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Graph written 2026-10-05

Supply Chain

Concentration Monitor

Supplier–customer relationships between named firms, and how concentrated each supply layer is.

Concentration and alternatives at 14 supply-chain chokepoints

Herfindahl after the substitute deductionthe demand-growth extensionthe raw Herfindahl, before either operation

3 assessments have no supported composite; the register retains each assessment without a bar.

02,5005,0007,50010,00012,500Herfindahl → compositeEUV Lithography Systems · Herfindahl 10,000 · substitutes 0% · demand growth 15% · composite 11,500 · stableEUV Lithography Systems11,500ABF Dielectric Film · Herfindahl 9,050 · substitutes 5% · demand growth 20% · composite 10,317 · stableABF Dielectric Film10,317Gallium (Primary Low-Purity Production) · Herfindahl 9,802 · substitutes 10% · demand growth 15% · composite 10,145 · worseningGallium (Primary Low-Purity Production)10,145worseningEML Laser Chips (800G+ Optical Interconnect) · Herfindahl 4,150 · substitutes 15% · demand growth 160% · composite 9,172 · stableEML Laser Chips (800G+ Optical Interconnect)9,172High Bandwidth Memory (HBM) · Herfindahl 3,913 · substitutes 5% · demand growth 55% · composite 5,762 · stableHigh Bandwidth Memory (HBM)5,762Advanced 2.5D Packaging (CoWoS-class) · Herfindahl 4,658 · substitutes 15% · demand growth 40% · composite 5,543 · stableAdvanced 2.5D Packaging (CoWoS-class)5,543Wafer Inspection & Metrology Equipment · Herfindahl 4,038 · substitutes 10% · demand growth 15% · composite 4,179 · stableWafer Inspection & Metrology Equipment4,179EDA Tools (Advanced Node) · Herfindahl 2,696 · substitutes 5% · demand growth 12% · composite 2,869 · stableEDA Tools (Advanced Node)2,869EUV Photomasks & Pellicles · Herfindahl 2,250 · substitutes 5% · demand growth 20% · composite 2,565 · stableEUV Photomasks & Pellicles2,565Photoresist (EUV-grade) · Herfindahl 2,114 · substitutes 10% · demand growth 18% · composite 2,245 · stablePhotoresist (EUV-grade)2,245Silicon Wafers (300mm) · Herfindahl 2,058 · substitutes 20% · demand growth 8% · composite 1,778 · stableSilicon Wafers (300mm)1,778

Chokepoints ordered by the editorial composite: the Herfindahl index reduced for substitute availability, then extended for demand growth. All rows share the axis below.

012,500
  1. EUV Lithography Systems composite 11,500

    Herfindahl 10,000 · substitutes 0% · demand growth 15% · stable

  2. ABF Dielectric Film composite 10,317

    Herfindahl 9,050 · substitutes 5% · demand growth 20% · stable

  3. Gallium (Primary Low-Purity Production) composite 10,145

    Herfindahl 9,802 · substitutes 10% · demand growth 15% · worsening

  4. EML Laser Chips (800G+ Optical Interconnect) composite 9,172

    Herfindahl 4,150 · substitutes 15% · demand growth 160% · stable

  5. High Bandwidth Memory (HBM) composite 5,762

    Herfindahl 3,913 · substitutes 5% · demand growth 55% · stable

  6. Advanced 2.5D Packaging (CoWoS-class) composite 5,543

    Herfindahl 4,658 · substitutes 15% · demand growth 40% · stable

  7. Wafer Inspection & Metrology Equipment composite 4,179

    Herfindahl 4,038 · substitutes 10% · demand growth 15% · stable

  8. EDA Tools (Advanced Node) composite 2,869

    Herfindahl 2,696 · substitutes 5% · demand growth 12% · stable

  9. EUV Photomasks & Pellicles composite 2,565

    Herfindahl 2,250 · substitutes 5% · demand growth 20% · stable

  10. Photoresist (EUV-grade) composite 2,245

    Herfindahl 2,114 · substitutes 10% · demand growth 18% · stable

  11. Silicon Wafers (300mm) composite 1,778

    Herfindahl 2,058 · substitutes 20% · demand growth 8% · stable

For EUV Lithography Systems, 0% assessed substitute availability and 15% estimated annual demand growth modify a raw Herfindahl of ; the formula yields 11,500.

The ordering above is an editorial ranking: every row is flagged estimated with an editorial estimation method, and each Herfindahl is computed from analyst share estimates. It carries no measured severity.

Among assessments with supported concentration inputs, 1 chokepoint is concentrating, 10 stable and 0 deconcentrating; 1 has no substitute identified. These are dated analyst assessments. Each Herfindahl here describes one market; the stress index combines concentration across 93 CSET steps using portfolio weights. The Chokepoints page uses a higher evidence threshold for its per-layer figures, admitting tier-1 and tier-2 shares.

Current chokepoints by editorial priority

14 nodes · ordered by editorial composite
AI-compute supply chokepoints in an editorial priority ordering derived from HHI concentration, hand-assigned substitute availability, and demand growth, with trajectory.
TechnologyCategoryTop SupplierHHISubstitutesDemand GrowthTrajectoryPriority (editorial)
EUV Lithography SystemsLithographyASML (Netherlands)
0%
15%
Stable
ABF Dielectric FilmSubstratesAjinomoto (Japan)
5%
20%
Stable
Gallium (Primary Low-Purity Production)MaterialsChina (aggregated producers) (China)
10%
15%
Concentrating
EML Laser Chips (800G+ Optical Interconnect)OpticsLumentum (United States)
15%
160%
Stable
High Bandwidth Memory (HBM)MemorySK Hynix (South Korea)
5%
55%
Stable
Advanced 2.5D Packaging (CoWoS-class)PackagingTSMC (Taiwan)
15%
40%
Stable
Wafer Inspection & Metrology EquipmentEquipmentKLA Corporation (United States)
10%
15%
Stable
EDA Tools (Advanced Node)EDASynopsys (United States)
5%
12%
Stable
EUV Photomasks & PelliclesMaterialsToppan (Japan)
5%
20%
Stable
Photoresist (EUV-grade)MaterialsJSR Corporation (Japan)
10%
18%
Stable
Silicon Wafers (300mm)MaterialsShin-Etsu Chemical (Japan)
20%
8%
Stable
Chiplet Interconnects (UCIe)PackagingUnavailableUnavailable
10%
50%UnavailableUnavailable
Semiconductor-Grade Neon GasMaterialsUnavailableUnavailable
15%
10%UnavailableUnavailable
US Data Center Grid InterconnectionInfrastructureUnavailableUnavailable
20%
35%UnavailableUnavailable
HHI runs 0 (perfect competition) to 10,000 (monopoly), computed from Tier-3 market-share estimates; the Priority column is the editorial composite the figure above decomposes. 3 rows have no supported composite. 4 of 11 supported rows exceed the 7,000 critical threshold.

Supply-chain stress index

Default weights · 45.7 / 100 · Moderate

Supply chain stress index

Weight Adjustment

A single 0–100 composite across four sub-indices: demand (WSTS monthly billings, three-month moving average, year on year), concentration (a CSET Herfindahl weighted across 93 supply-chain steps), capacity (FRED semiconductor utilization), and power (the PJM data-center-region queue-to-operational ratio). The default equal-weight composite is ; the controls above recalculate it under your selected weights. The series follows the available WSTS year-on-year observations through 2026-01; months without a FRED observation use the latest available utilization value. Two of the four sub-indices update monthly and two are held constant: demand and capacity move on WSTS billings and FRED utilization, while concentration and power read single-vintage snapshots. The two flat lines in the series above are those two.

Concentration among reported chip designers

Herfindahl 4,886 · 2025 Q4

Reported cumulative H100-equivalent shipments across the 5 designers whose source rows all run from one cumulative start: Nvidia, Google, AMD, Huawei, Amazon. The reported chip models do not cover the whole market.

Source: Epoch AI · AI Chip Sales (CC-BY 4.0). The line is a Herfindahl over reported shipment shares. For each designer, Scrutica sums Epoch’s chip-level p5 values and p95 values, then varies designer totals independently between those sums to find the lowest and highest reachable Herfindahls. Summed per-chip percentiles bound the designer total; the shaded band spans the extremes reachable that way, with no probability attached.

Source starts: Nvidia 2022-01-01; Google 2023-01-01; AMD 2024-01-01; Huawei 2024-01-01; Amazon 2024-01-01. Excluded incomplete or missing-record quarters: 2026 Q1. Designers whose rows run from more than one cumulative start are held out of this series; the upstream chip-flow panel lists them with their own windows.

The per-market Herfindahls in the figure and table above are point-in-time editorial estimates, with no series behind them: the capacity records accumulate one facility’s build-out at a time and hold no market cross-section to compute a share from.

18-month outlook

14 cards · dated assessments, supplier shares and monitoring signals
EUV Lithography Systems Critical · composite 11,500 Resolution: No clear path
Stable

ASML reported a €38.8 billion order backlog at the end of 2025 across its system business, and €7.4 billion of EUV bookings in the fourth quarter alone. It also recognised revenue for two High-NA systems in that quarter. High-NA extends ASML’s product range within the single-supplier EUV market represented here.

Estimated shares are squared as published, without renormalizing rounding differences. All share coverage is represented.

100%ASMLNetherlands

A single EUV scanner supplier makes access to its systems consequential for fabs that use EUV processes. ASML’s September 2024 licensing statement confirms that EUV sales require licences. The supplier share establishes commercial concentration; the relevant export rules and transaction determine whether a particular shipment can proceed.

Demand Growth
15% YoY
Substitute Availability
0%
Resolution Timeline
No clear path
ABF Dielectric Film Critical · composite 10,317 Resolution: No verified date for replacement at scale
Stable

Ajinomoto describes ABF as the insulating film between wiring layers in package substrates. In its own materials-business interview, the company puts its share at roughly 95%; the figure is a supplier claim, without an independently verified market breakdown here. Intel’s July 2026 glass-substrate collaboration with Lens Technology concerns further development. The announcement does not report a commercial product shipment.

Estimated shares are squared as published, without renormalizing rounding differences. 5% is in residual buckets, each squared as one supplier; splitting it lowers its contribution. HHI is an upper bound relative to splitting these buckets.

95%AjinomotoJapan
5%Others (Sekisui, etc.)Various

The dependency assessed here is the dielectric film used inside a package substrate. A glass-core packaging announcement does not establish that the design replaces this film. Evaluating an alternative requires evidence about its insulating layers and qualification for the intended chip, before treating it as a second source.

Demand Growth
20% YoY
Substitute Availability
5%
Resolution Timeline
No verified date for replacement at scale
Gallium (Primary Low-Purity Production) Critical · composite 10,145 Resolution: November 27, 2026 (deadline-driven)
Concentrating

USGS Mineral Commodity Summaries 2026 attributes 99% of primary low-purity gallium production to China. The export restriction at issue is US-specific: MOFCOM Announcement 72/2025 suspends paragraph two of Announcement 46/2024 until 27 November 2026. That paragraph generally denies licences for relevant dual-use gallium, germanium, antimony and superhard-material exports to the United States. Its reinstatement would restrict US access; it would not remove Chinese output from the entire world market.

Estimated shares are squared as published, without renormalizing rounding differences. 1% is in residual buckets, each squared as one supplier; splitting it lowers its contribution. HHI is an upper bound relative to splitting these buckets.

99%China (aggregated producers)China
1%Rest of worldVarious

The 99% input measures primary low-purity gallium production by country, so this HHI is not directly comparable with the company-based HHIs. Germanium is covered by the same suspended export provision but has a different supplier structure and is excluded from this HHI. The practical exposure depends on access to refining, inventories and alternative supplies as well as the announced licensing policy.

Demand Growth
15% YoY
Substitute Availability
10%
Resolution Timeline
November 27, 2026 (deadline-driven)
EML Laser Chips (800G+ Optical Interconnect) Critical · composite 9,172 Resolution: Production volumes and customer qualification require confirmation
Stable

Lumentum demonstrated a 1.6T DR4 OSFP prototype at OFC in March 2026 using four 400G differential EML lasers. Its optical interface was 4×400 Gbps; the host electrical interface was 8×200 Gbps. A prototype demonstration establishes a technical milestone, without measuring available laser-chip production or the size of a supply shortfall.

Estimated shares are squared as published, without renormalizing rounding differences. 15% is in residual buckets, each squared as one supplier; splitting it lowers its contribution. HHI is an upper bound relative to splitting these buckets.

55%LumentumUnited States
30%Coherent (incl. Source Photonics)United States
15%OthersVarious

The estimates here concern EML laser chips inside transceivers. A shortage of qualified chips can limit module supply, but the effect on a cluster depends on its chosen network architecture and optical products. Neither the 55% supplier estimate nor the prototype announcement establishes that every capacity expansion falls short of demand.

Demand Growth
160% YoY
Substitute Availability
15%
Resolution Timeline
Production volumes and customer qualification require confirmation
High Bandwidth Memory (HBM) Elevated · composite 5,762 Resolution: Micron Singapore capacity expansion planned from 2027
Stable

The Q2 2026 vendor estimates used here put SK Hynix at ~50%, Samsung at ~33% and Micron at ~18%. SK Hynix and Samsung together account for ~83%; that is a supplier share, not a measurement of production physically located in South Korea. Micron broke ground on an HBM packaging facility in Singapore in January 2025, with operations planned for 2026 and substantial additional packaging capacity from 2027.

Estimated shares are squared as published, without renormalizing rounding differences. All share coverage is represented.

50%SK HynixSouth Korea
33%SamsungSouth Korea
18%MicronUnited States

A disruption affecting one of the three suppliers could constrain accelerator production even where GPU fabrication continues. Assessing exposure to a peninsula-wide event requires the locations and capacity of the relevant fabs and packaging plants; the headquarters-based shares above cannot supply that estimate.

Demand Growth
55% YoY
Substitute Availability
5%
Resolution Timeline
Micron Singapore capacity expansion planned from 2027
Advanced 2.5D Packaging (CoWoS-class) Elevated · composite 5,543 Resolution: US packaging facilities announced; operating dates require confirmation
Stable

TSMC’s March 2025 US expansion plan included two advanced-packaging facilities. The announcement establishes an intention to add packaging outside Taiwan, with no production-start date in that release. The supplier shares used here do not distinguish those planned sites from operating capacity, and cannot establish how much packaging will be available to a particular accelerator customer.

Estimated shares are squared as published, without renormalizing rounding differences. All share coverage is represented.

65%TSMCTaiwan
15%AmkorSouth Korea
12%ASE Group (SPIL)Taiwan
8%SamsungSouth Korea

A logic fab outside Taiwan does not by itself provide packaging for its output. For a specific accelerator, the relevant questions are where the qualified packaging process runs, when additional capacity becomes available and whether the customer has secured access to it. Company market share cannot answer those questions.

Demand Growth
40% YoY
Substitute Availability
15%
Resolution Timeline
US packaging facilities announced; operating dates require confirmation
Wafer Inspection & Metrology Equipment Elevated · composite 4,179 Resolution: Qualification and competition vary by inspection task
Stable

KLA’s December 2025 quarterly filing identifies EUV adoption in logic and DRAM, including HBM, as a source of new process-control requirements. It also describes higher process-control intensity at 2nm and growth in advanced packaging. These observations explain demand for inspection and metrology; they do not validate a change in the 60% KLA share used here. Estimates covering different equipment segments cannot be combined into a market-share trend.

Estimated shares are squared as published, without renormalizing rounding differences. 7% is in residual buckets, each squared as one supplier; splitting it lowers its contribution. HHI is an upper bound relative to splitting these buckets.

60%KLA CorporationUnited States
15%Applied MaterialsUnited States
10%Hitachi High-TechJapan
8%Onto InnovationUnited States
7%OthersVarious

KLA, Applied Materials and Onto Innovation account for 83% in these supplier estimates. Their headquarters do not establish the licensing treatment of every inspection tool. A control assessment must identify the equipment specification and intended transaction; the share table describes commercial concentration.

Demand Growth
15% YoY
Substitute Availability
10%
Resolution Timeline
Qualification and competition vary by inspection task
EDA Tools (Advanced Node) Moderate · composite 2,869 Resolution: No clear path
Stable

Synopsys reported that BIS rescinded the China restrictions communicated in its 29 May 2025 letter on 2 July 2025, and that it was restoring access to the affected products. BIS had separately introduced controls on qualifying GAAFET-design software in 2022. The supplier shares used here describe the estimated vendor structure, without measuring the commercial effect of either rule.

Estimated shares are squared as published, without renormalizing rounding differences. 24% is in residual buckets, each squared as one supplier; splitting it lowers its contribution. HHI is an upper bound relative to splitting these buckets.

32%SynopsysUnited States
30%CadenceUnited States
14%Siemens EDAGermany
24%Others (Keysight, Altium, et al.)United States

Synopsys and Cadence account for ~62% in these supplier estimates; Siemens brings the combined share to ~76%. Restrictions on access to their tools can affect design work before a chip reaches fabrication. The May–July 2025 episode also shows that access restrictions can change within weeks.

Demand Growth
12% YoY
Substitute Availability
5%
Resolution Timeline
No clear path
EUV Photomasks & Pellicles Moderate · composite 2,565 Resolution: DNP photomask mass-production target: fiscal 2027
Stable

Mitsui Chemicals began commercial EUV-pellicle production under an ASML licence in 2021 and announced facilities for carbon-nanotube pellicles in May 2024. Separately, DNP and imec’s March 2024 development announcement targeted mass production of next-generation EUV photomasks in fiscal 2027. These are different products within the lithography process; the editorial photomask shares scored here do not measure pellicle supply.

Estimated shares are squared as published, without renormalizing rounding differences. 10% is in residual buckets, each squared as one supplier; splitting it lowers its contribution. HHI is an upper bound relative to splitting these buckets.

30%ToppanJapan
25%Dai Nippon Printing (DNP)Japan
20%PhotronicsUnited States
15%HOYAJapan
10%OthersVarious

EUV exposure depends on qualified masks and pellicles as well as the scanner. Mitsui manufactures pellicles under an ASML licence; that relationship cannot be inferred from the photomask supplier shares scored here. US controls already listed specified EUV mask blanks, pellicles and masks under ECCN 3B001.j, .l and .q in December 2024. The applicable licence requirements depend on the item and transaction.

Demand Growth
20% YoY
Substitute Availability
5%
Resolution Timeline
DNP photomask mass-production target: fiscal 2027
Photoresist (EUV-grade) Moderate · composite 2,245 Resolution: Capacity expansion within existing suppliers
Stable

The estimates used here assign 88% of supply to JSR, TOK, Shin-Etsu and Fujifilm, all Japanese-headquartered companies. Manufacturing locations differ: JSR announced final-stage metal-oxide-resist production in Korea, with operation planned for 2026, while TOK reported construction of a new photoresist building at Koriyama in August 2025. These investments expand incumbent suppliers; the company-share estimates do not measure how much production remains in Japan.

Estimated shares are squared as published, without renormalizing rounding differences. 4% is in residual buckets, each squared as one supplier; splitting it lowers its contribution. HHI is an upper bound relative to splitting these buckets.

28%JSR CorporationJapan
25%Tokyo Ohka Kogyo (TOK)Japan
20%Shin-Etsu ChemicalJapan
15%FujifilmJapan
8%DuPontUnited States
4%OthersVarious

Japan tightened licensing for photoresist exports to South Korea in 2019; the two governments agreed in March 2023 to restore the earlier permit system. The estimated 88% share here belongs to Japanese-headquartered suppliers. Exposure to a similar restriction depends on which products ship from Japan, so overseas production requires a separate assessment.

Demand Growth
18% YoY
Substitute Availability
10%
Resolution Timeline
Capacity expansion within existing suppliers
Silicon Wafers (300mm) Moderate · composite 1,778 Resolution: New manufacturing locations within incumbent suppliers
Stable

GlobalWafers opened its 300mm wafer facility in Sherman, Texas, in May 2025 and announced plans for additional phases. This expands manufacturing outside the supplier’s home country while keeping production within an incumbent firm. A stable supplier-share table can therefore coexist with a change in geographic exposure.

Estimated shares are squared as published, without renormalizing rounding differences. 7% is in residual buckets, each squared as one supplier; splitting it lowers its contribution. HHI is an upper bound relative to splitting these buckets.

30%Shin-Etsu ChemicalJapan
24%SUMCOJapan
17%GlobalWafersTaiwan
12%SiltronicGermany
10%SK SiltronSouth Korea
7%OthersVarious

Shin-Etsu and SUMCO are Japanese-headquartered suppliers; GlobalWafers is headquartered in Taiwan and operates the new Texas facility. These company shares cannot quantify the output exposed to an earthquake in Japan or a disruption in Taiwan. That calculation requires plant locations, qualified products and site capacity.

Demand Growth
8% YoY
Substitute Availability
20%
Resolution Timeline
New manufacturing locations within incumbent suppliers
Chiplet Interconnects (UCIe) Composite unavailable Resolution: Packaging capacity and UCIe adoption need separate tracking
Unavailable

The UCIe Consortium now publishes specifications through version 3.0, including die-to-die links at 48 and 64 GT/s. The companies listed are advanced-packaging suppliers; none of the sources cited here gives supplier shares for UCIe interconnects, so this row has no Herfindahl.

Concentration unavailable: no supplier market shares are known.

UnknownIntel (EMIB/Foveros)United States
UnknownSamsung (I-Cube)South Korea
UnknownTSMC (CoWoS/InFO)Taiwan
UnknownOthers (OSAT/startups)Various

A common die-to-die interface can support interoperability between chiplets. Manufacturing still requires a suitable packaging process and available capacity.

Demand Growth
50% YoY
Substitute Availability
10%
Resolution Timeline
Packaging capacity and UCIe adoption need separate tracking
Semiconductor-Grade Neon Gas Composite unavailable Resolution: Current supply shares require verification
Unavailable

DeCarlo and Goodman’s April 2022 USITC briefing reported Ukraine at roughly half of global neon supply and nearly all US imports of semiconductor-grade neon. It also reported that Cryoin and Ingas had stopped production in March 2022. Air Liquide announced a new Japanese air-separation unit with neon output in February 2025. These sources document disruption and additional supply; neither gives current supplier shares, so this row has no Herfindahl.

Concentration unavailable: no supplier market shares are known.

UnknownChinaChina
UnknownJapan purifiers (Air Liquide, Taiyo Nippon Sanso)Japan
UnknownKorea purifiers (Linde Korea)South Korea
UnknownUkraine (Ingas, Cryoin)Ukraine
UnknownOthersVarious

Neon is a buffer and carrier gas in DUV excimer-laser mixtures. Supply substitution requires qualified gas: the 2022 USITC briefing reported qualification periods of 3–18 months, repeated when a manufacturer changes source. Additional raw-gas capacity therefore does not by itself establish an immediately usable replacement for a fab.

Demand Growth
10% YoY
Substitute Availability
15%
Resolution Timeline
Current supply shares require verification
US Data Center Grid Interconnection Composite unavailable Resolution: Project-specific service terms and network upgrades
Unavailable

FERC’s December 2025 PJM order required clearer terms for loads co-located with generation, including an interim non-firm service while network upgrades are completed. The order addresses how a large load receives electricity. Generation-interconnection queue counts measure a different process and cannot be read as the number of data centers waiting for power. The operators listed are not competing suppliers a developer can choose between at one location.

Concentration unavailable: no supplier market shares are known.

UnknownERCOTUnited States
UnknownMISOUnited States
UnknownPJM InterconnectionUnited States
UnknownOther ISOs/RTOsUnited States

For a proposed campus, the useful evidence is its available electrical service: when it starts, how much load it permits and whether it can be curtailed. A site announcement or a nearby generation project does not supply those terms.

Demand Growth
35% YoY
Substitute Availability
20%
Resolution Timeline
Project-specific service terms and network upgrades

Upstream chip flow

Component demand

Epoch AI models the semiconductor inputs used by named chip designers in each quarter. These estimates describe input consumption; they do not measure installed compute or legal control.

Google TPU and Amazon Trainium series follow Epoch's end-customer attribution. These labels do not identify direct fabrication or ASIC partners.

Download this selection

Estimated global 3–5 nm logic supply, in 12-inch wafers (including N5-family 4 nm).

Q4 2025 · Logic wafers. Model medians, with p5–p95 intervals below.
DesignerDemand (wafers)Share of supply (%)
AMD~3,449.72,772.25–4,201.39~0.320.24–0.4
Amazon~9,288.637,742.58–10,827.25~0.860.67–1.03
Google~10,339.858,820.52–11,880.04~0.950.76–1.13
NVIDIA~103,746.9295,716.52–113,943.05~9.568.26–10.83
Other · residual~958,198.71958,198.71–958,198.71~88.3188.31–88.31

Modeled supply (wafers): ~1,085,023.811,052,516.18–1,159,144.74

“Other” is a model residual that can include untracked demand, inventory, unused capacity and model error. Provider shares come from modeled distributions; dividing the displayed medians need not reproduce them.

HBM is measured in USD, not memory volume. CoWoS wafers do not count finished packages. Component timing differs from chip sales, which also provide inputs to this model.

Source: Epoch AI, methodology · CC BY 4.0 · snapshot retrieved 2026-09-13. Downloads preserve the source decimals, missing values and provenance.

Related research · full year 2025

Chokepoint rank under four scoring formulas

The same 11 chokepoints ranked four ways: by Herfindahl alone, by each single editorial term applied to it, and by the published composite. 5 of 11 keep the same position under these four constructions. 3 assessments are unranked because concentration inputs are unavailable. The largest mover is EML Laser Chips (800G+ Optical Interconnect), which shifts 3 places across the constructions.

ChokepointHHI aloneHHI × (1 − substitutes)HHI × (1 + growth)Published compositeSpread
EUV Lithography Systems11110
ABF Dielectric Film33321
Gallium (Primary Low-Purity Production)22231
EML Laser Chips (800G+ Optical Interconnect)57443
High Bandwidth Memory (HBM)75652
Advanced 2.5D Packaging (CoWoS-class)44562
Wafer Inspection & Metrology Equipment66771
EDA Tools (Advanced Node)88880
EUV Photomasks & Pellicles99990
Photoresist (EUV-grade)101010100
Silicon Wafers (300mm)111111110
Chiplet Interconnects (UCIe)UnavailableUnavailableUnavailableUnavailableUnavailable
Semiconductor-Grade Neon GasUnavailableUnavailableUnavailableUnavailableUnavailable
US Data Center Grid InterconnectionUnavailableUnavailableUnavailableUnavailableUnavailable

Reading Rank 1 is the highest score under that construction; tied scores share a rank. A spread of 0 means its rank is unchanged across the four formulas tested. Larger spreads show greater sensitivity to these choices; the comparison does not test different input estimates.

Composite methodology and share-coverage bounds

The ordering composite, decomposed. One bar per chokepoint with supported concentration inputs. Each bar’s total length is the composite this page orders by, and the two spans are the two operations that built it: the solid span is the layer’s Herfindahl after the substitute deduction, and the outline extends it by the demand-growth multiplier.

The caret marks the raw Herfindahl before either operation, so where it falls inside the outline, demand growth more than replaced what substitutes deducted; where it falls past the bar’s end, the substitute deduction won and the composite is smaller than the raw Herfindahl.

Methodology

Supported concentration estimates are Tier 3 (analyst judgment + public data). Unavailable composites carry Tier 4. HHI (Herfindahl-Hirschman Index) is computed from estimated market shares: sum of squared market share percentages on a 0–10,000 scale. Editorial priority composite = HHI × (1 − substitute availability) × (1 + demand growth rate). Substitute availability is an editorial assessment on a 0–1 scale (0 = no substitute identified in the assessment; 1 = drop-in replacement available at scale). Demand growth rates are editorial estimates of annual growth; no row cites a source for its rate. Trajectory labels are dated analyst assessments; they are not calculated from a time series. Because two of its three inputs are hand-assigned, the composite is an editorial ordinal that prioritizes analyst attention, and no measured severity enters it; the formula is deterministic and fully reproducible from the inputs shown in each card. The composite can exceed 10,000 after the demand-growth multiplier is applied (the HHI component uses published shares without renormalizing rounding differences). Color thresholds: critical (>7,000), elevated (>4,000), moderate (≤4,000). Where multiple competitors are bundled into a residual group, that group is squared as though it were a single supplier; splitting it lowers its contribution to HHI. 8 of 14 rows contain known residual shares, ranging 1 to 24 points. Known shares cover less than the full market in 0 rows with a computable HHI; an asterisk marks these partial results. Adding omitted shares increases concentration under this convention. 0 rows combine residual buckets and omitted shares, so no single bound direction applies to them. Unavailable HHI: 3 of 14 rows. Each outlook card states its coverage and the interpretation that applies to its inputs.

Sources: ASML, TSMC, SK Hynix annual reports and earnings calls; TrendForce, Omdia, 650 Group / LightCounting, Counterpoint Research market trackers; USGS Mineral Commodity Summaries 2026; MOFCOM Announcement No. 72/2025; PJM Interconnection Queue data; SemiAnalysis; Ajinomoto Co. Annual Report 2025.

Policy sources and scope

The related policy sources include proposals and publications; a citation alone does not establish a restriction in force or its applicability to a particular product, destination or end user. Supplier countries describe the recorded market shares, not legal jurisdiction.

Consolidation activity

ownership changes across 4 of the 7 layers the ownership feed classifies

Three detectors run over the 29 ownership-change deals the feed has classified, which fall in 4 of the 7 layers it defines (CoWoS packaging, chiplets, EDA, advanced substrates, specialty photoresists, datacenter liquid cooling, wide-bandgap power electronics). That set overlaps the tracked chokepoints above without coinciding with them: liquid cooling and power electronics are not tracked as chokepoints, and most tracked chokepoints have no layer here. The detectors are per-layer quarterly anomalies (z > 2 vs the trailing eight-quarter mean), consolidation clusters (one acquirer, three or more deals in a rolling twelve months), and cross-layer actors (one acquirer moving in two or more layers). No anomaly has fired in the last 18 months, the window these counts treat as recent; the archive holds what the detectors found when they were first run back over the historical series.

Recent anomalies
0
+ 1 historical · last 18 mo
Cross-layer actors
0
≥ 2 layers within 12 months
Total events
29
all-time, ownership-change deals

The three ownership-change detectors

The feed aggregates ownership-change events (Buyout, M&A, Corporate Divestiture, Asset Sale, Public-to-Private, Secondary Buyout, Spin-Off, Reverse Merger, Joint Venture) from a licensed corporate-ownership database, filtered to the AI-compute chokepoint universe via per-organization layer classifications, and aggregated by quarter. Three detectors run over that series:

  • Per-layer quarterly anomaly: a quarter whose event count exceeds the trailing eight-quarter mean by z > 2, with a secondary absolute gate (observed − mean ≥ 2) so a jump from zero to two events in a thin layer does not trip on variance alone.
  • Consolidation cluster: one acquirer closing three or more deals inside a single layer within a rolling twelve months.
  • Cross-layer actor: one acquirer active in two or more layers within twelve months, which puts several chokepoint layers under one owner while each of them stays as fragmented as it was.

Anomalies persist archivally with stable identifiers. The date badge distinguishes recent activity (≤ 18 months) from historical patterns the detectors surface retroactively; an “open” anomaly can reference a quarter from decades ago, so the recent counts above are the subset whose reference window lands in the trailing eighteen months. Disclosure of deal dollar amounts runs about 46%; the event counts are complete. All classification and anomaly assessment is Tier 2–3 (a licensed research database plus rule-defined detection over it).