	FY2017	—	No
Qualcomm Inc	Samsung	gpu_accelerator	SEC segment disclosure: QUALCOMM INC → SAMSUNG ELECTRONICS CO LTD	—	FY2010	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	—	FY2020	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	—	FY2018	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	—	FY2021	—	No
Qorvo	Apple	other	SEC segment disclosure: QORVO INC → APPLE INC	—	FY2018	—	No
Qorvo	Apple	other	SEC segment disclosure: QORVO INC → APPLE INC	—	FY2020	—	No
GlobalFoundries	Qualcomm Inc	foundry_services	SEC segment disclosure: GLOBALFOUNDRIES INC → QUALCOMM INC	—	FY2024	—	No
NEWELL BRANDS INC	Amazon.com, Inc.	other	SEC segment disclosure: NEWELL BRANDS INC → AMAZON.COM INC	—	FY2023	—	No
Arista Networks	Microsoft Corporation	networking	SEC segment disclosure: ARISTA NETWORKS INC → MICROSOFT CORP	—	FY2023	—	No
Applied Materials	Intel	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP	—	FY2011	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	—	FY2011	—	No
Arista Networks	Meta Platforms, Inc.	networking	SEC segment disclosure: ARISTA NETWORKS INC → META PLATFORMS INC	—	FY2024	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	—	FY2010	—	No
NXP Semiconductors NV	Continental	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → CONTINENTAL AG	—	FY2018	—	No
Qorvo	Apple	other	SEC segment disclosure: QORVO INC → APPLE INC	—	FY2017	—	No
NXP Semiconductors NV	Continental	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → CONTINENTAL AG	—	FY2017	—	No
ELECTRONIC ARTS INC	Microsoft Corporation	other	SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP	—	FY2021	—	No
Cirrus Logic	Apple	other	SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC	—	FY2020	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD	—	FY2006	—	No
Jabil	Cisco	other	SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC	—	FY2001	—	No
GlobalFoundries	Qualcomm Inc	foundry_services	SEC segment disclosure: GLOBALFOUNDRIES INC → QUALCOMM INC	—	FY2021	—	No
Micron	Intel	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP	—	FY2012	—	No
Qorvo	Apple	other	SEC segment disclosure: QORVO INC → APPLE INC	—	FY2019	—	No
NXP Semiconductors NV	Continental	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → CONTINENTAL AG	—	FY2019	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD	—	FY2013	—	No
Match Group	Alphabet	other	SEC segment disclosure: MATCH GROUP INC → ALPHABET INC	—	FY2011	—	No
Micron	Intel	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP	—	FY2009	—	No
EPLUS INC	Cisco	other	SEC segment disclosure: EPLUS INC → CISCO SYSTEMS INC	—	FY2024	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	—	FY2009	—	No
ELECTRONIC ARTS INC	Microsoft Corporation	other	SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP	—	FY2020	—	No
NXP Semiconductors NV	ARROW ELECTRONICS, INC.	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → ARROW ELECTRONICS INC	—	FY2018	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	—	FY2019	—	No
Ultra Clean	Lam Research	other	SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → LAM RESEARCH CORP	—	FY2022	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	—	FY2013	—	No
TSMC	NVIDIA	foundry_services	SEC segment disclosure: TAIWAN SEMICONDUCTOR MFG CO → NVIDIA CORP	—	FY2002	—	No
Logitech International	Amazon.com, Inc.	other	SEC segment disclosure: LOGITECH INTERNATIONAL SA → AMAZON.COM INC	—	FY2022	—	No
Celestica	Cisco	other	SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC	—	FY2018	—	No
Cirrus Logic	Apple	other	SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC	—	FY2019	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	—	FY2011	—	No
Amdocs Ltd.	T-MOBILE US INC	other	SEC segment disclosure: AMDOCS → T-MOBILE US INC	—	FY2022	—	No
Micron	HP Inc	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC	—	FY2013	—	No
Micron	Intel	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP	—	FY2013	—	No
TSMC	NVIDIA	foundry_services	SEC segment disclosure: TAIWAN SEMICONDUCTOR MFG CO → NVIDIA CORP	—	FY2003	—	No
Celestica	Cisco	other	SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC	—	FY2007	—	No
NXP Semiconductors NV	ARROW ELECTRONICS, INC.	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → ARROW ELECTRONICS INC	—	FY2019	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	—	FY2008	—	No
Celestica	Cisco	other	SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC	—	FY2006	—	No
Micron	Intel	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP	—	FY2011	—	No
Micron	Dell Technologies	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → DELL TECHNOLOGIES INC	—	FY2000	—	No
STMicroelectronics	Apple	other	SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC	—	FY2017	—	No
AMD	Fujitsu	gpu_accelerator	SEC segment disclosure: ADVANCED MICRO DEVICES → FUJITSU LTD	—	FY2005	—	No
Logitech International	Amazon.com, Inc.	other	SEC segment disclosure: LOGITECH INTERNATIONAL SA → AMAZON.COM INC	—	FY2025	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	—	FY2010	—	No
Logitech International	Amazon.com, Inc.	other	SEC segment disclosure: LOGITECH INTERNATIONAL SA → AMAZON.COM INC	—	FY2023	—	No
NXP Semiconductors NV	Avnet	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC	—	FY2015	—	No
Qualcomm Inc	LG Electronics	gpu_accelerator	SEC segment disclosure: QUALCOMM INC → LG ELECTRONICS INC	—	FY2005	—	No
Jabil	Cisco	other	SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC	—	FY2002	—	No
KLA	Samsung	semiconductor_equipment	SEC segment disclosure: KLA CORP → SAMSUNG ELECTRONICS CO LTD	—	FY2018	—	No
Ultra Clean	Lam Research	other	SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → LAM RESEARCH CORP	—	FY2021	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	—	FY2012	—	No
Micron	COMPAQ COMPUTER CORP	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → COMPAQ COMPUTER CORP	—	FY2000	—	No
Amkor	Apple	other	SEC segment disclosure: AMKOR TECHNOLOGY INC → APPLE INC	—	FY2021	—	No
NVIDIA	ASUSTek Computer	gpu_accelerator	SEC segment disclosure: NVIDIA CORP → ASUSTEK COMPUTER INC	—	FY2017	—	No
Match Group	Alphabet	other	SEC segment disclosure: MATCH GROUP INC → ALPHABET INC	—	FY2018	—	No
ELECTRONIC ARTS INC	Microsoft Corporation	other	SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP	—	FY2018	—	No
ELECTRONIC ARTS INC	Microsoft Corporation	other	SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP	—	FY2017	—	No
Amdocs Ltd.	T-MOBILE US INC	other	SEC segment disclosure: AMDOCS → T-MOBILE US INC	—	FY2021	—	No
GlobalFoundries	AMD	foundry_services	SEC segment disclosure: GLOBALFOUNDRIES INC → ADVANCED MICRO DEVICES	—	FY2021	—	No
EPLUS INC	Cisco	other	SEC segment disclosure: EPLUS INC → CISCO SYSTEMS INC	—	FY2023	—	No
Celestica	Juniper Networks, Inc.	other	SEC segment disclosure: CELESTICA INC → JUNIPER NETWORKS INC	—	FY2017	—	No
Celestica	Cisco	other	SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC	—	FY2011	—	No
ELECTRONIC ARTS INC	Microsoft Corporation	other	SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP	—	FY2019	—	No
Qualcomm Inc	GLOBALSTAR TELECOMM LTD	gpu_accelerator	SEC segment disclosure: QUALCOMM INC → GLOBALSTAR TELECOMM LTD	—	FY1998	—	No
Micron	HP Inc	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC	—	FY2011	—	No
Lam Research	Samsung	semiconductor_equipment	SEC segment disclosure: LAM RESEARCH CORP → SAMSUNG ELECTRONICS CO LTD	—	FY2011	—	No
Logitech International	Amazon.com, Inc.	other	SEC segment disclosure: LOGITECH INTERNATIONAL SA → AMAZON.COM INC	—	FY2024	—	No
Cirrus Logic	Apple	other	SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC	—	FY2016	—	No
Micron	Intel	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP	—	FY2010	—	No
Jabil	Cisco	other	SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC	—	FY2003	—	No
IAC INC	Alphabet	other	SEC segment disclosure: IAC INC → ALPHABET INC	—	FY2021	—	No
GlobalFoundries	AMD	foundry_services	SEC segment disclosure: GLOBALFOUNDRIES INC → ADVANCED MICRO DEVICES	—	FY2022	—	No
Applied Materials	Intel	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP	—	FY2001	—	No
NXP Semiconductors NV	Avnet	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC	—	FY2014	—	No
Amkor	Apple	other	SEC segment disclosure: AMKOR TECHNOLOGY INC → APPLE INC	—	FY2020	—	No
Qualcomm Inc	LG Electronics	gpu_accelerator	SEC segment disclosure: QUALCOMM INC → LG ELECTRONICS INC	—	FY2004	—	No
Match Group	Alphabet	other	SEC segment disclosure: MATCH GROUP INC → ALPHABET INC	—	FY2010	—	No
Synopsys	Intel	other	SEC segment disclosure: SYNOPSYS INC → INTEL CORP	—	FY2023	—	No
GlobalFoundries	AMD	foundry_services	SEC segment disclosure: GLOBALFOUNDRIES INC → ADVANCED MICRO DEVICES	—	FY2024	—	No
Amkor	Qualcomm Inc	other	SEC segment disclosure: AMKOR TECHNOLOGY INC → QUALCOMM INC	—	FY2022	—	No
Celestica	Cisco	other	SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC	—	FY2012	—	No
Analog Devices	Apple	other	SEC segment disclosure: ANALOG DEVICES INC → APPLE INC	—	FY2017	—	No
IAC INC	Alphabet	other	SEC segment disclosure: IAC INC → ALPHABET INC	—	FY2023	—	No
Jabil	Cisco	other	SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC	—	FY2000	—	No
WARNER MUSIC GROUP CORP	Apple	other	SEC segment disclosure: WARNER MUSIC GROUP CORP → APPLE INC	—	FY2024	—	No
Celestica	Cisco	other	SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC	—	FY2019	—	No
HASBRO INC	Amazon.com, Inc.	other	SEC segment disclosure: HASBRO INC → AMAZON.COM INC	—	FY2021	—	No
IAC INC	Alphabet	other	SEC segment disclosure: IAC INC → ALPHABET INC	—	FY2022	—	No
Arista Networks	Microsoft Corporation	networking	SEC segment disclosure: ARISTA NETWORKS INC → MICROSOFT CORP	—	FY2022	—	No
WARNER MUSIC GROUP CORP	Apple	other	SEC segment disclosure: WARNER MUSIC GROUP CORP → APPLE INC	—	FY2021	—	No
KLA	TSMC	semiconductor_equipment	SEC >10% customer disclosure	—	FY2019	—	No
KLA	TSMC	semiconductor_equipment	SEC segment disclosure: KLA CORP → TAIWAN SEMICONDUCTOR MFG CO	—	FY2019	—	No
Logitech International	Amazon.com, Inc.	other	SEC segment disclosure: LOGITECH INTERNATIONAL SA → AMAZON.COM INC	—	FY2021	—	No
EPLUS INC	Cisco	other	SEC segment disclosure: EPLUS INC → CISCO SYSTEMS INC	—	FY2022	—	No
ARM	Arm Technology (China) Co. Limited	software_ip	SEC >10% customer disclosure	—	FY2024	—	No
ARM	Arm Technology (China) Co. Limited	software_ip	SEC >10% customer disclosure	—	FY2025	—	No
Marvell Technology	Wintech Digital Systems Technology Corp	networking	SEC >10% customer disclosure	—	FY2022	—	No
Ultra Clean	Lam Research	other	SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → LAM RESEARCH CORP	—	FY2024	—	No
WARNER MUSIC GROUP CORP	Apple	other	SEC segment disclosure: WARNER MUSIC GROUP CORP → APPLE INC	—	FY2023	—	No
Cirrus Logic	Apple	other	SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC	—	FY2013	—	No
Micron	HP Inc	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC	—	FY2012	—	No
Celestica	Juniper Networks, Inc.	other	SEC segment disclosure: CELESTICA INC → JUNIPER NETWORKS INC	—	FY2016	—	No
Cirrus Logic	Apple	other	SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC	—	FY2015	—	No
WARNER MUSIC GROUP CORP	Apple	other	SEC segment disclosure: WARNER MUSIC GROUP CORP → APPLE INC	—	FY2022	—	No
Amkor	Qualcomm Inc	other	SEC segment disclosure: AMKOR TECHNOLOGY INC → QUALCOMM INC	—	FY2024	—	No
EPLUS INC	Cisco	other	SEC segment disclosure: EPLUS INC → CISCO SYSTEMS INC	—	FY2025	—	No
WARNER MUSIC GROUP CORP	Apple	other	SEC segment disclosure: WARNER MUSIC GROUP CORP → APPLE INC	—	FY2020	—	No
Qualcomm Inc	Motorola Solutions	gpu_accelerator	SEC segment disclosure: QUALCOMM INC → MOTOROLA SOLUTIONS INC	—	FY2005	—	No
Fabrinet	Cisco	other	SEC segment disclosure: FABRINET → CISCO SYSTEMS INC	—	FY2025	—	No
GlobalFoundries	AMD	foundry_services	SEC segment disclosure: GLOBALFOUNDRIES INC → ADVANCED MICRO DEVICES	—	FY2023	—	No
Ichor Holdings	Lam Research	other	SEC segment disclosure: ICHOR HOLDINGS LTD → LAM RESEARCH CORP	—	FY2022	—	No
ELECTRONIC ARTS INC	Microsoft Corporation	other	SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP	—	FY2016	—	No
EPLUS INC	Cisco	other	SEC segment disclosure: EPLUS INC → CISCO SYSTEMS INC	—	FY2020	—	No
Match Group	Alphabet	other	SEC segment disclosure: MATCH GROUP INC → ALPHABET INC	—	FY2008	—	No
Ultra Clean	Lam Research	other	SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → LAM RESEARCH CORP	—	FY2018	—	No
Applied Materials	Intel	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP	—	FY2009	—	No
Ultra Clean	Lam Research	other	SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → LAM RESEARCH CORP	—	FY2020	—	No
Synopsys	Intel	other	SEC segment disclosure: SYNOPSYS INC → INTEL CORP	—	FY2022	—	No
Ultra Clean	Lam Research	other	SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → LAM RESEARCH CORP	—	FY2023	—	No
EPLUS INC	Cisco	other	SEC segment disclosure: EPLUS INC → CISCO SYSTEMS INC	—	FY2018	—	No
ENTRAVISION COMMUNICATIONS	Meta Platforms, Inc.	other	SEC segment disclosure: ENTRAVISION COMMUNICATIONS → META PLATFORMS INC	—	FY2023	—	No
HASBRO INC	Amazon.com, Inc.	other	SEC segment disclosure: HASBRO INC → AMAZON.COM INC	—	FY2022	—	No
Applied Materials	Intel	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP	—	FY2003	—	No
WARNER MUSIC GROUP CORP	Apple	other	SEC segment disclosure: WARNER MUSIC GROUP CORP → APPLE INC	—	FY2019	—	No
Arista Networks	Microsoft Corporation	networking	SEC segment disclosure: ARISTA NETWORKS INC → MICROSOFT CORP	—	FY2018	—	No
Ichor Holdings	Lam Research	other	SEC segment disclosure: ICHOR HOLDINGS LTD → LAM RESEARCH CORP	—	FY2021	—	No
Fabrinet	Cisco	other	SEC segment disclosure: FABRINET → CISCO SYSTEMS INC	—	FY2022	—	No
Micron	HP Inc	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC	—	FY2007	—	No
SYSTEM1 INC	Alphabet	other	SEC segment disclosure: SYSTEM1 INC → ALPHABET INC	—	FY2022	—	No
Cirrus Logic	Apple	other	SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC	—	FY2014	—	No
Match Group	Alphabet	other	SEC segment disclosure: MATCH GROUP INC → ALPHABET INC	—	FY2009	—	No
EPLUS INC	Cisco	other	SEC segment disclosure: EPLUS INC → CISCO SYSTEMS INC	—	FY2019	—	No
IAC INC	Alphabet	other	SEC segment disclosure: IAC INC → ALPHABET INC	—	FY2020	—	No
Arista Networks	Microsoft Corporation	networking	SEC segment disclosure: ARISTA NETWORKS INC → MICROSOFT CORP	—	FY2019	—	No
Ultra Clean	Lam Research	other	SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → LAM RESEARCH CORP	—	FY2017	—	No
NVIDIA	ASUSTek Computer	gpu_accelerator	SEC segment disclosure: NVIDIA CORP → ASUSTEK COMPUTER INC	—	FY2016	—	No
Ultra Clean	Applied Materials	other	SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → APPLIED MATERIALS INC	—	FY2022	—	No
HASBRO INC	Amazon.com, Inc.	other	SEC segment disclosure: HASBRO INC → AMAZON.COM INC	—	FY2023	—	No
HASBRO INC	Amazon.com, Inc.	other	SEC segment disclosure: HASBRO INC → AMAZON.COM INC	—	FY2020	—	No
EPLUS INC	Cisco	other	SEC segment disclosure: EPLUS INC → CISCO SYSTEMS INC	—	FY2021	—	No
TTM TECHNOLOGIES INC	Apple	other	SEC segment disclosure: TTM TECHNOLOGIES INC → APPLE INC	—	FY2017	—	No
Lumentum Holdings	Apple	other	SEC segment disclosure: LUMENTUM HOLDINGS INC → APPLE INC	—	FY2021	—	No
Intel	COMPAQ COMPUTER CORP	gpu_accelerator	SEC segment disclosure: INTEL CORP → COMPAQ COMPUTER CORP	—	FY1998	—	No
Celestica	Cisco	other	SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC	—	FY2020	—	No
Qualcomm Inc	Motorola Solutions	gpu_accelerator	SEC segment disclosure: QUALCOMM INC → MOTOROLA SOLUTIONS INC	—	FY2003	—	No
Qualcomm Inc	LG Electronics	gpu_accelerator	SEC segment disclosure: QUALCOMM INC → LG ELECTRONICS INC	—	FY2003	—	No
Lam Research	Samsung	semiconductor_equipment	SEC segment disclosure: LAM RESEARCH CORP → SAMSUNG ELECTRONICS CO LTD	—	FY2010	—	No
Applied Materials	Intel	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP	—	FY2002	—	No
Qorvo	Samsung	other	SEC segment disclosure: QORVO INC → SAMSUNG ELECTRONICS CO LTD	—	FY2022	—	No
Corsair Gaming	Amazon.com, Inc.	other	SEC segment disclosure: CORSAIR GAMING INC → AMAZON.COM INC	—	FY2021	—	No
Entegris	TSMC	other	SEC segment disclosure: ENTEGRIS INC → TAIWAN SEMICONDUCTOR MFG CO	—	FY2024	—	No
IAC INC	Alphabet	other	SEC segment disclosure: IAC INC → ALPHABET INC	—	FY2024	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD	—	FY2009	—	No
Ultra Clean	Applied Materials	other	SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → APPLIED MATERIALS INC	—	FY2021	—	No
Garmin	Amazon.com, Inc.	other	SEC segment disclosure: GARMIN LTD → AMAZON.COM INC	—	FY2021	—	No
Arista Networks	Microsoft Corporation	networking	SEC segment disclosure: ARISTA NETWORKS INC → MICROSOFT CORP	—	FY2020	—	No
Lumentum Holdings	Apple	other	SEC segment disclosure: LUMENTUM HOLDINGS INC → APPLE INC	—	FY2022	—	No
Qualcomm Inc	Motorola Solutions	gpu_accelerator	SEC segment disclosure: QUALCOMM INC → MOTOROLA SOLUTIONS INC	—	FY2004	—	No
Synopsys	Intel	other	SEC segment disclosure: SYNOPSYS INC → INTEL CORP	—	FY2017	—	No
ORGANON & CO	SAMSUNG BIOLOGICS Co., Ltd.	other	SEC segment disclosure: ORGANON & CO → SAMSUNG BIOLOGICS CO LTD	—	FY2022	—	No
Synopsys	Intel	other	SEC segment disclosure: SYNOPSYS INC → INTEL CORP	—	FY2018	—	No
Ichor Holdings	Lam Research	other	SEC segment disclosure: ICHOR HOLDINGS LTD → LAM RESEARCH CORP	—	FY2020	—	No
Ultra Clean	Applied Materials	other	SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → APPLIED MATERIALS INC	—	FY2024	—	No
Lam Research	Samsung	semiconductor_equipment	SEC segment disclosure: LAM RESEARCH CORP → SAMSUNG ELECTRONICS CO LTD	—	FY2008	—	No
ENTRAVISION COMMUNICATIONS	Meta Platforms, Inc.	other	SEC segment disclosure: ENTRAVISION COMMUNICATIONS → META PLATFORMS INC	—	FY2022	—	No
Teradyne	TSMC	semiconductor_equipment	SEC >10% customer disclosure	—	FY2020	—	No
Teradyne	TSMC	semiconductor_equipment	SEC segment disclosure: TERADYNE INC → TAIWAN SEMICONDUCTOR MFG CO	—	FY2020	—	No
Ichor Holdings	Lam Research	other	SEC segment disclosure: ICHOR HOLDINGS LTD → LAM RESEARCH CORP	—	FY2018	—	No
Meta Platforms, Inc.	ZYNGA INC	other	SEC segment disclosure: META PLATFORMS INC → ZYNGA INC	—	FY2012	—	No
Synopsys	Intel	other	SEC segment disclosure: SYNOPSYS INC → INTEL CORP	—	FY2020	—	No
HASBRO INC	Amazon.com, Inc.	other	SEC segment disclosure: HASBRO INC → AMAZON.COM INC	—	FY2024	—	No
DUOLINGO INC	Apple	other	SEC segment disclosure: DUOLINGO INC → APPLE INC	—	FY2024	—	No
AMD	HP Inc	gpu_accelerator	SEC segment disclosure: ADVANCED MICRO DEVICES → HP INC	—	FY2018	—	No
Qorvo	Samsung	other	SEC segment disclosure: QORVO INC → SAMSUNG ELECTRONICS CO LTD	—	FY2024	—	No
Micron	Dell Technologies	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → DELL TECHNOLOGIES INC	—	FY1998	—	No
ELECTRONIC ARTS INC	Microsoft Corporation	other	SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP	—	FY2015	—	No
Corsair Gaming	Amazon.com, Inc.	other	SEC segment disclosure: CORSAIR GAMING INC → AMAZON.COM INC	—	FY2023	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	—	FY1998	—	No
Ultra Clean	Lam Research	other	SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → LAM RESEARCH CORP	—	FY2019	—	No
Teradyne	TSMC	semiconductor_equipment	SEC >10% customer disclosure	—	FY2021	—	No
Teradyne	TSMC	semiconductor_equipment	SEC segment disclosure: TERADYNE INC → TAIWAN SEMICONDUCTOR MFG CO	—	FY2021	—	No
Arista Networks	Microsoft Corporation	networking	SEC segment disclosure: ARISTA NETWORKS INC → MICROSOFT CORP	—	FY2021	—	No
Synopsys	Intel	other	SEC segment disclosure: SYNOPSYS INC → INTEL CORP	—	FY2021	—	No
Lumentum Holdings	Apple	other	SEC segment disclosure: LUMENTUM HOLDINGS INC → APPLE INC	—	FY2020	—	No
Penguin Solutions	Samsung	other	SEC segment disclosure: PENGUIN SOLUTIONS INC → SAMSUNG ELECTRONICS CO LTD	—	FY2018	—	No
Flex	Cisco	other	SEC segment disclosure: FLEX LTD → CISCO SYSTEMS INC	—	FY2000	—	No
Synopsys	Intel	other	SEC segment disclosure: SYNOPSYS INC → INTEL CORP	—	FY2019	—	No
NVIDIA	Microsoft Corporation	gpu_accelerator	SEC segment disclosure: NVIDIA CORP → MICROSOFT CORP	—	FY2003	—	No
Qorvo	Samsung	other	SEC segment disclosure: QORVO INC → SAMSUNG ELECTRONICS CO LTD	—	FY2023	—	No
AMD	HP Inc	gpu_accelerator	SEC segment disclosure: ADVANCED MICRO DEVICES → HP INC	—	FY2016	—	No
TTM TECHNOLOGIES INC	Apple	other	SEC segment disclosure: TTM TECHNOLOGIES INC → APPLE INC	—	FY2018	—	No
Qualcomm Inc	Kyocera	gpu_accelerator	SEC segment disclosure: QUALCOMM INC → KYOCERA CORP	—	FY2002	—	No
Micron	Dell Technologies	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → DELL TECHNOLOGIES INC	—	FY2001	—	No
Benchmark Electronics	Applied Materials	other	SEC segment disclosure: BENCHMARK ELECTRONICS INC → APPLIED MATERIALS INC	—	FY2022	—	No
Digital Realty	Oracle Corporation	other	SEC >10% customer disclosure	—	FY2025	—	No
ORGANON & CO	SAMSUNG BIOLOGICS Co., Ltd.	other	SEC segment disclosure: ORGANON & CO → SAMSUNG BIOLOGICS CO LTD	—	FY2021	—	No
HELEN OF TROY LTD	Amazon.com, Inc.	other	SEC segment disclosure: HELEN OF TROY LTD → AMAZON.COM INC	—	FY2022	—	No
HELEN OF TROY LTD	Amazon.com, Inc.	other	SEC segment disclosure: HELEN OF TROY LTD → AMAZON.COM INC	—	FY2024	—	No
HELEN OF TROY LTD	Amazon.com, Inc.	other	SEC segment disclosure: HELEN OF TROY LTD → AMAZON.COM INC	—	FY2021	—	No
HELEN OF TROY LTD	Amazon.com, Inc.	other	SEC segment disclosure: HELEN OF TROY LTD → AMAZON.COM INC	—	FY2025	—	No
TTM TECHNOLOGIES INC	Apple	other	SEC segment disclosure: TTM TECHNOLOGIES INC → APPLE INC	—	FY2015	—	No
Corsair Gaming	Amazon.com, Inc.	other	SEC segment disclosure: CORSAIR GAMING INC → AMAZON.COM INC	—	FY2020	—	No
ENTRAVISION COMMUNICATIONS	Meta Platforms, Inc.	other	SEC segment disclosure: ENTRAVISION COMMUNICATIONS → META PLATFORMS INC	—	FY2021	—	No
Logitech International	Amazon.com, Inc.	other	SEC segment disclosure: LOGITECH INTERNATIONAL SA → AMAZON.COM INC	—	FY2020	—	No
Seagate Technology Holdings	Samsung	other	SEC segment disclosure: SEAGATE TECHNOLOGY HOLDINGS → SAMSUNG ELECTRONICS CO LTD	—	FY2013	—	No
Fabrinet	Cisco	other	SEC segment disclosure: FABRINET → CISCO SYSTEMS INC	—	FY2023	—	No
Arista Networks	Facebook	networking	SEC >10% customer disclosure	—	FY2019	—	No
Arista Networks	Meta Platforms, Inc.	networking	SEC segment disclosure: ARISTA NETWORKS INC → META PLATFORMS INC	—	FY2019	—	No
NVIDIA	ASUSTek Computer	gpu_accelerator	SEC segment disclosure: NVIDIA CORP → ASUSTEK COMPUTER INC	—	FY2008	—	No
Entegris	TSMC	other	SEC segment disclosure: ENTEGRIS INC → TAIWAN SEMICONDUCTOR MFG CO	—	FY2022	—	No
Corsair Gaming	Amazon.com, Inc.	other	SEC segment disclosure: CORSAIR GAMING INC → AMAZON.COM INC	—	FY2024	—	No
Ultra Clean	Applied Materials	other	SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → APPLIED MATERIALS INC	—	FY2023	—	No
TTM TECHNOLOGIES INC	Apple	other	SEC segment disclosure: TTM TECHNOLOGIES INC → APPLE INC	—	FY2019	—	No
ARM	Qualcomm Inc	software_ip	SEC segment disclosure: ARM HOLDINGS PLC → QUALCOMM INC	—	FY2025	—	No
Plug Power	Amazon.com, Inc.	other	SEC segment disclosure: PLUG POWER INC → AMAZON.COM INC	—	FY2020	—	No
Ichor Holdings	Applied Materials	other	SEC segment disclosure: ICHOR HOLDINGS LTD → APPLIED MATERIALS INC	—	FY2022	—	No
Match Group	Alphabet	other	SEC segment disclosure: MATCH GROUP INC → ALPHABET INC	—	FY2019	—	No
Logitech International	Amazon.com, Inc.	other	SEC segment disclosure: LOGITECH INTERNATIONAL SA → AMAZON.COM INC	—	FY2019	—	No
Fabrinet	Cisco	other	SEC segment disclosure: FABRINET → CISCO SYSTEMS INC	—	FY2024	—	No

6 companies recorded as sole suppliers

Taiwan 11

TSMC 11
Inspect 11 relationships
Alibaba 5nm foundry manufacturing for Yitian 710 server CPU (T-Head design) · criticality 10 of 10 · recorded date not stated Google Foundry manufacturing of TPU v4 silicon (process node unverified) · criticality 10 of 10 · recorded date not stated · estimated Google Foundry manufacturing of TPU v5e silicon (process node unverified) · criticality 10 of 10 · recorded date not stated · estimated Google Foundry manufacturing of TPU v5p silicon on TSMC N5 · criticality 10 of 10 · recorded date not stated · estimated Google Foundry manufacturing of TPU v6e (Trillium) on TSMC N5 · criticality 10 of 10 · recorded date not stated · estimated Apple Foundry manufacturing of Apple silicon (A-series, M-series processors) at N3/N4 process nodes · criticality 10 of 10 · recorded date not stated Biren Technology Foundry services — Biren BR100 at TSMC N7 (TERMINATED Oct 2023) · criticality 10 of 10 · recorded date not stated · relationship ended 2023-10-17 · estimated HiSilicon Foundry services — HiSilicon Kirin/Ascend 910 at TSMC N7/N5 (TERMINATED May 2020) · criticality 10 of 10 · recorded date not stated · relationship ended 2020-05-14 Moore Threads Foundry services — Moore Threads Chunxiao GPU (in MTT S80) at TSMC N7 (TERMINATED Oct 2023) · criticality 10 of 10 · recorded date not stated · relationship ended 2023-10-17 Google CoWoS advanced packaging for TPU v5p/v6e with HBM stacks · criticality 9 of 10 · recorded date not stated · estimated Iluvatar CoreX Foundry services — Iluvatar CoreX TianGai-100 7nm GPGPU (first domestic 7nm GPGPU, released Jan 2021; foundry unverified but TSMC inferred from process node) · criticality 9 of 10 · recorded date not stated · estimated

Japan 3

Ajinomoto Co., Inc. 3
Inspect 3 relationships
Ibiden Ajinomoto Build-up Film (ABF) substrate material for FC-BGA packages · criticality 10 of 10 · recorded date not stated · estimated Shinko Electric Ajinomoto Build-up Film (ABF) substrate material for FC-BGA packages · criticality 10 of 10 · recorded date not stated · estimated Unimicron Ajinomoto Build-up Film (ABF) substrate material for FC-BGA packages · criticality 10 of 10 · recorded date not stated · estimated

China 2

SMIC 2
Inspect 2 relationships
HiSilicon Foundry services — HiSilicon Ascend 910B at SMIC N+2 (~7nm DUV) · criticality 10 of 10 · recorded date not stated · estimated Huawei Technologies Foundry for Kirin/Ascend chips at N+2 (7nm-class DUV) · criticality 9 of 10 · recorded date not stated

United States 2

AMD 1
Inspect 1 relationship
Hygon Information Technology Co., Ltd. AMD Zen x86 architecture license via TISC JV (TERMINATED June 2019) · criticality 10 of 10 · recorded date not stated · relationship ended 2019-06-24
GlobalFoundries 1
Inspect 1 relationship
Enflame Technology (Suiyuan) Foundry services — Enflame CloudBlazer DTU at GlobalFoundries 12LP FinFET · criticality 9 of 10 · recorded date 2019-12-12

Netherlands 1

ASML 1
Inspect 1 relationship
SMIC DUV ArF immersion lithography (NXT:2000i). EUV blocked by Dutch export controls. · criticality 10 of 10 · recorded date not stated

19 single-source dependencies among all 14,795 relationships on file · one cell per relationship

criticality 10 · 15 criticality 9 · 4 criticality 8 · 0 recorded as ended · 4

relationships recorded as sole-source, involving 6 suppliers. Taiwan accounts for 11 relationships.

companies on the buying side, counted once each across the 19 single-source dependencies above.

4,950

companies across the relationship data, in 71 countries.

Single-source dependencies, one mark each. The recorded classification applies to the named customer and product in the selected record. A missing end date leaves current status unknown. Alternative suppliers may exist outside this corpus.

Columns group by the supplier’s recorded home jurisdiction and company, highest assessed criticality first. Mark form encodes that criticality on a 1–10 scale and the legend names each form with its count; a struck amber mark has a recorded end date.

The band at the foot draws the same 19 at one cell each among all 14,795 relationships on file, the solid block at its head being their share of the corpus.

The underlying corpus is drawn from licensed supply-chain pulls, SEC EDGAR and public-registry re-derivations, and CSET entity classification. The 19 relationships recorded as sole-source involve 6 suppliers in 5 jurisdictions, and 4 of them carry a recorded end date. How the graph is assembled

Eligible records and resolved relationships

18,874 source records are eligible for the supply graph; designation matches are excluded. 14,795 is the count of relationships: what remains after rows recording an unnamed counterparty are set aside and every surviving row is collapsed onto its canonical supplier, canonical customer, and product or service, so two sources reporting the same relationship count once.

How a relationship enters the corpus

1 · Provenance

Relationships arrive from four families: 13,490 rows from a licensed supply-chain database held under subscription and not redistributed; 3,170 re-sourced to primary SEC filings (10-K and 20-F segment and greater-than-ten-per-cent-customer disclosures); 2,128 independently re-derived from a public primary source, each with a verbatim quote; and 86 from CSET classification and Scrutica research enrichment.

These source counts describe eligible records before deduplication. Licensed-only relationships are withheld from display.

2 · Identity and collapse

Both sides of every row resolve through the canonical organization map, which merges the same real-world company across the different identifier schemes its sources use before anything is counted. Rows then collapse on the resolved pair plus the product or service, so a relationship two sources both report counts once. A citation attests the relationship; where the source carries nothing further, the criticality, value and sole-source fields stay unknown.

Single-source dependencies are the rows flagged sole-source, collapsed on that same resolved pair and product. All 19 come from public sources, and the single-source figure above names every one.