Scrutica
supply_chain_links rows. Sourced from a licensed supply-chain database (12,140 edges, 8,392 with relationship value in $M and 3-month price correlation), public-primary-source re-derivations (4,166 edges re-sourced to SEC EDGAR, public registries, and company disclosure), SEC Exhibit 21 subsidiary filings, and CSET entity classification. Search by company, filter by country/category/relationship type.Unique organizations in the graph
Bilateral supplier-customer relationships
Relationships with no known alternativeLayer-by-layer concentration → Chokepoint AnatomySupplier relationships with no alternative known in the datasetLayer-by-layer concentration → Chokepoint Anatomy
Organizations with at least one sole-source upstream dependency
Distinct countries among the named organizations
Mean criticality score (1–10 scale)Average risk score across all relationships (higher = harder to replace)
| Supplier | Customer | Category | Product / service | Criticality | Sole source |
|---|---|---|---|---|---|
| TSMC | Alphabet | foundry_services | Foundry manufacturing of TPU v5p silicon on TSMC N5 | 10.0 | Yes |
| ASML | TSMC | semiconductor_equipment | EUV lithography systems | 10.0 | Yes |
| NVIDIA | Meta Platforms, Inc. | gpu_accelerator | NVIDIA H100 SXM5 80GB GPU accelerators — 100,000 unit deployment | 10.0 | Yes |
| TSMC | NVIDIA | advanced_packaging | CoWoS-S advanced packaging | 10.0 | Yes |
| TSMC | NVIDIA | foundry_services | Foundry services — GH100 die at N5 process node | 10.0 | Yes |
| TSMC | HiSilicon | foundry_services | Foundry services — HiSilicon Kirin/Ascend 910 at TSMC N7/N5 (TERMINATED May 2020) | 10.0 | Yes |
| TSMC | Biren Technology | foundry_services | Foundry services — Biren BR100 at TSMC N7 (TERMINATED Oct 2023) | 10.0 | Yes |
| TSMC | NVIDIA | foundry_services | GH100 die at N5 foundry | 10.0 | Yes |
| TSMC | NVIDIA | foundry_services | Foundry services — NVIDIA H100 GH100 die at N5 (5nm) process node | 10.0 | Yes |
| TSMC | NVIDIA | foundry_services | GH100 die at N5 foundry | 10.0 | Yes |
| TSMC | NVIDIA | advanced_packaging | CoWoS-S advanced packaging — integrating GH100 compute die with HBM3 stacks | 10.0 | Yes |
| TSMC | Alibaba | foundry_services | 5nm foundry manufacturing for Yitian 710 server CPU (T-Head design) | 10.0 | Yes |
| NVIDIA | NVIDIA Corporation / CoreWeave | gpu_accelerator | NVIDIA H100 SXM5 80GB GPU accelerators — Eos supercomputer deployment | 10.0 | Yes |
| ASML | TSMC | semiconductor_equipment | EUV lithography systems for N5 | 10.0 | Yes |
| Ajinomoto Co., Inc. | Unimicron | substrates | Ajinomoto Build-up Film (ABF) substrate material for FC-BGA packages | 10.0 | Yes |
| NVIDIA | xAI | gpu_accelerator | NVIDIA H100 SXM5 80GB GPU accelerators | 10.0 | Yes |
| TSMC | NVIDIA | advanced_packaging | CoWoS-S advanced packaging for H200 SXM (larger interposer than H100 to accommodate 141GB HBM3e) | 10.0 | Yes |
| Ajinomoto Co., Inc. | Amkor | substrates | ABF substrate material for FOWLP | 10.0 | Yes |
| TSMC | NVIDIA | advanced_packaging | CoWoS-S advanced packaging | 10.0 | Yes |
| TSMC | NVIDIA | foundry_services | Foundry services — GH100 die at N5 (5nm) process node | 10.0 | Yes |
| TSMC | NVIDIA | advanced_packaging | CoWoS-S advanced packaging | 10.0 | Yes |
| ASML | TSMC | semiconductor_equipment | EUV lithography systems for N5 | 10.0 | Yes |
| NVIDIA | Microsoft Corporation | gpu_accelerator | NVIDIA H100 SXM5 80GB GPU accelerators | 10.0 | Yes |
| Ajinomoto Co., Inc. | Intel | substrates | ABF substrate material for EMIB and Foveros packaging | 10.0 | Yes |
| TSMC | NVIDIA | advanced_packaging | CoWoS-S advanced packaging | 10.0 | Yes |
| TSMC | Alphabet | foundry_services | Foundry manufacturing of TPU v6e (Trillium) on TSMC N5 | 10.0 | Yes |
| ASML | TSMC | semiconductor_equipment | EUV lithography systems | 10.0 | Yes |
| Ajinomoto Co., Inc. | Samsung | substrates | ABF substrate material for I-Cube packaging | 10.0 | Yes |
| Ajinomoto Co., Inc. | TSMC | substrates | ABF substrate material for CoWoS and InFO advanced packaging | 10.0 | Yes |
| TSMC | NVIDIA | foundry_services | Foundry services — GH100 die at N5 (5nm) process node (H200 reuses H100 compute die with upgraded HBM3e) | 10.0 | Yes |
| NVIDIA | Oracle Corporation | gpu_accelerator | NVIDIA H100 SXM5 80GB GPU accelerators for OCI Supercluster | 10.0 | Yes |
| ASML | TSMC | semiconductor_equipment | EUV lithography systems | 10.0 | Yes |
| TSMC | Alphabet | foundry_services | Foundry manufacturing of TPU v4 silicon (process node unverified) | 10.0 | Yes |
| NVIDIA | CoreWeave | gpu_accelerator | NVIDIA H200 SXM GPU accelerators | 10.0 | Yes |
| TSMC | Alphabet | foundry_services | Foundry manufacturing of TPU v5e silicon (process node unverified) | 10.0 | Yes |
| SMIC | HiSilicon | foundry_services | Foundry services — HiSilicon Ascend 910B at SMIC N+2 (~7nm DUV) | 10.0 | Yes |
| ASML | SMIC | semiconductor_equipment | DUV ArF immersion lithography (NXT:2000i). EUV blocked by Dutch export controls. | 10.0 | Yes |
| TSMC | Moore Threads | foundry_services | Foundry services — Moore Threads Chunxiao GPU (in MTT S80) at TSMC N7 (TERMINATED Oct 2023) | 10.0 | Yes |
| ASML | TSMC | semiconductor_equipment | EUV lithography systems (TWINSCAN NXE/EXE series) for N5 process node patterning | 10.0 | Yes |
| TSMC | Apple | foundry_services | Foundry manufacturing of Apple silicon (A-series, M-series processors) at N3/N4 process nodes | 10.0 | Yes |
| ASML | TSMC | semiconductor_equipment | EUV lithography systems for N5 patterning | 10.0 | Yes |
| Ajinomoto Co., Inc. | Shinko Electric | substrates | Ajinomoto Build-up Film (ABF) substrate material for FC-BGA packages | 10.0 | Yes |
| Ajinomoto Co., Inc. | Ibiden | substrates | Ajinomoto Build-up Film (ABF) substrate material for FC-BGA packages | 10.0 | Yes |
| NVIDIA | Amazon.com, Inc. | gpu_accelerator | NVIDIA H100 SXM5 80GB GPU accelerators for EC2 P5 instances | 10.0 | Yes |
| TSMC | NVIDIA | foundry_services | Foundry services — GH100 die at N5 process node | 10.0 | Yes |
| AMD | Hygon Information Technology Co., Ltd. | other | AMD Zen x86 architecture license via TISC JV (TERMINATED June 2019) | 10.0 | Yes |
| TSMC | NVIDIA | advanced_packaging | CoWoS-S advanced packaging | 10.0 | Yes |
| Alphabet | Alphabet | networking | ICI (Inter-Chip Interconnect) networking for TPU v5p pods | 9.0 | Yes |
| Alphabet | Alphabet | networking | Inter-Chip Interconnect (ICI) — Google's custom optical/electrical TPU pod network | 9.0 | Yes |
| NVIDIA | Meta Platforms, Inc. | gpu_accelerator | NVIDIA A100 GPU accelerators (SXM4 and PCIe variants) | 9.0 | Yes |
| TSMC | Iluvatar CoreX | foundry_services | Foundry services — Iluvatar CoreX TianGai-100 7nm GPGPU (first domestic 7nm GPGPU, released Jan 2021; foundry unverified but TSMC inferred from process node) | 9.0 | Yes |
| TSMC | Alphabet | advanced_packaging | CoWoS advanced packaging for TPU v5p/v6e with HBM stacks | 9.0 | Yes |
| TSMC | NVIDIA | foundry_services | Foundry services — GA100 die at N7 (7nm) process node | 9.0 | Yes |
| GlobalFoundries | Enflame Technology (Suiyuan) | foundry_services | Foundry services — Enflame CloudBlazer DTU at GlobalFoundries 12LP FinFET | 9.0 | Yes |
| SMIC | Huawei Technologies | foundry_services | Foundry for Kirin/Ascend chips at N+2 (7nm-class DUV) | 9.0 | Yes |
| NVIDIA | Amazon.com, Inc. | networking | Elastic Fabric Adapter (EFA) over InfiniBand NDR — P5 instance networking | 8.0 | Yes |
| NVIDIA | NVIDIA Corporation / CoreWeave | networking | InfiniBand NDR switching and networking — NVIDIA Quantum-2 InfiniBand | 8.0 | Yes |
| Alphabet | Alphabet | gpu_accelerator | Google TPU v5p ASIC | 8.0 | Yes |
| NVIDIA | Meta Platforms, Inc. | networking | InfiniBand HDR (200 Gb/s) cluster networking for RSC | 8.0 | Yes |
| NVIDIA | CoreWeave | networking | InfiniBand NDR networking — CoreWeave GPU-native cloud fabric | 8.0 | Yes |
| NVIDIA | xAI | networking | InfiniBand HDR/NDR networking — NVLink switch fabric for H100 SXM5 inter-GPU interconnect | 8.0 | Yes |
| Alphabet | Alphabet | gpu_accelerator | Google TPU v4 ASIC — custom AI accelerator designed and deployed by Google | 8.0 | Yes |
| NVIDIA | Microsoft Corporation | networking | InfiniBand NDR interconnect for Azure Eagle cluster fabric | 8.0 | Yes |
| SK Hynix | NVIDIA | memory | HBM3 for H100 SXM5 | 9.0 | No |
| FOUNDRY-UNVERIFIED | Alphabet | foundry_services | Foundry services for TPU v5p | 9.0 | No |
| SK Hynix | NVIDIA | memory | HBM3 for H100 SXM5 | 9.0 | No |
| SK Hynix | Huawei Technologies | memory | HBM memory supply for Huawei Ascend AI accelerator production | 9.0 | No |
| SK Hynix | NVIDIA | memory | HBM3e high-bandwidth memory for H200 SXM (141GB per Epoch ML Hardware) | 9.0 | No |
| TSMC | Cambricon | foundry_services | Foundry services — Cambricon MLU370 7nm chiplet (39B transistors, taped out Q3 2020 pre-BIS listing; foundry undisclosed, TSMC inferred) (TERMINATED Dec 2022) | 9.0 | No |
| SK Hynix | NVIDIA | memory | HBM3 high-bandwidth memory for H100 SXM5 | 9.0 | No |
| ASML | TSMC | semiconductor_equipment | ArF immersion (DUV) lithography for N7 process node | 9.0 | No |
| ASML | TPU v4 foundry | semiconductor_equipment | ArF immersion (DUV) lithography for 7nm node (DUV multi-patterning) | 9.0 | No |
| SK Hynix | NVIDIA | memory | HBM3 memory | 9.0 | No |
| SK Hynix | NVIDIA | memory | HBM3 memory for H100 SXM5 | 9.0 | No |
| FOUNDRY-UNVERIFIED | Alphabet | foundry_services | Foundry services for TPU v4 at 7nm process node | 9.0 | No |
| Broadcom Inc. | Alphabet | software_ip | ASIC co-design, SerDes IP, GDS tape-out for all TPU generations | 9.0 | No |
| SK Hynix | NVIDIA | memory | HBM3 high-bandwidth memory | 9.0 | No |
| Samsung | Qualcomm Inc | other | General Computer Hardware supply | 8.0 | No |
| Qualcomm Inc | Samsung | other | General Computer Hardware procurement | 8.0 | No |
| NXP | Avnet | other | Other IT Distributors procurement | 8.0 | No |
| Skyworks Solutions | Apple | other | Analog and Mixed Signal Semiconductors supply | 8.0 | No |
| FIH Mobile | Foxconn | advanced_packaging | Contract Electronic Manufacturing supply | 8.0 | No |
| Kioxia | Sandisk | memory | Data Storage Hardware procurement | 8.0 | No |
| Amkor | Qualcomm Inc | foundry_services | Semiconductor Manufacturing Services supply | 8.0 | No |
| Entegris | TSMC | foundry_services | Semiconductor Manufacturing Services procurement | 8.0 | No |
| Ichor Holdings | Applied Materials | semiconductor_equipment | Semiconductor Manufacturing Capital Equipment supply | 8.0 | No |
| Ichor Holdings | Lam Research | semiconductor_equipment | Semiconductor Manufacturing Capital Equipment supply | 8.0 | No |
| SkyWater Technology | Infineon Technologies | advanced_packaging | Contract Electronic Manufacturing supply | 8.0 | No |
| Xintec | TSMC | foundry_services | Semiconductor Manufacturing Services supply | 8.0 | No |
| SMIC | Brite Semicon Shanghai A | gpu_accelerator | Programmable Logic and ASIC Semiconductors procurement | 8.0 | No |
| Formosa Sumco Tech | SUMCO | semiconductor_equipment | Semiconductor Manufacturing Capital Equipment supply | 8.0 | No |
| Compuware Technology, Inc. | Super Micro Computer, Inc. | other | Electrical Products supply | 8.0 | No |
| Global Unichip | TSMC | gpu_accelerator | Programmable Logic and ASIC Semiconductors supply | 8.0 | No |
| Marumae | Tokyo Electron | semiconductor_equipment | Semiconductor Manufacturing Capital Equipment supply | 8.0 | No |
| ASE Technology Holding | TSMC | osat_services | OSAT packaging and testing services for TSMC-fabricated chips (including CoWoS-equivalent advanced packaging) | 8.0 | No |
| NXP | Arrow Electron | other | Other IT Distributors procurement | 8.0 | No |
| AspenTech Corp. | Emerson Electric | other | Other Machinery Manufacturing supply | 8.0 | No |
| ASE Technology Holding | TSMC | foundry_services | Semiconductor Manufacturing Services procurement | 8.0 | No |
| Soulbrain | Samsung | raw_materials | Other Specialty/Performance Chemical Manufacturing supply | 8.0 | No |
| Corning | Samsung | other | General Computer Hardware procurement | 8.0 | No |
| Samsung | Alphabet | memory | HBM3E memory for TPU v6e/Trillium — primary supplier >60% share | 8.0 | No |
| Celestica | Lam Research | semiconductor_equipment | Semiconductor Manufacturing Capital Equipment procurement | 8.0 | No |
| Micron | Avnet | other | Other IT Distributors procurement | 8.0 | No |
| Broadcom Inc. | Arista Networks | other | Analog and Mixed Signal Semiconductors supply | 8.0 | No |
| Analog Devices | Arrow Electron | other | Other IT Distributors procurement | 8.0 | No |
| NVIDIA | ByteDance | gpu_accelerator | AI training/inference GPUs (H20; $16B stockpile pre-ban) | 8.0 | No |
| Texas Instruments | Arrow Electron | other | Other IT Distributors procurement | 8.0 | No |
| JSR Corporation | TSMC | raw_materials | EUV and ArF photoresists for advanced node patterning | 8.0 | No |
| Amkor | Apple | osat_services | Advanced packaging services for Apple silicon (SiP modules, system-in-package) | 8.0 | No |
| Hewlett Packard Ent /US | AMD | other | Computer Systems supply | 8.0 | No |
| Samsung Electronics or SK Hynix | Alphabet | memory | HBM2 memory for TPU v4 | 8.0 | No |
| Canaan ADR A | Cipher Digital | other | Computer Systems supply | 8.0 | No |
| Samsung Electronics or SK Hynix | Alphabet | memory | HBM2e memory — TPU v5p memory = 95GB per Epoch | 8.0 | No |
| SMIC | Loongson | foundry_services | Foundry services — Loongson 3A6000 at SMIC 12nm | 8.0 | No |
| Ichor Holdings | ASML | semiconductor_equipment | Semiconductor Manufacturing Capital Equipment supply | 8.0 | No |
| Infineon Technologies | Arrow Electron | other | Other IT Distributors procurement | 8.0 | No |
| HPE | AMD | gpu_accelerator | Specialized Semiconductors procurement | 8.0 | No |
| HPE | NVIDIA | gpu_accelerator | Specialized Semiconductors procurement | 8.0 | No |
| Kendrion | ASML | power_delivery | Commercial and Industrial Electric Products supply | 8.0 | No |
| CoreWeave | NVIDIA | gpu_accelerator | Specialized Semiconductors procurement | 8.0 | No |
| Samsung | NVIDIA | memory | HBM2e high-bandwidth memory for A100 | 8.0 | No |
| NVIDIA | Tencent Holdings Ltd. | gpu_accelerator | AI training/inference GPUs; late to domestic transition | 8.0 | No |
| AudioCodes | Cisco | gpu_accelerator | Specialized Semiconductors supply | 8.0 | No |
| Cadence | Arteris | software_ip | Design and Engineering Software procurement | 8.0 | No |
| Sandisk | Kioxia | memory | Data Storage Hardware partnership | 7.0 | No |
| Ningbo Semiconductor International Corp. | SMIC | other | Semiconductors partnership | 7.0 | No |
| Samsung | Corning | other | General Computer Hardware partnership | 7.0 | No |
| Atomera | Synopsys | raw_materials | Other Specialty/Performance Chemical Manufacturing partnership | 7.0 | No |
| Arista Networks | Jabil | networking | Wide Area Networking Equipment partnership | 7.0 | No |
| Huawei Technologies | ByteDance | gpu_accelerator | Ascend 910C AI accelerators ($5.6B commitment) | 7.0 | No |
| NVIDIA | Alibaba | gpu_accelerator | AI training/inference GPUs; Alibaba developing Hanguang 800 | 7.0 | No |
| Huawei Technologies | Tencent Holdings Ltd. | gpu_accelerator | Ascend AI accelerators (volume undisclosed) | 7.0 | No |
| Arrow Electron | NXP | other | Other IT Distributors partnership | 7.0 | No |
| ASE Technology Holding | Qualcomm Inc | osat_services | OSAT packaging and testing services for Qualcomm Snapdragon and modem chips | 7.0 | No |
| Penguin Solutions | AMD | other | Module and Subassembly Components partnership | 7.0 | No |
| Huawei Technologies | Alibaba | gpu_accelerator | Ascend AI accelerators (volume undisclosed) | 7.0 | No |
| LG Electronics | MediaTek | other | General Computer Hardware partnership | 7.0 | No |
| AMD | GlobalFoundries | gpu_accelerator | Specialized Semiconductors partnership | 7.0 | No |
| Amkor | Qualcomm Inc | osat_services | Advanced packaging and testing services for Qualcomm mobile and connectivity chips | 7.0 | No |
| Amkor | NVIDIA | osat_services | Advanced packaging and testing for NVIDIA GPU products | 7.0 | No |
| SK Hynix | Alphabet | memory | HBM3E memory for TPU v6e/Trillium — secondary supplier ~40% | 7.0 | No |
| Shin-Etsu Chemical | TSMC | raw_materials | Silicon wafers (300mm) for N5 fabrication | 7.0 | No |
| NVIDIA | Oracle Corporation | networking | RDMA over Converged Ethernet (RoCEv2) via NVIDIA ConnectX-7 NICs | 7.0 | No |
| NVIDIA | Meta Platforms, Inc. | networking | InfiniBand NDR cluster networking | 7.0 | No |
| Applied Materials | TSMC | semiconductor_equipment | CVD/PVD deposition tools, CMP tools, etch tools for N5 fab process | 7.0 | No |
| Shin-Etsu Chemical | TSMC | raw_materials | Silicon wafers (300mm) and photoresists for N5 fab process | 7.0 | No |
| Dell Technologies | Broadcom Inc. | other | General Computer Hardware partnership | 7.0 | No |
| Silicon Motion Technology | Micron | gpu_accelerator | Specialized Semiconductors supply | 6.0 | No |
| General Interface Solution (GIS) Holding | Foxconn | other | Module and Subassembly Components supply | 6.0 | No |
| STAG Industrial | Schneider Electric | other | Equity REITs supply | 6.0 | No |
| ShunSin Technology Hldgs | Foxconn | other | Optoelectronics Electronic Components supply | 6.0 | No |
| GSI Technology | Flex | memory | Memory Semiconductors supply | 6.0 | No |
| Vertiv Holdings | Digital Realty | other | Equity REITs procurement | 6.0 | No |
| Vertiv Holdings | CoreWeave | power_delivery | Commercial and Industrial Electric Products supply | 6.0 | No |
| Qt Group | Texas Instruments | software_ip | Design and Engineering Software supply | 6.0 | No |
| Micron | TD SYNNEX Corp | other | IT Hardware Distributors procurement | 6.0 | No |
| Super Micro Computer, Inc. | WhiteFiber | other | Internet Hosting Services procurement | 6.0 | No |
| ARM | Raspberry Pi Holdings | other | Hardware Components procurement | 6.0 | No |
| Analog Devices | Apple | networking | Wireless Mobile Equipment procurement | 6.0 | No |
| Super Micro Computer, Inc. | Applied Digital | other | Computer Systems supply | 6.0 | No |
| Texas Instruments | Tokyo Electron | other | Other IT Distributors procurement | 6.0 | No |
| GlobalFoundries | Qualcomm Inc | gpu_accelerator | Specialized Semiconductors procurement | 6.0 | No |
| GlobalFoundries | Samsung | other | General Computer Hardware procurement | 6.0 | No |
| GAONCHIPS | ARM | gpu_accelerator | Programmable Logic and ASIC Semiconductors supply | 6.0 | No |
| NXP | LG Electronics | other | General Computer Hardware procurement | 6.0 | No |
| SMIC | VeriSilicon Microelectronics (Shanghai) A | gpu_accelerator | Programmable Logic and ASIC Semiconductors procurement | 6.0 | No |
| NXP | Aptiv | other | Consumer Vehicle Parts Manufacturing procurement | 6.0 | No |
| Qt Group | NXP | software_ip | Design and Engineering Software supply | 6.0 | No |
| VeriSilicon Microelectronics (Shanghai) A | SMIC | gpu_accelerator | Programmable Logic and ASIC Semiconductors supply | 6.0 | No |
| Rambus | AMD | software_ip | Design and Engineering Software supply | 6.0 | No |
| Equinix, Inc. | NVIDIA | gpu_accelerator | Specialized Semiconductors procurement | 6.0 | No |
| GlobalFoundries | Cirrus Logic | other | Analog and Mixed Signal Semiconductors procurement | 6.0 | No |
| GAONCHIPS | Samsung | gpu_accelerator | Programmable Logic and ASIC Semiconductors supply | 6.0 | No |
| STMicroelectronics | Mobileye Global A | other | Analog and Mixed Signal Semiconductors procurement | 6.0 | No |
| Analog Devices | Macnica Holdings | other | Other IT Distributors procurement | 6.0 | No |
| Huawei Technologies | Baidu | gpu_accelerator | Ascend AI accelerators for Baidu Cloud inference | 6.0 | No |
| Alphabet | Broadcom Inc. | other | Analog and Mixed Signal Semiconductors procurement | 6.0 | No |
| NVIDIA | Baidu | gpu_accelerator | AI training GPUs (A100/H800 historical; partially replaced by Kunlun) | 6.0 | No |
| Celestica | Ciena | networking | Wide Area Networking Equipment procurement | 6.0 | No |
| Cadence | TSMC | foundry_services | Semiconductor Manufacturing Services procurement | 6.0 | No |
| NVIDIA | Foxconn | gpu_accelerator | Specialized Semiconductors supply | 6.0 | No |
| Qt Group | STMicroelectronics | software_ip | Design and Engineering Software supply | 6.0 | No |
| Broadcom Inc. | HPE | other | Analog and Mixed Signal Semiconductors supply | 6.0 | No |
| Rambus | Micron | software_ip | Design and Engineering Software supply | 6.0 | No |
| Super Micro Computer, Inc. | One Stop Systems | other | Computer Systems procurement | 6.0 | No |
| Texas Instruments | Apple | other | Analog and Mixed Signal Semiconductors supply | 6.0 | No |
| Genesem | SK Hynix | semiconductor_equipment | Semiconductor Manufacturing Capital Equipment supply | 6.0 | No |
| Texas Instruments | Rochester Electronics LLC | other | Semiconductors procurement | 6.0 | No |
| King Yuan Electronics | MediaTek | foundry_services | Semiconductor Manufacturing Services supply | 6.0 | No |
| UMC | MediaTek | foundry_services | Semiconductor Manufacturing Services supply | 6.0 | No |
| TSMC | MediaTek | foundry_services | Semiconductor Manufacturing Services supply | 6.0 | No |
| Ibiden | Alphabet | substrates | ABF FC-BGA substrates for TPU CoWoS packages | 6.0 | No |
| HPE | Intel | gpu_accelerator | Processor Semiconductors procurement | 6.0 | No |
| Parade Technologies | Foxconn | gpu_accelerator | Specialized Semiconductors supply | 6.0 | No |
| Parade Technologies | Foxconn | gpu_accelerator | Specialized Semiconductors supply | 6.0 | No |
| Jenoptik | ASML | other | Industrial Machine Parts and Support Equipment supply | 6.0 | No |
| Hewlett Packard Ent /US | NVIDIA | other | Computer Systems supply | 6.0 | No |
| JCET Group A | SMIC | foundry_services | Semiconductor Manufacturing Services supply | 6.0 | No |
| Dell Technologies | Ingram Micro Holding | other | IT Hardware Distributors procurement | 6.0 | No |
| MediaTek | TSMC | gpu_accelerator | Specialized Semiconductors partnership | 5.0 | No |
| Qualcomm Inc | GlobalFoundries | gpu_accelerator | Specialized Semiconductors partnership | 5.0 | No |
| Sony Group | Qualcomm Inc | other | General Computer Hardware partnership | 5.0 | No |
| Synopsys | NVIDIA | software_ip | Design and Engineering Software partnership | 5.0 | No |
| Ambiq Micro | Cadence | gpu_accelerator | Specialized Semiconductors partnership | 5.0 | No |
| Cohu | Jabil | semiconductor_equipment | Semiconductor Manufacturing Capital Equipment partnership | 5.0 | No |
| VeriSilicon Microelectronics (Shanghai) A | GlobalFoundries | gpu_accelerator | Programmable Logic and ASIC Semiconductors partnership | 5.0 | No |
| Intel | Arista Networks | gpu_accelerator | Processor Semiconductors partnership | 5.0 | No |
| Cirrus Logic | GlobalFoundries | other | Analog and Mixed Signal Semiconductors partnership | 5.0 | No |
| Broadcom Inc. | AMD | other | Analog and Mixed Signal Semiconductors partnership | 5.0 | No |
| Microsoft Corporation | Arista Networks | software_ip | General and Mixed-Type Software partnership | 5.0 | No |
| PTC | Synopsys | other | Other Machinery Manufacturing partnership | 5.0 | No |
| Hewlett Packard Ent /US | Broadcom Inc. | other | Computer Systems partnership | 5.0 | No |
| Flip Electronics LLC | Analog Devices | other | Semiconductors partnership | 5.0 | No |
| Samsung | GlobalFoundries | other | General Computer Hardware partnership | 5.0 | No |
| Arista Networks | Broadcom Inc. | networking | Wide Area Networking Equipment partnership | 5.0 | No |
| Cadence | NVIDIA | software_ip | Design and Engineering Software partnership | 5.0 | No |
| ZF Friedrichshafen AG | Infineon Technologies | other | Consumer Vehicle Parts Manufacturing partnership | 5.0 | No |
| OPENEDGES Technology | ARM | software_ip | Design and Engineering Software partnership | 5.0 | No |
| Penguin Solutions | Micron | other | Module and Subassembly Components partnership | 5.0 | No |
| Apptronik, Inc. | Jabil | cooling | Industrial Machinery partnership | 5.0 | No |
| Mobileye Global A | STMicroelectronics | other | Analog and Mixed Signal Semiconductors partnership | 5.0 | No |
| Progate Group | TSMC | gpu_accelerator | Programmable Logic and ASIC Semiconductors partnership | 5.0 | No |
| Rackspace Technology Global, Inc. | Cisco | other | Internet Hosting Services partnership | 5.0 | No |
| TSMC | Cadence | foundry_services | Semiconductor Manufacturing Services partnership | 5.0 | No |
| Phison Electronics | Kioxia | other | Module and Subassembly Components partnership | 5.0 | No |
| indie Semiconductor A | GlobalFoundries | other | Analog and Mixed Signal Semiconductors partnership | 5.0 | No |
| DTS, Inc. (California) | Cadence | software_ip | Design and Engineering Software partnership | 5.0 | No |
| DigitalOcean | AMD | other | Internet Hosting Services partnership | 5.0 | No |
| Western Digital | Kioxia | memory | Data Storage Hardware partnership | 5.0 | No |
| Qualcomm Inc | Xiaomi B | networking | Wireless Mobile Equipment procurement | 4.0 | No |
| Fabrinet | NVIDIA | advanced_packaging | Contract Electronic Manufacturing supply | 4.0 | No |
| Digital Realty | Oracle Corporation | other | Equity REITs supply | 4.0 | No |
| Tokyo Ohka Kogyo | TSMC | raw_materials | Other Specialty/Performance Chemical Manufacturing supply | 4.0 | No |
| Foxconn | Sharp | other | General Computer Hardware procurement | 4.0 | No |
| Innolux | Foxconn | other | Hardware Components supply | 4.0 | No |
| SiTime | Apple | other | Analog and Mixed Signal Semiconductors supply | 4.0 | No |
| Maxone Semiconductor A | SMIC | semiconductor_equipment | Semiconductor Manufacturing Capital Equipment supply | 4.0 | No |
| Micron | ASBISc Enterprises | other | IT Hardware Distributors procurement | 4.0 | No |
| Synopsys | TSMC | foundry_services | Semiconductor Manufacturing Services procurement | 4.0 | No |
| Kopin Corp | Lenovo Group | other | Module and Subassembly Components supply | 4.0 | No |
| Celestica | Honeywell International | other | Other Machinery Manufacturing procurement | 4.0 | No |
| Celestica | Dell Technologies | other | General Computer Hardware procurement | 4.0 | No |
| Equinix, Inc. | Dell Technologies | other | Equity REITs supply | 4.0 | No |
| Equinix, Inc. | HPE | other | Equity REITs supply | 4.0 | No |
| Equinix, Inc. | Hewlett Packard Ent /US | other | Computer Systems procurement | 4.0 | No |
| FIT Hon Teng | Foxconn | substrates | Interconnect Electronic Components supply | 4.0 | No |
| NXP | WPG Holding | other | Other IT Distributors procurement | 4.0 | No |
| NXP | WT Microelectronics | other | Other IT Distributors procurement | 4.0 | No |
| Foxconn Industrial Internet | Vizio Holding Corp. | other | Consumer Video Electronics Equipment procurement | 4.0 | No |
| WinMate | Intel | other | Computer Systems supply | 4.0 | No |
| NXP | DENSO Corp | other | Consumer Vehicle Parts Manufacturing procurement | 4.0 | No |
| GlobalFoundries | AMD | foundry_services | Semiconductor Manufacturing Services supply | 4.0 | No |
| Celestica | Hewlett Packard Ent /US | other | Computer Systems procurement | 4.0 | No |
| Flex | Enphase Energy | other | Module and Subassembly Components procurement | 4.0 | No |
| Cadence | MediaTek | gpu_accelerator | Specialized Semiconductors procurement | 4.0 | No |
| Applied Materials | Atomera | raw_materials | Other Specialty/Performance Chemical Manufacturing procurement | 4.0 | No |
| Qt Group | Renesas | software_ip | Design and Engineering Software supply | 4.0 | No |
| Penguin Solutions | Schneider Electric | other | Module and Subassembly Components supply | 4.0 | No |
| Rambus | Western Digital | software_ip | Design and Engineering Software supply | 4.0 | No |
| Samsung | Apple | other | General Computer Hardware supply | 4.0 | No |
| TSMC | Renesas | foundry_services | Semiconductor Manufacturing Services supply | 4.0 | No |
| Micron | Unitrontech | memory | Memory Semiconductors procurement | 4.0 | No |
| Micron | RYODEN | other | Other IT Distributors procurement | 4.0 | No |
| Micron | WT Microelectronics | other | Other IT Distributors procurement | 4.0 | No |
| Resonant, Inc. | Cadence | software_ip | Design and Engineering Software supply | 4.0 | No |
| Super Micro Computer, Inc. | Ingram Micro Holding | other | IT Hardware Distributors procurement | 4.0 | No |
| STMicroelectronics | Continental | other | Consumer Vehicle Parts Manufacturing procurement | 4.0 | No |
| MediaTek | Xiaomi B | networking | Wireless Mobile Equipment procurement | 4.0 | No |
| Texas Instruments | Micross Components, Inc. | semiconductor_equipment | Electronic Production Equipment procurement | 4.0 | No |
| Matterport, Inc. | Amazon.com, Inc. | software_ip | Design and Engineering Software supply | 4.0 | No |
| Texas Instruments | Digi-Key Corp. | semiconductor_equipment | Electronic Production Equipment procurement | 4.0 | No |
| Musashi Seimitsu Industry | Nidec Corporation | other | Consumer Vehicle Parts Manufacturing supply | 4.0 | No |
| JFrog | Alphabet | software_ip | Design and Engineering Software supply | 4.0 | No |
| Bloom Energy A | Equinix, Inc. | power_delivery | Power Generation and Support Products supply | 4.0 | No |
| Sanmina | Arista Networks | advanced_packaging | Contract Electronic Manufacturing supply | 4.0 | No |
| TSMC | Analog Devices | foundry_services | Semiconductor Manufacturing Services supply | 4.0 | No |
| TSMC | NXP | foundry_services | Semiconductor Manufacturing Services supply | 4.0 | No |
| Alviva Holdings Ltd. | Dell Technologies | other | IT Hardware Distributors supply | 4.0 | No |
| Hwatsing Technology A | SMIC | semiconductor_equipment | Semiconductor Manufacturing Capital Equipment supply | 4.0 | No |
| Intel | HP Inc | other | Computer Systems procurement | 4.0 | No |
| Uni-Pixel, Inc. | Foxconn | raw_materials | Other Specialty/Performance Chemical Manufacturing supply | 4.0 | No |
| Parade Technologies | Quanta Computer | gpu_accelerator | Specialized Semiconductors supply | 4.0 | No |
| Uni-Pixel, Inc. | Foxconn | raw_materials | Other Specialty/Performance Chemical Manufacturing supply | 4.0 | No |
| Venture Corporation | Lam Research | advanced_packaging | Contract Electronic Manufacturing supply | 4.0 | No |
| CoreWeave | Microsoft Corporation | software_ip | General and Mixed-Type Software procurement | 4.0 | No |
| Dell Technologies | CDW | other | IT Hardware Distributors procurement | 4.0 | No |
| Sypris Solutions | Analog Devices | other | Defense Manufacturing supply | 4.0 | No |
| Hewlett Packard Ent /US | Intel | other | Computer Systems supply | 4.0 | No |
| Everspin Technologies | GlobalFoundries | memory | Memory Semiconductors supply | 4.0 | No |
| Qualcomm Inc | Apple | gpu_accelerator | Specialized Semiconductors supply | 3.0 | No |
| Amkor | Apple | foundry_services | Semiconductor Manufacturing Services supply | 3.0 | No |
| SK Hynix | Essencore Ltd. | other | Semiconductors procurement | 3.0 | No |
| STMicroelectronics | Apple | other | Analog and Mixed Signal Semiconductors supply | 3.0 | No |
| Cirrus Logic | Apple | other | Analog and Mixed Signal Semiconductors supply | 3.0 | No |
| Logitech International | Amazon.com, Inc. | other | Computer Peripherals supply | 3.0 | No |
| SK ecoplant | SK Hynix | construction | Infrastructure Construction/Contracting Services supply | 3.0 | No |
| NOK | Apple | other | Other Machinery Manufacturing supply | 3.0 | No |
| Fabrinet | Cisco | advanced_packaging | Contract Electronic Manufacturing supply | 3.0 | No |
| Prologis | Amazon.com, Inc. | other | Equity REITs supply | 3.0 | No |
| Ibiden | Intel | other | Hardware Components supply | 3.0 | No |
| Ibiden | NVIDIA | other | Hardware Components supply | 3.0 | No |
| Corsair Gaming | Amazon.com, Inc. | other | Module and Subassembly Components supply | 3.0 | No |
| CammSys | Samsung | other | Module and Subassembly Components supply | 3.0 | No |
| Ibiden | AMD | other | Hardware Components supply | 3.0 | No |
| FormFactor | SK Hynix | semiconductor_equipment | Semiconductor Manufacturing Capital Equipment supply | 3.0 | No |
| BXP | Alphabet | other | Equity REITs supply | 3.0 | No |
| Hodogaya Chemical | Samsung | raw_materials | Other Specialty/Performance Chemical Manufacturing supply | 3.0 | No |
| Digital Realty | Meta Platforms, Inc. | other | Equity REITs supply | 3.0 | No |
| Cousins Properties | Amazon.com, Inc. | other | Equity REITs supply | 3.0 | No |
| Hudson Pacific Properties | Alphabet | other | Equity REITs supply | 3.0 | No |
| Tritax Big Box | Amazon.com, Inc. | other | Equity REITs supply | 3.0 | No |
| Universal Display | Samsung | raw_materials | Other Specialty/Performance Chemical Manufacturing supply | 3.0 | No |
| Hudson Pacific Properties | Amazon.com, Inc. | other | Equity REITs supply | 3.0 | No |
| BXP | Microsoft Corporation | other | Equity REITs supply | 3.0 | No |
| British Land | Meta Platforms, Inc. | other | Equity REITs supply | 3.0 | No |
| JBG SMITH Properties | Amazon.com, Inc. | other | Equity REITs supply | 3.0 | No |
| Alexandria Real Estate | Alphabet | other | Equity REITs supply | 3.0 | No |
| Prologis Property Mexico | Amazon.com, Inc. | other | Equity REITs supply | 3.0 | No |
| STAG Industrial | Amazon.com, Inc. | other | Equity REITs supply | 3.0 | No |
| YoungWoo DSP | Samsung | semiconductor_equipment | Semiconductor Manufacturing Capital Equipment supply | 3.0 | No |
| Zoom | Amazon.com, Inc. | other | Media Industry Electronics Manufacturing supply | 3.0 | No |
| Hudson Pacific Properties | Dell Technologies | other | Equity REITs supply | 3.0 | No |
| Maxone Semiconductor A | ASE Technology Holding | semiconductor_equipment | Semiconductor Manufacturing Capital Equipment supply | 3.0 | No |
| ICP Das | HPE | semiconductor_equipment | Factory Automation Equipment supply | 3.0 | No |
| Charter Hall Group | Amazon.com, Inc. | other | Equity REITs supply | 3.0 | No |
| Net Lease Office Properties | Alphabet | other | Equity REITs supply | 3.0 | No |
| InvenTrust Ppts | Amazon.com, Inc. | other | Equity REITs supply | 3.0 | No |
| Manulife US REIT-S | Amazon.com, Inc. | other | Equity REITs supply | 3.0 | No |
| Beamr Imaging | Alphabet | software_ip | Design and Engineering Software supply | 3.0 | No |
| Qt Group | NVIDIA | software_ip | Design and Engineering Software supply | 3.0 | No |
| Corsair Gaming | Intel | other | Module and Subassembly Components partnership | 3.0 | No |
| Giga Device Semiconductor H | SMIC | memory | Memory Semiconductors supply | 3.0 | No |
| Haivision Systems | Microsoft Corporation | other | Media Industry Electronics Manufacturing supply | 3.0 | No |
| Lens Technology H | Samsung | raw_materials | Nonmetallic Minerals Products supply | 3.0 | No |
| Datatec | Cisco | other | IT Hardware Distributors partnership | 3.0 | No |
| Ham-Let (Israel-Canada) Ltd. | Applied Materials | cooling | Air, Liquid and Gas Control Equipment supply | 3.0 | No |
| Rockley Photonics Holdings Ltd. | Apple | other | Optoelectronics Electronic Components supply | 3.0 | No |
| Hansol Chemical | Samsung | raw_materials | Other Specialty/Performance Chemical Manufacturing supply | 3.0 | No |
| Wuxi Unicomp Technology | Amphenol A | semiconductor_equipment | Electronics Manufacturing Equipment supply | 3.0 | No |
| Daewon CTS Co., Ltd. | Samsung | other | Electronics Distributors supply | 3.0 | No |
| Penguin Solutions | NVIDIA | other | Module and Subassembly Components partnership | 3.0 | No |
| Daewon CTS Co., Ltd. | Western Digital | other | Electronics Distributors supply | 3.0 | No |
| Penguin Solutions | Celestica | other | Module and Subassembly Components partnership | 3.0 | No |
| Penguin Solutions | Intel | other | Module and Subassembly Components partnership | 3.0 | No |
| Pennar Industries | Emerson Electric | raw_materials | Primary Metals Products supply | 3.0 | No |
| Electrovaya | Jabil | power_delivery | Commercial and Industrial Electric Products supply | 3.0 | No |
| Gudeng Precision Rg | TSMC | semiconductor_equipment | Semiconductor Manufacturing Capital Equipment supply | 3.0 | No |
| NVIDIA | Super Micro Computer, Inc. | other | Computer Systems procurement | 3.0 | No |
| NVIDIA | Samsung | other | General Computer Hardware procurement | 3.0 | No |
| Dream Global Real Estate Investment Trust | Alphabet | other | Equity REITs supply | 3.0 | No |
| Gudeng Precision Rg | Intel | semiconductor_equipment | Semiconductor Manufacturing Capital Equipment supply | 3.0 | No |
| Shinko | Intel | substrates | Interconnect Electronic Components supply | 3.0 | No |
| Wuxi Unicomp Technology | Eaton | semiconductor_equipment | Electronics Manufacturing Equipment supply | 3.0 | No |
| Celestica | HPE | advanced_packaging | Contract Electronic Manufacturing supply | 3.0 | No |
| Celestica | Meta Platforms, Inc. | advanced_packaging | Contract Electronic Manufacturing supply | 3.0 | No |
| Cadence | SMIC | foundry_services | Semiconductor Manufacturing Services procurement | 3.0 | No |
| Cadence | Faraday Technology | gpu_accelerator | Programmable Logic and ASIC Semiconductors procurement | 3.0 | No |
| NetApp | Alphabet | memory | Data Storage Hardware supply | 3.0 | No |
| Celestica | Amazon.com, Inc. | advanced_packaging | Contract Electronic Manufacturing supply | 3.0 | No |
| Nokia | Samsung | networking | Other Communications Equipment supply | 3.0 | No |
| Celestica | Applied Materials | advanced_packaging | Contract Electronic Manufacturing supply | 3.0 | No |
| Cadence | Tower Semiconductor | foundry_services | Semiconductor Manufacturing Services procurement | 3.0 | No |
| TES | Samsung | semiconductor_equipment | Semiconductor Manufacturing Capital Equipment supply | 3.0 | No |
| QuantumScape A | Corning | power_delivery | Commercial and Industrial Electric Products partnership | 3.0 | No |
| NetApp | NVIDIA | memory | Data Storage Hardware supply | 3.0 | No |
| Nokia | Lenovo Group | networking | Other Communications Equipment supply | 3.0 | No |
| Renesas | Tower Semiconductor | foundry_services | Semiconductor Manufacturing Services procurement | 3.0 | No |
| Vimeo, Inc. | Amazon.com, Inc. | other | Internet Hosting Services supply | 3.0 | No |
| Siemens Energy | Eaton | power_delivery | Power Generation and Support Products partnership | 3.0 | No |
| Zhuhai Bojay Electronics A | Amazon.com, Inc. | other | Industrial Machine Parts and Support Equipment supply | 3.0 | No |
| KEMET Corp. | Flex | raw_materials | Passive Electronic Components supply | 3.0 | No |
| KEMET Corp. | Jabil | raw_materials | Passive Electronic Components supply | 3.0 | No |
| Zhuhai Bojay Electronics A | Dell Technologies | other | Industrial Machine Parts and Support Equipment supply | 3.0 | No |
| Versum Materials | TSMC | raw_materials | Other Specialty/Performance Chemical Manufacturing supply | 3.0 | No |
| Zhuhai Bojay Electronics A | Foxconn | other | Industrial Machine Parts and Support Equipment supply | 3.0 | No |
| Versum Materials | Samsung | raw_materials | Other Specialty/Performance Chemical Manufacturing supply | 3.0 | No |
| Zhuhai Bojay Electronics A | Alphabet | other | Industrial Machine Parts and Support Equipment supply | 3.0 | No |
| Versum Materials | Intel | raw_materials | Other Specialty/Performance Chemical Manufacturing supply | 3.0 | No |
| Bloom Energy A | Oracle Corporation | power_delivery | Power Generation and Support Products supply | 3.0 | No |
| TES | SK Hynix | semiconductor_equipment | Semiconductor Manufacturing Capital Equipment supply | 3.0 | No |
| Wuxi Unicomp Technology | Emerson Electric | semiconductor_equipment | Electronics Manufacturing Equipment supply | 3.0 | No |
| Fibocom Wireless H | MediaTek | other | Module and Subassembly Components partnership | 3.0 | No |
| Granite Real Estate | Amazon.com, Inc. | other | Equity REITs supply | 3.0 | No |
| Fibocom Wireless H | Qualcomm Inc | other | Module and Subassembly Components partnership | 3.0 | No |
| Shenzhen Fenda Technology A | Amazon.com, Inc. | other | Audio Electronics Manufacturing supply | 3.0 | No |
| Genesys | Microsoft Corporation | software_ip | Design and Engineering Software supply | 3.0 | No |
| WinMate | Texas Instruments | other | Computer Systems partnership | 3.0 | No |
| SK Hynix | Penguin Solutions | other | Module and Subassembly Components procurement | 3.0 | No |
| Genesem | Samsung | semiconductor_equipment | Semiconductor Manufacturing Capital Equipment supply | 3.0 | No |
| Hana Micron | Samsung | foundry_services | Semiconductor Manufacturing Services supply | 3.0 | No |
| Frasers Commercial Trust | Microsoft Corporation | other | Equity REITs supply | 3.0 | No |
| WinMate | Microsoft Corporation | other | Computer Systems supply | 3.0 | No |
| Cohu | STMicroelectronics | semiconductor_equipment | Semiconductor Manufacturing Capital Equipment supply | 3.0 | No |
| Cisco | CDW | other | IT Hardware Distributors procurement | 3.0 | No |
| Foxconn | Apple | advanced_packaging | Contract Electronic Manufacturing supply | 3.0 | No |
| Cray, Inc. | Dell Technologies | other | Computer Systems supply | 3.0 | No |
| Plug Power | Amazon.com, Inc. | power_delivery | Power Generation and Support Products supply | 3.0 | No |
| FormFactor | Advantest | semiconductor_equipment | Semiconductor Manufacturing Capital Equipment partnership | 3.0 | No |
| Cray, Inc. | HPE | other | Computer Systems supply | 3.0 | No |
| Hygon Information Technology Co., Ltd. | Lenovo Group | gpu_accelerator | Processor Semiconductors supply | 3.0 | No |
| Rohm | Vitesco Technologies Group AG | other | Consumer Vehicle Parts Manufacturing procurement | 3.0 | No |
| First Solar | Apple | power_delivery | Power Generation and Support Products supply | 3.0 | No |
| NXP | Visteon | other | Consumer Vehicle Parts Manufacturing procurement | 3.0 | No |
| Finisar Corp. | Alphabet | other | Optoelectronics Electronic Components supply | 3.0 | No |
| Atomera | STMicroelectronics | raw_materials | Other Specialty/Performance Chemical Manufacturing supply | 3.0 | No |
| NXP | Samsung | other | General Computer Hardware procurement | 3.0 | No |
| Arashi Vision A | Apple | other | Photography Equipment supply | 3.0 | No |
| SMIC | Himax Technologies ADR | other | Analog and Mixed Signal Semiconductors procurement | 3.0 | No |
| FADU | SK Hynix | other | Module and Subassembly Components supply | 3.0 | No |
| NXP | Apple | other | Analog and Mixed Signal Semiconductors supply | 3.0 | No |
| Corsair Gaming | AMD | other | Module and Subassembly Components partnership | 3.0 | No |
| SMIC | Cypress Technology | gpu_accelerator | Processor Semiconductors procurement | 3.0 | No |
| Sony Group | Apple | other | General Computer Hardware supply | 3.0 | No |
| Egis Technology | Lenovo Group | gpu_accelerator | Specialized Semiconductors supply | 3.0 | No |
| Enphase Energy | Flex | other | Module and Subassembly Components partnership | 3.0 | No |
| ENGIE | Alphabet | power_delivery | Other Electric and Natural Gas Utilities supply | 3.0 | No |
| Micron | ELKO Grupa AS | other | Electronics Distributors procurement | 3.0 | No |
| Hassan Allam Holding | Samsung | construction | Engineering & Construction supply | 3.0 | No |
| ironSource Ltd. | Alphabet | software_ip | Design and Engineering Software supply | 3.0 | No |
| ironSource Ltd. | Meta Platforms, Inc. | software_ip | Design and Engineering Software supply | 3.0 | No |
| NXP | Aumovio | other | Consumer Vehicle Parts Manufacturing procurement | 3.0 | No |
| ironSource Ltd. | Samsung | software_ip | Design and Engineering Software supply | 3.0 | No |
| SMIC | Silicon Laboratories | gpu_accelerator | Processor Semiconductors procurement | 3.0 | No |
| Sondrel (Holdings) Plc | Samsung | gpu_accelerator | Programmable Logic and ASIC Semiconductors supply | 3.0 | No |
| ASE Technology Holding | Qualcomm Inc | gpu_accelerator | Specialized Semiconductors procurement | 3.0 | No |
| FormFactor | TSMC | semiconductor_equipment | Semiconductor Manufacturing Capital Equipment supply | 3.0 | No |
| Corsair Components, Inc. | Lenovo Group | other | Computer Peripherals supply | 3.0 | No |
| Cisco | TD SYNNEX Corp | other | IT Hardware Distributors procurement | 3.0 | No |
| Foxconn | Cisco | advanced_packaging | Contract Electronic Manufacturing supply | 3.0 | No |
| STMicroelectronics | Robert Bosch GmbH | other | Consumer Vehicle Parts Manufacturing procurement | 3.0 | No |
| LightOn | HPE | software_ip | Design and Engineering Software supply | 3.0 | No |
| Mirgor C | Samsung | advanced_packaging | Contract Electronic Manufacturing supply | 3.0 | No |
| GlobalFoundries | MediaTek | gpu_accelerator | Specialized Semiconductors procurement | 3.0 | No |
| Cisco | Insight Enterprises | other | IT Hardware Distributors procurement | 3.0 | No |
| CTCI | Microsoft Corporation | construction | Infrastructure Construction/Contracting Services supply | 3.0 | No |
| KEMET Corp. | Dell Technologies | raw_materials | Passive Electronic Components supply | 3.0 | No |
| Wuxi Unicomp Technology | Foxconn | semiconductor_equipment | Electronics Manufacturing Equipment supply | 3.0 | No |
| Calnex Solutions | NVIDIA | semiconductor_equipment | Test and Measurement Equipment supply | 3.0 | No |
| Calnex Solutions | Qualcomm Inc | semiconductor_equipment | Test and Measurement Equipment supply | 3.0 | No |
| Corning | Apple | raw_materials | Nonmetallic Minerals Products supply | 3.0 | No |
| Gitlab A | Amazon.com, Inc. | software_ip | Design and Engineering Software supply | 3.0 | No |
| Innovation New Material Technology | Apple | raw_materials | Primary Metals Products supply | 3.0 | No |
| Acacia Communications, Inc. | Cisco | other | Optoelectronics Electronic Components supply | 3.0 | No |
| Calnex Solutions | Intel | semiconductor_equipment | Test and Measurement Equipment supply | 3.0 | No |
| Sondrel (Holdings) Plc | ARM | gpu_accelerator | Programmable Logic and ASIC Semiconductors partnership | 3.0 | No |
| Calnex Solutions | Meta Platforms, Inc. | semiconductor_equipment | Test and Measurement Equipment supply | 3.0 | No |
| Napatech | AMD | networking | Local Area Networking Equipment supply | 3.0 | No |
| Beamr Imaging | NVIDIA | software_ip | Design and Engineering Software supply | 3.0 | No |
| Samsung | LM Ericsson B | networking | Other Communications Equipment procurement | 3.0 | No |
| Versum Materials | SK Hynix | raw_materials | Other Specialty/Performance Chemical Manufacturing supply | 3.0 | No |
| QLogic LLC | Lenovo Group | memory | Data Storage Hardware supply | 3.0 | No |
| NuFlare Technology, Inc. | Samsung | semiconductor_equipment | Semiconductor Manufacturing Capital Equipment supply | 3.0 | No |
| QLogic LLC | Cisco | memory | Data Storage Hardware supply | 3.0 | No |
| AT & S Austria Tech | Apple | substrates | Interconnect Fabrication supply | 3.0 | No |
| QLogic LLC | Dell Technologies | memory | Data Storage Hardware supply | 3.0 | No |
| Siemens EDA | SMIC | other | Other Machinery Manufacturing supply | 3.0 | No |
| Zhuhai Bojay Electronics A | Cisco | other | Industrial Machine Parts and Support Equipment supply | 3.0 | No |
| Plantronics, Inc. | Alphabet | networking | Business Communications Equipment supply | 3.0 | No |
| QLogic LLC | HPE | memory | Data Storage Hardware supply | 3.0 | No |
| KEMET Corp. | Western Digital | raw_materials | Passive Electronic Components supply | 3.0 | No |
| CCP Contact Probes | Microsoft Corporation | substrates | Interconnect Electronic Components supply | 3.0 | No |
| CCP Contact Probes | Western Digital | substrates | Interconnect Electronic Components supply | 3.0 | No |
| Siemens EDA | TSMC | other | Other Machinery Manufacturing supply | 3.0 | No |
| Nokia | Microsoft Corporation | networking | Other Communications Equipment supply | 3.0 | No |
| Siemens EDA | NVIDIA | other | Other Machinery Manufacturing partnership | 3.0 | No |
| CCP Contact Probes | Advantest | substrates | Interconnect Electronic Components supply | 3.0 | No |
| Inzi Display | Samsung | advanced_packaging | Contract Electronic Manufacturing supply | 3.0 | No |
| Nokia | Alphabet | networking | Other Communications Equipment supply | 3.0 | No |
| Nokia | Amazon.com, Inc. | networking | Other Communications Equipment supply | 3.0 | No |
| Celestica | Alphabet | advanced_packaging | Contract Electronic Manufacturing supply | 3.0 | No |
| AT & S Austria Tech | AMD | substrates | Interconnect Fabrication supply | 3.0 | No |
| CCP Contact Probes | Flex | substrates | Interconnect Electronic Components supply | 3.0 | No |
| Flex | SolarEdge Technologies | other | Module and Subassembly Components procurement | 3.0 | No |
| Cadence | Global Unichip | gpu_accelerator | Programmable Logic and ASIC Semiconductors procurement | 3.0 | No |
| Soulbrain | SK Hynix | raw_materials | Other Specialty/Performance Chemical Manufacturing supply | 3.0 | No |
| Liberty Property Trust | Amazon.com, Inc. | other | Equity REITs supply | 3.0 | No |
| A10 Networks | Microsoft Corporation | networking | Wide Area Networking Equipment supply | 3.0 | No |
| CCP Contact Probes | Foxconn | substrates | Interconnect Electronic Components supply | 3.0 | No |
| Harman International Industries, Inc. | Microsoft Corporation | other | Automotive and Marine Electronics Manufacturing supply | 3.0 | No |
| Xerox Holdings | Flex | other | Computer Peripherals partnership | 3.0 | No |
| Rambus | STMicroelectronics | software_ip | Design and Engineering Software supply | 3.0 | No |
| Taiwan Microloops | Intel | raw_materials | Passive Electronic Components supply | 3.0 | No |
| Rambus | Infineon Technologies | software_ip | Design and Engineering Software supply | 3.0 | No |
| Netlist | SK Hynix | other | Other IT Distributors supply | 3.0 | No |
| Yubico | Alphabet | other | Electronic Security Equipment supply | 3.0 | No |
| Net Insight B | Microsoft Corporation | networking | Cable Equipment supply | 3.0 | No |
| Luminar Tech A | NVIDIA | other | Consumer Vehicle Parts Manufacturing supply | 3.0 | No |
| Rambus | Samsung | software_ip | Design and Engineering Software supply | 3.0 | No |
| Rambus | MediaTek | software_ip | Design and Engineering Software supply | 3.0 | No |
| Penguin Solutions | Dell Technologies | other | Module and Subassembly Components partnership | 3.0 | No |
| Rambus | NVIDIA | software_ip | Design and Engineering Software supply | 3.0 | No |
| Rambus | Qualcomm Inc | software_ip | Design and Engineering Software supply | 3.0 | No |
| Daewon CTS Co., Ltd. | Microsoft Corporation | other | Electronics Distributors supply | 3.0 | No |
| Spel Semiconductor | Renesas | foundry_services | Semiconductor Manufacturing Services supply | 3.0 | No |
| Lens Technology H | Apple | raw_materials | Nonmetallic Minerals Products supply | 3.0 | No |
| Scanfil | Emerson Electric | advanced_packaging | Contract Electronic Manufacturing supply | 3.0 | No |
| Shinko | Lam Research | substrates | Interconnect Electronic Components supply | 3.0 | No |
| FIT Hon Teng | MediaTek | substrates | Interconnect Electronic Components partnership | 3.0 | No |
| FEI Co. | Applied Materials | semiconductor_equipment | Scientific Products supply | 3.0 | No |
| Rambus | Broadcom Inc. | software_ip | Design and Engineering Software supply | 3.0 | No |