Supply Chain
Supplier–customer relationships between named firms, and the layers with only one supplier.
Supplier–customer relationships between named firms, and the layers with only one supplier.
single-source dependencies drawn — every relationship in the substrate for which no second supplier is recorded, one mark each. 8 companies are the sole source across all of them; Taiwan holds 20.
companies exposed — the distinct dependent parties across those 54 marks.
companies in the relationship substrate, across 72 countries. A count of companies, not of relationships — the 54 marks above are drawn against the 14,950 relationships, which is their denominator.
The single-source dependency field. Each mark in the strands is one relationship the substrate records as sole-source: a named supplier, a named customer, a named input, and no second supplier on file. Columns are the supplier’s home jurisdiction — the side that carries the leverage, since whoever can withhold sits under one government’s authority — and within a column marks group by the supplier itself, most critical highest. Mark form encodes the assessed criticality score, which on this set occupies only 8 to 10 of the substrate’s 1–10 scale, so the three forms are the three values present rather than thirds of the range; a struck amber mark is a relationship the substrate records as ended. The band beneath draws the same 54 at one cell each, inked at the head of every other relationship in the substrate, so the reader sees them against 14,950 rather than floating free. The honest limit is the one that matters most: an absent second source in this substrate is not evidence that no second source exists in the world — it is evidence that Scrutica has not recorded one.
The substrate holds 14,950 bilateral supplier–customer relationships between 5,085 named companies across 72 countries — licensed supply-chain pulls, SEC EDGAR and public-registry re-derivations, and CSET entity classification. Of those, 54 record no alternative supplier at all. They trace back to 8 companies in 5 jurisdictions, and 26 companies sit on the receiving end of one. 4 of the 54 are already severed — the substrate records an end date, and in each case an export-control action or an entity designation is what ended it. How the graph is assembled
This page carries two numbers that both sound like “links”, and they answer different questions. 18,999 is the count of ROWS in the relationship table — every observation as filed, one row per source statement. 14,950 is the count of RELATIONSHIPS — what remains after rows recording an unnamed counterparty are set aside and every surviving row is collapsed onto its canonical supplier, canonical customer, and product or service, so two sources reporting the same relationship count once.
Every figure on this sheet is drawn against the relationship count. The row count appears here and in the export metadata, where it is named as rows. Their difference is deliberately not published as a quantity, because it is not one: three unrelated operations — the aggregate exclusion, the canonical-identity merge, and the duplicate collapse — land in the same arithmetic step, and a single subtraction would invite a reading none of them supports.
Search by company; filter by country, category, or relationship type; export the propagation-relevant subgraph. The interactive canvas draws the public-provenance subset the register beneath it enumerates — licensed relationships are counted in the denominators above and are not redistributed here.
| Supplier | Customer | Category | Product / service | Fiscal year | Criticality | Sole source |
|---|---|---|---|---|---|---|
| TSMC | NVIDIA | advanced_packaging | CoWoS-S advanced packaging — integrating GH100 compute die with HBM3 stacks | — | 10.0 | Yes |
| TSMC | NVIDIA | advanced_packaging | CoWoS-S advanced packaging | — | 10.0 | Yes |
| TSMC | NVIDIA | foundry_services | Foundry services — GH100 die at N5 process node | — | 10.0 | Yes |
| TSMC | Alphabet | foundry_services | Foundry manufacturing of TPU v5e silicon (process node unverified) | — | 10.0 | Yes |
| TSMC | NVIDIA | foundry_services | GH100 die at N5 foundry | — | 10.0 | Yes |
| TSMC | Biren Technology | foundry_services | Foundry services — Biren BR100 at TSMC N7 (TERMINATED Oct 2023) | — | 10.0 | Yes |
| Ajinomoto Co., Inc. | Shinko Electric | substrates | Ajinomoto Build-up Film (ABF) substrate material for FC-BGA packages | — | 10.0 | Yes |
| TSMC | NVIDIA | advanced_packaging | CoWoS-S advanced packaging | — | 10.0 | Yes |
| Ajinomoto Co., Inc. | Ibiden | substrates | Ajinomoto Build-up Film (ABF) substrate material for FC-BGA packages | — | 10.0 | Yes |
| TSMC | Apple | foundry_services | Foundry manufacturing of Apple silicon (A-series, M-series processors) at N3/N4 process nodes | — | 10.0 | Yes |
| TSMC | Moore Threads | foundry_services | Foundry services — Moore Threads Chunxiao GPU (in MTT S80) at TSMC N7 (TERMINATED Oct 2023) | — | 10.0 | Yes |
| TSMC | NVIDIA | foundry_services | Foundry services — NVIDIA H100 GH100 die at N5 (5nm) process node | — | 10.0 | Yes |
| ASML | TSMC | semiconductor_equipment | EUV lithography systems (TWINSCAN NXE/EXE series) for N5 process node patterning | — | 10.0 | Yes |
| ASML | TSMC | semiconductor_equipment | EUV lithography systems | — | 10.0 | Yes |
| ASML | TSMC | semiconductor_equipment | EUV lithography systems | — | 10.0 | Yes |
| Ajinomoto Co., Inc. | TSMC | substrates | ABF substrate material for CoWoS and InFO advanced packaging | — | 10.0 | Yes |
| TSMC | HiSilicon | foundry_services | Foundry services — HiSilicon Kirin/Ascend 910 at TSMC N7/N5 (TERMINATED May 2020) | — | 10.0 | Yes |
| TSMC | NVIDIA | foundry_services | Foundry services — GH100 die at N5 (5nm) process node (H200 reuses H100 compute die with upgraded HBM3e) | — | 10.0 | Yes |
| TSMC | NVIDIA | advanced_packaging | CoWoS-S advanced packaging for H200 SXM (larger interposer than H100 to accommodate 141GB HBM3e) | — | 10.0 | Yes |
| NVIDIA | Microsoft Corporation | gpu_accelerator | NVIDIA H100 SXM5 80GB GPU accelerators | — | 10.0 | Yes |
| TSMC | Alphabet | foundry_services | Foundry manufacturing of TPU v5p silicon on TSMC N5 | — | 10.0 | Yes |
| Ajinomoto Co., Inc. | Unimicron | substrates | Ajinomoto Build-up Film (ABF) substrate material for FC-BGA packages | — | 10.0 | Yes |
| NVIDIA | xAI | gpu_accelerator | NVIDIA H100 SXM5 80GB GPU accelerators | — | 10.0 | Yes |
| ASML | TSMC | semiconductor_equipment | EUV lithography systems for N5 patterning | — | 10.0 | Yes |
| NVIDIA | Oracle Corporation | gpu_accelerator | NVIDIA H100 SXM5 80GB GPU accelerators for OCI Supercluster | — | 10.0 | Yes |
| Ajinomoto Co., Inc. | Intel | substrates | ABF substrate material for EMIB and Foveros packaging | — | 10.0 | Yes |
| Ajinomoto Co., Inc. | Samsung | substrates | ABF substrate material for I-Cube packaging | — | 10.0 | Yes |
| ASML | TSMC | semiconductor_equipment | EUV lithography systems for N5 | — | 10.0 | Yes |
| TSMC | Alphabet | foundry_services | Foundry manufacturing of TPU v6e (Trillium) on TSMC N5 | — | 10.0 | Yes |
| ASML | TSMC | semiconductor_equipment | EUV lithography systems | — | 10.0 | Yes |
| SMIC | HiSilicon | foundry_services | Foundry services — HiSilicon Ascend 910B at SMIC N+2 (~7nm DUV) | — | 10.0 | Yes |
| TSMC | NVIDIA | advanced_packaging | CoWoS-S advanced packaging | — | 10.0 | Yes |
| NVIDIA | Amazon.com, Inc. | gpu_accelerator | NVIDIA H100 SXM5 80GB GPU accelerators for EC2 P5 instances | — | 10.0 | Yes |
| Ajinomoto Co., Inc. | Amkor | substrates | ABF substrate material for FOWLP | — | 10.0 | Yes |
| ASML | TSMC | semiconductor_equipment | EUV lithography systems for N5 | — | 10.0 | Yes |
| NVIDIA | NVIDIA Corporation / CoreWeave | gpu_accelerator | NVIDIA H100 SXM5 80GB GPU accelerators — Eos supercomputer deployment | — | 10.0 | Yes |
| TSMC | NVIDIA | foundry_services | GH100 die at N5 foundry | — | 10.0 | Yes |
| TSMC | NVIDIA | advanced_packaging | CoWoS-S advanced packaging | — | 10.0 | Yes |
| ASML | SMIC | semiconductor_equipment | DUV ArF immersion lithography (NXT:2000i). EUV blocked by Dutch export controls. | — | 10.0 | Yes |
| NVIDIA | CoreWeave | gpu_accelerator | NVIDIA H200 SXM GPU accelerators | — | 10.0 | Yes |
| TSMC | Alibaba | foundry_services | 5nm foundry manufacturing for Yitian 710 server CPU (T-Head design) | — | 10.0 | Yes |
| TSMC | NVIDIA | foundry_services | Foundry services — GH100 die at N5 (5nm) process node | — | 10.0 | Yes |
| TSMC | Alphabet | foundry_services | Foundry manufacturing of TPU v4 silicon (process node unverified) | — | 10.0 | Yes |
| AMD | Hygon Information Technology Co., Ltd. | other | AMD Zen x86 architecture license via TISC JV (TERMINATED June 2019) | — | 10.0 | Yes |
| TSMC | NVIDIA | advanced_packaging | CoWoS-S advanced packaging | — | 10.0 | Yes |
| NVIDIA | Meta Platforms, Inc. | gpu_accelerator | NVIDIA H100 SXM5 80GB GPU accelerators — 100,000 unit deployment | — | 10.0 | Yes |
| TSMC | NVIDIA | foundry_services | Foundry services — GH100 die at N5 process node | — | 10.0 | Yes |
| NVIDIA | Meta Platforms, Inc. | gpu_accelerator | NVIDIA A100 GPU accelerators (SXM4 and PCIe variants) | — | 9.0 | Yes |
| GlobalFoundries | Enflame Technology (Suiyuan) | foundry_services | Foundry services — Enflame CloudBlazer DTU at GlobalFoundries 12LP FinFET | FY2019 | 9.0 | Yes |
| SMIC | Huawei Technologies | foundry_services | Foundry for Kirin/Ascend chips at N+2 (7nm-class DUV) | — | 9.0 | Yes |
| TSMC | Alphabet | advanced_packaging | CoWoS advanced packaging for TPU v5p/v6e with HBM stacks | — | 9.0 | Yes |
| TSMC | Iluvatar CoreX | foundry_services | Foundry services — Iluvatar CoreX TianGai-100 7nm GPGPU (first domestic 7nm GPGPU, released Jan 2021; foundry unverified but TSMC inferred from process node) | — | 9.0 | Yes |
| Alphabet | Alphabet | networking | ICI (Inter-Chip Interconnect) networking for TPU v5p pods | — | 9.0 | Yes |
| Alphabet | Alphabet | networking | Inter-Chip Interconnect (ICI) — Google's custom optical/electrical TPU pod network | — | 9.0 | Yes |
| TSMC | NVIDIA | foundry_services | Foundry services — GA100 die at N7 (7nm) process node | — | 9.0 | Yes |
| NVIDIA | NVIDIA Corporation / CoreWeave | networking | InfiniBand NDR switching and networking — NVIDIA Quantum-2 InfiniBand | — | 8.0 | Yes |
| Alphabet | Alphabet | gpu_accelerator | Google TPU v4 ASIC — custom AI accelerator designed and deployed by Google | — | 8.0 | Yes |
| Alphabet | Alphabet | gpu_accelerator | Google TPU v5p ASIC | — | 8.0 | Yes |
| NVIDIA | xAI | networking | InfiniBand HDR/NDR networking — NVLink switch fabric for H100 SXM5 inter-GPU interconnect | — | 8.0 | Yes |
| NVIDIA | Microsoft Corporation | networking | InfiniBand NDR interconnect for Azure Eagle cluster fabric | — | 8.0 | Yes |
| NVIDIA | CoreWeave | networking | InfiniBand NDR networking — CoreWeave GPU-native cloud fabric | — | 8.0 | Yes |
| NVIDIA | Amazon.com, Inc. | networking | Elastic Fabric Adapter (EFA) over InfiniBand NDR — P5 instance networking | — | 8.0 | Yes |
| NVIDIA | Meta Platforms, Inc. | networking | InfiniBand HDR (200 Gb/s) cluster networking for RSC | — | 8.0 | Yes |
| Broadcom Inc. | WT Microelectronics | networking | SEC >10% customer disclosure | FY2025 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2021 | — | No |
| Broadcom Inc. | WT Microelectronics | networking | SEC segment disclosure: BROADCOM INC → WT MICROELECTRONICS CO LTD | FY2024 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2020 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2019 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2022 | — | No |
| UNITED PARCEL SERVICE INC | Amazon.com, Inc. | other | SEC segment disclosure: UNITED PARCEL SERVICE INC → AMAZON.COM INC | FY2021 | — | No |
| UNITED PARCEL SERVICE INC | Amazon.com, Inc. | other | SEC segment disclosure: UNITED PARCEL SERVICE INC → AMAZON.COM INC | FY2022 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2018 | — | No |
| UNITED PARCEL SERVICE INC | Amazon.com, Inc. | other | SEC segment disclosure: UNITED PARCEL SERVICE INC → AMAZON.COM INC | FY2020 | — | No |
| UNITED PARCEL SERVICE INC | Amazon.com, Inc. | other | SEC segment disclosure: UNITED PARCEL SERVICE INC → AMAZON.COM INC | FY2024 | — | No |
| UNITED PARCEL SERVICE INC | Amazon.com, Inc. | other | SEC segment disclosure: UNITED PARCEL SERVICE INC → AMAZON.COM INC | FY2023 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2023 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2011 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2024 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2014 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC >10% customer disclosure | FY2025 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2017 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2012 | — | No |
| Intel | Lenovo Group | gpu_accelerator | SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD | FY2021 | — | No |
| Intel | Lenovo Group | gpu_accelerator | SEC >10% customer disclosure | FY2019 | — | No |
| Intel | Lenovo Group | gpu_accelerator | SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD | FY2020 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2010 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2013 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2014 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2016 | — | No |
| UNITED PARCEL SERVICE INC | Amazon.com, Inc. | other | SEC segment disclosure: UNITED PARCEL SERVICE INC → AMAZON.COM INC | FY2019 | — | No |
| Intel | Lenovo Group | gpu_accelerator | SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD | FY2018 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2015 | — | No |
| Intel | Lenovo Group | gpu_accelerator | SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD | FY2017 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2011 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2019 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2013 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2021 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2018 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2020 | — | No |
| Intel | Lenovo Group | gpu_accelerator | SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD | FY2022 | — | No |
| Broadcom Inc. | WT Microelectronics | networking | SEC segment disclosure: BROADCOM INC → WT MICROELECTRONICS CO LTD | FY2023 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2008 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2012 | — | No |
| Intel | Lenovo Group | gpu_accelerator | SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD | FY2024 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2010 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2009 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2005 | — | No |
| Intel | Lenovo Group | gpu_accelerator | SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD | FY2015 | — | No |
| Broadcom Inc. | Apple | networking | SEC segment disclosure: BROADCOM INC → APPLE INC | FY2023 | — | No |
| TD SYNNEX Corp | Apple | other | SEC segment disclosure: TD SYNNEX CORP → APPLE INC | FY2024 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2022 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2017 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2007 | — | No |
| TD SYNNEX Corp | Apple | other | SEC segment disclosure: TD SYNNEX CORPORATION → APPLE INC | FY2022 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2008 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2006 | — | No |
| Intel | Lenovo Group | gpu_accelerator | SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD | FY2014 | — | No |
| Broadcom Inc. | Apple | networking | SEC segment disclosure: BROADCOM INC → APPLE INC | FY2022 | — | No |
| Broadcom Inc. | WT Microelectronics | networking | SEC segment disclosure: BROADCOM INC → WT MICROELECTRONICS CO LTD | FY2022 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2007 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2004 | — | No |
| Jabil | Apple | other | SEC segment disclosure: JABIL INC → APPLE INC | FY2021 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2024 | — | No |
| Jabil | Apple | other | SEC segment disclosure: JABIL INC → APPLE INC | FY2022 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC >10% customer disclosure | FY2025 | — | No |
| Intel | Lenovo Group | gpu_accelerator | SEC >10% customer disclosure | FY2025 | — | No |
| TD SYNNEX Corp | Apple | other | SEC segment disclosure: TD SYNNEX CORPORATION → APPLE INC | FY2023 | — | No |
| Intel | Lenovo Group | gpu_accelerator | SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD | FY2013 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2005 | — | No |
| Jabil | Apple | other | SEC segment disclosure: JABIL INC → APPLE INC | FY2018 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2009 | — | No |
| Intel | Lenovo Group | gpu_accelerator | SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD | FY2023 | — | No |
| Tech Data Corp. | Apple | other | SEC segment disclosure: TECH DATA CORP → APPLE INC | FY2019 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2016 | — | No |
| Jabil | Apple | other | SEC segment disclosure: JABIL INC → APPLE INC | FY2023 | — | No |
| Intel | Lenovo Group | gpu_accelerator | SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD | FY2012 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2003 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2006 | — | No |
| Jabil | Apple | other | SEC segment disclosure: JABIL INC → APPLE INC | FY2019 | — | No |
| Broadcom Inc. | Apple | networking | SEC segment disclosure: BROADCOM INC → APPLE INC | FY2021 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2004 | — | No |
| Jabil | Apple | other | SEC segment disclosure: JABIL INC → APPLE INC | FY2020 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2023 | — | No |
| Micron | HP Inc | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC | FY2006 | — | No |
| Broadcom Inc. | Apple | networking | SEC segment disclosure: BROADCOM INC → APPLE INC | FY2018 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2022 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC >10% customer disclosure | FY2022 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC >10% customer disclosure | FY2023 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2023 | — | No |
| Broadcom Inc. | WT Microelectronics | networking | SEC segment disclosure: BROADCOM INC → WT MICROELECTRONICS CO LTD | FY2021 | — | No |
| Microsoft Corporation | Dell Technologies | software_ip | SEC segment disclosure: MICROSOFT CORP → DELL TECHNOLOGIES INC | FY2006 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD | FY2021 | — | No |
| Jabil | Apple | other | SEC segment disclosure: JABIL INC → APPLE INC | FY2017 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2003 | — | No |
| Broadcom Inc. | Apple | networking | SEC segment disclosure: BROADCOM INC → APPLE INC | FY2019 | — | No |
| Samsung | Qualcomm Inc | other | General Computer Hardware supply | — | 8.0 | No |
| Qualcomm Inc | Samsung | other | General Computer Hardware procurement | — | 8.0 | No |
| Qualcomm Inc | Xiaomi Corporation | networking | Wireless Mobile Equipment procurement | — | 4.0 | No |
| Qualcomm Inc | Apple | gpu_accelerator | Specialized Semiconductors supply | — | 3.0 | No |
| Jabil | Apple | other | SEC segment disclosure: JABIL INC → APPLE INC | FY2016 | — | No |
| Intel | COMPAQ COMPUTER CORP | gpu_accelerator | SEC segment disclosure: INTEL CORP → COMPAQ COMPUTER CORP | FY2000 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2000 | — | No |
| Jabil | Apple | other | SEC segment disclosure: JABIL INC → APPLE INC | FY2015 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2002 | — | No |
| Tech Data Corp. | Cisco | other | SEC segment disclosure: TECH DATA CORP → CISCO SYSTEMS INC | FY2019 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2002 | — | No |
| Microsoft Corporation | Dell Technologies | software_ip | SEC segment disclosure: MICROSOFT CORP → DELL TECHNOLOGIES INC | FY2005 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC >10% customer disclosure | FY2023 | — | No |
| Broadcom Inc. | WT Microelectronics | networking | SEC segment disclosure: BROADCOM INC → WT MICROELECTRONICS CO LTD | FY2019 | — | No |
| Intel | COMPAQ COMPUTER CORP | gpu_accelerator | SEC segment disclosure: INTEL CORP → COMPAQ COMPUTER CORP | FY1999 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY1999 | — | No |
| Micron | Kingston Technology Company, Inc. | memory | SEC >10% customer disclosure | FY2022 | — | No |
| Microsoft Corporation | Dell Technologies | software_ip | SEC segment disclosure: MICROSOFT CORP → DELL TECHNOLOGIES INC | FY2004 | — | No |
| Jabil | Amazon.com, Inc. | other | SEC segment disclosure: JABIL INC → AMAZON.COM INC | FY2022 | — | No |
| Micron | WPG Holding | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → WPG HOLDINGS | FY2021 | — | No |
| Broadcom Inc. | Apple | networking | SEC segment disclosure: BROADCOM INC → APPLE INC | FY2020 | — | No |
| Broadcom Inc. | Apple | networking | SEC segment disclosure: BROADCOM INC → APPLE INC | FY2013 | — | No |
| Jabil | Apple | other | SEC segment disclosure: JABIL INC → APPLE INC | FY2013 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC >10% customer disclosure | FY2021 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2021 | — | No |
| Sharp | Apple | other | SEC segment disclosure: SHARP CORP → APPLE INC | FY2013 | — | No |
| Micron | WPG Holding | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → WPG HOLDINGS | FY2022 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD | FY2017 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD | FY2024 | — | No |
| Skyworks Solutions | Apple | other | SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC | FY2022 | — | No |
| Jabil | Apple | other | SEC segment disclosure: JABIL INC → APPLE INC | FY2024 | — | No |
| Skyworks Solutions | Apple | other | SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC | FY2023 | — | No |
| Broadcom Inc. | WT Microelectronics | networking | SEC segment disclosure: BROADCOM INC → WT MICROELECTRONICS CO LTD | FY2020 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC >10% customer disclosure | FY2020 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD | FY2020 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2020 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD | FY2022 | — | No |
| Skyworks Solutions | Apple | other | SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC | FY2021 | — | No |
| Intel | COMPAQ COMPUTER CORP | gpu_accelerator | SEC segment disclosure: INTEL CORP → COMPAQ COMPUTER CORP | FY1997 | — | No |
| Jabil | Amazon.com, Inc. | other | SEC segment disclosure: JABIL INC → AMAZON.COM INC | FY2020 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2024 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC >10% customer disclosure | FY2024 | — | No |
| Skyworks Solutions | Apple | other | SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC | FY2024 | — | No |
| Jabil | Apple | other | SEC segment disclosure: JABIL INC → APPLE INC | FY2014 | — | No |
| NXP | Avnet | other | Other IT Distributors procurement | — | 8.0 | No |
| Micron | Huawei Technologies | memory | SEC >10% customer disclosure | FY2019 | — | No |
| NXP Semiconductors NV | Avnet | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC | FY2023 | — | No |
| NXP Semiconductors NV | Avnet | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC | FY2024 | — | No |
| Skyworks Solutions | Apple | other | Analog and Mixed Signal Semiconductors supply | — | 8.0 | No |
| Skyworks Solutions | Apple | other | SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC | FY2025 | — | No |
| STMicroelectronics | Apple | other | SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC | FY2022 | — | No |
| NXP Semiconductors NV | Avnet | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC | FY2022 | — | No |
| STMicroelectronics | Apple | other | SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC | FY2021 | — | No |
| Applied Materials | Intel | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP | FY2022 | — | No |
| Micron | Kingston Technology Company, Inc. | memory | SEC >10% customer disclosure | FY2019 | — | No |
| STMicroelectronics | Apple | other | SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC | FY2020 | — | No |
| Micron | Kingston Technology Company, Inc. | memory | SEC >10% customer disclosure | FY2020 | — | No |
| Arista Networks | Microsoft Corporation | networking | SEC >10% customer disclosure | FY2025 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD | FY2018 | — | No |
| Jabil | Apple | other | SEC segment disclosure: JABIL INC → APPLE INC | FY2012 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2017 | — | No |
| Jabil | Cisco | other | SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC | FY2011 | — | No |
| STMicroelectronics | Apple | other | SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC | FY2023 | — | No |
| NOV INC | Samsung Heavy Industries Co., Ltd. | other | SEC segment disclosure: NOV INC → SAMSUNG HEAVY INDUSTRIES CO | FY2010 | — | No |
| NOV INC | Samsung Heavy Industries Co., Ltd. | other | SEC segment disclosure: NOV INC → SAMSUNG HEAVY INDUSTRIES CO | FY2013 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC >10% customer disclosure | FY2019 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2019 | — | No |
| Jabil | Cisco | other | SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC | FY2008 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2013 | — | No |
| Jabil | Cisco | other | SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC | FY2010 | — | No |
| NOV INC | Samsung Heavy Industries Co., Ltd. | other | SEC segment disclosure: NOV INC → SAMSUNG HEAVY INDUSTRIES CO | FY2012 | — | No |
| Amkor | Apple | foundry_services | Semiconductor Manufacturing Services supply | — | 3.0 | No |
| NXP Semiconductors NV | Avnet | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC | FY2021 | — | No |
| Marvell Technology | Wintech Digital Systems Technology Corp | networking | SEC >10% customer disclosure | FY2025 | — | No |
| Amkor | Apple | other | SEC segment disclosure: AMKOR TECHNOLOGY INC → APPLE INC | FY2024 | — | No |
| STMicroelectronics | Apple | other | SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC | FY2024 | — | No |
| SK Hynix | Essencore Ltd. | other | Semiconductors procurement | — | 3.0 | No |
| Qualcomm Inc | Samsung | gpu_accelerator | SEC segment disclosure: QUALCOMM INC → SAMSUNG ELECTRONICS CO LTD | FY2012 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2014 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2018 | — | No |
| Applied Materials | Intel | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP | FY2018 | — | No |
| Qualcomm Inc | Samsung | gpu_accelerator | SEC segment disclosure: QUALCOMM INC → SAMSUNG ELECTRONICS CO LTD | FY2011 | — | No |
| Qualcomm Inc | HTC | gpu_accelerator | SEC segment disclosure: QUALCOMM INC → HTC CORPORATION | FY2011 | — | No |
| Skyworks Solutions | Apple | other | SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC | FY2020 | — | No |
| Broadcom Inc. | Foxconn | networking | SEC segment disclosure: BROADCOM INC → FOXCONN TECHNOLOGY CO LTD | FY2018 | — | No |
| Qualcomm Inc | LG Electronics | gpu_accelerator | SEC segment disclosure: QUALCOMM INC → LG ELECTRONICS INC | FY2009 | — | No |
| Jabil | Cisco | other | SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC | FY2007 | — | No |
| Micron | Intel | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP | FY2017 | — | No |
| Skyworks Solutions | Apple | other | SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC | FY2018 | — | No |
| Amkor | Apple | other | SEC segment disclosure: AMKOR TECHNOLOGY INC → APPLE INC | FY2023 | — | No |
| Qualcomm Inc | LG Electronics | gpu_accelerator | SEC segment disclosure: QUALCOMM INC → LG ELECTRONICS INC | FY2008 | — | No |
| Applied Materials | Intel | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP | FY2019 | — | No |
| Qorvo | Apple | other | SEC segment disclosure: QORVO INC → APPLE INC | FY2025 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD | FY2012 | — | No |
| Micron | Intel | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP | FY2016 | — | No |
| Qorvo | Apple | other | SEC segment disclosure: QORVO INC → APPLE INC | FY2024 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2016 | — | No |
| Skyworks Solutions | Apple | other | SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC | FY2019 | — | No |
| Jabil | Cisco | other | SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC | FY2012 | — | No |
| STMicroelectronics | Apple | other | Analog and Mixed Signal Semiconductors supply | — | 3.0 | No |
| Cirrus Logic | Apple | other | SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC | FY2025 | — | No |
| Cirrus Logic | Apple | other | Analog and Mixed Signal Semiconductors supply | — | 3.0 | No |
| STMicroelectronics | Apple | other | SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC | FY2019 | — | No |
| Qualcomm Inc | LG Electronics | gpu_accelerator | SEC segment disclosure: QUALCOMM INC → LG ELECTRONICS INC | FY2010 | — | No |
| Cirrus Logic | Apple | other | SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC | FY2023 | — | No |
| Qualcomm Inc | Samsung | gpu_accelerator | SEC segment disclosure: QUALCOMM INC → SAMSUNG ELECTRONICS CO LTD | FY2008 | — | No |
| Cirrus Logic | Apple | other | SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC | FY2024 | — | No |
| FIH Mobile | Foxconn | advanced_packaging | Contract Electronic Manufacturing supply | — | 8.0 | No |
| Qorvo | Apple | other | SEC segment disclosure: QORVO INC → APPLE INC | FY2022 | — | No |
| Jabil | Cisco | other | SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC | FY2009 | — | No |
| NOV INC | Samsung Heavy Industries Co., Ltd. | other | SEC segment disclosure: NOV INC → SAMSUNG HEAVY INDUSTRIES CO | FY2014 | — | No |
| Match Group | Alphabet | other | SEC segment disclosure: MATCH GROUP INC → ALPHABET INC | FY2013 | — | No |
| Micron | HP Inc | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC | FY2014 | — | No |
| NXP Semiconductors NV | Avnet | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC | FY2020 | — | No |
| Amkor | Apple | other | SEC segment disclosure: AMKOR TECHNOLOGY INC → APPLE INC | FY2022 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2015 | — | No |
| AMD | HP Inc | gpu_accelerator | SEC segment disclosure: ADVANCED MICRO DEVICES → HP INC | FY2011 | — | No |
| Arista Networks | Meta Platforms, Inc. | networking | SEC >10% customer disclosure | FY2025 | — | No |
| Texas Instruments | Apple | other | SEC segment disclosure: TEXAS INSTRUMENTS INC → APPLE INC | FY2015 | — | No |
| Cirrus Logic | Apple | other | SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC | FY2022 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD | FY2016 | — | No |
| Arista Networks | Microsoft Corporation | networking | SEC segment disclosure: ARISTA NETWORKS INC → MICROSOFT CORP | FY2024 | — | No |
| ZYNGA INC | Apple | other | SEC segment disclosure: ZYNGA INC → APPLE INC | FY2014 | — | No |
| AMD | HP Inc | gpu_accelerator | SEC segment disclosure: ADVANCED MICRO DEVICES → HP INC | FY2010 | — | No |
| Match Group | Alphabet | other | SEC segment disclosure: MATCH GROUP INC → ALPHABET INC | FY2012 | — | No |
| Match Group | Alphabet | other | SEC segment disclosure: MATCH GROUP INC → ALPHABET INC | FY2014 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2012 | — | No |
| NXP Semiconductors NV | Avnet | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC | FY2017 | — | No |
| Qualcomm Inc | Samsung | gpu_accelerator | SEC segment disclosure: QUALCOMM INC → SAMSUNG ELECTRONICS CO LTD | FY2009 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD | FY2010 | — | No |
| GlobalFoundries | Qualcomm Inc | foundry_services | SEC segment disclosure: GLOBALFOUNDRIES INC → QUALCOMM INC | FY2022 | — | No |
| Marvell Technology | Wintech Digital Systems Technology Corp | networking | SEC >10% customer disclosure | FY2024 | — | No |
| Qorvo | Apple | other | SEC segment disclosure: QORVO INC → APPLE INC | FY2023 | — | No |
| NXP Semiconductors NV | Avnet | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC | FY2018 | — | No |
| Micron | Intel | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP | FY2014 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD | FY2008 | — | No |
| Freescale Semiconductor, Inc. | Motorola Solutions | other | SEC segment disclosure: FREESCALE SEMICONDUCTOR INC → MOTOROLA SOLUTIONS INC | FY2002 | — | No |
| Micron | Intel | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP | FY2015 | — | No |
| ZYNGA INC | Alphabet | other | SEC segment disclosure: ZYNGA INC → ALPHABET INC | FY2015 | — | No |
| GlobalFoundries | Qualcomm Inc | foundry_services | SEC segment disclosure: GLOBALFOUNDRIES INC → QUALCOMM INC | FY2023 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2017 | — | No |
| NEWELL BRANDS INC | Amazon.com, Inc. | other | SEC segment disclosure: NEWELL BRANDS INC → AMAZON.COM INC | FY2021 | — | No |
| ELECTRONIC ARTS INC | Microsoft Corporation | other | SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP | FY2025 | — | No |
| STMicroelectronics | Apple | other | SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC | FY2018 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD | FY2011 | — | No |
| NXP Semiconductors NV | Avnet | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC | FY2019 | — | No |
| Cirrus Logic | Apple | other | SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC | FY2018 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2015 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2022 | — | No |
| NXP Semiconductors NV | Avnet | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC | FY2016 | — | No |
| Arista Networks | Meta Platforms, Inc. | networking | SEC segment disclosure: ARISTA NETWORKS INC → META PLATFORMS INC | FY2023 | — | No |
| NEWELL BRANDS INC | Amazon.com, Inc. | other | SEC segment disclosure: NEWELL BRANDS INC → AMAZON.COM INC | FY2022 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2016 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2024 | — | No |
| Cirrus Logic | Apple | other | SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC | FY2017 | — | No |
| ELECTRONIC ARTS INC | Microsoft Corporation | other | SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP | FY2024 | — | No |
| Qorvo | Apple | other | SEC segment disclosure: QORVO INC → APPLE INC | FY2021 | — | No |
| NVIDIA | Dell Technologies | gpu_accelerator | SEC segment disclosure: NVIDIA CORP → DELL TECHNOLOGIES INC | FY2020 | — | No |
| AMD | HP Inc | gpu_accelerator | SEC segment disclosure: ADVANCED MICRO DEVICES → HP INC | FY2012 | — | No |
| Applied Materials | Micron | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → MICRON TECHNOLOGY INC | FY2016 | — | No |
| Applied Materials | Intel | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP | FY2016 | — | No |
| ELECTRONIC ARTS INC | Microsoft Corporation | other | SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP | FY2023 | — | No |
| Marvell Technology | Wintech Digital Systems Technology Corp | networking | SEC >10% customer disclosure | FY2023 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2014 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD | FY2007 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2023 | — | No |
| Celestica | Cisco | other | SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC | FY2016 | — | No |
| Arista Networks | Meta Platforms, Inc. | networking | SEC >10% customer disclosure | FY2022 | — | No |
| NEWELL BRANDS INC | Amazon.com, Inc. | other | SEC segment disclosure: NEWELL BRANDS INC → AMAZON.COM INC | FY2024 | — | No |
| Cirrus Logic | Apple | other | SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC | FY2021 | — | No |
| SCI SYSTEMS INC | Apple | other | SEC segment disclosure: SCI SYSTEMS INC → APPLE INC | FY1997 | — | No |
| Micron | HP Inc | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC | FY2015 | — | No |
| Amdocs Ltd. | T-MOBILE US INC | other | SEC segment disclosure: AMDOCS → T-MOBILE US INC | FY2024 | — | No |
| Amdocs Ltd. | T-MOBILE US INC | other | SEC segment disclosure: AMDOCS → T-MOBILE US INC | FY2023 | — | No |
| NEWELL BRANDS INC | Amazon.com, Inc. | other | SEC segment disclosure: NEWELL BRANDS INC → AMAZON.COM INC | FY2020 | — | No |
| Jabil | Cisco | other | SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC | FY2004 | — | No |
| Kioxia | Sandisk | memory | Data Storage Hardware procurement | — | 8.0 | No |
| Sandisk | Kioxia | memory | Data Storage Hardware partnership | — | 7.0 | No |
| ELECTRONIC ARTS INC | Microsoft Corporation | other | SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP | FY2022 | — | No |
| Micron | Intel | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP | FY2008 | — | No |
| Micron | HP Inc | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC | FY2010 | — | No |
| Celestica | Cisco | other | SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC | FY2017 | — | No |
| Qualcomm Inc | Samsung | gpu_accelerator | SEC segment disclosure: QUALCOMM INC → SAMSUNG ELECTRONICS CO LTD | FY2010 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2020 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2018 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2021 | — | No |
| Qorvo | Apple | other | SEC segment disclosure: QORVO INC → APPLE INC | FY2018 | — | No |
| Qorvo | Apple | other | SEC segment disclosure: QORVO INC → APPLE INC | FY2020 | — | No |
| GlobalFoundries | Qualcomm Inc | foundry_services | SEC segment disclosure: GLOBALFOUNDRIES INC → QUALCOMM INC | FY2024 | — | No |
| NEWELL BRANDS INC | Amazon.com, Inc. | other | SEC segment disclosure: NEWELL BRANDS INC → AMAZON.COM INC | FY2023 | — | No |
| Arista Networks | Microsoft Corporation | networking | SEC segment disclosure: ARISTA NETWORKS INC → MICROSOFT CORP | FY2023 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2011 | — | No |
| Applied Materials | Intel | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP | FY2011 | — | No |
| Arista Networks | Meta Platforms, Inc. | networking | SEC segment disclosure: ARISTA NETWORKS INC → META PLATFORMS INC | FY2024 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2010 | — | No |
| NXP Semiconductors NV | Continental | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → CONTINENTAL AG | FY2018 | — | No |
| Qorvo | Apple | other | SEC segment disclosure: QORVO INC → APPLE INC | FY2017 | — | No |
| NXP Semiconductors NV | Continental | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → CONTINENTAL AG | FY2017 | — | No |
| ELECTRONIC ARTS INC | Microsoft Corporation | other | SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP | FY2021 | — | No |
| Cirrus Logic | Apple | other | SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC | FY2020 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD | FY2006 | — | No |
| AUO | Samsung | other | SEC segment disclosure: AUO CORPORATION → SAMSUNG ELECTRONICS CO LTD | FY2006 | — | No |
| GlobalFoundries | AMD | foundry_services | SEC segment disclosure: GLOBALFOUNDRIES INC → ADVANCED MICRO DEVICES | FY2020 | — | No |
| Jabil | Cisco | other | SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC | FY2001 | — | No |
| GlobalFoundries | Qualcomm Inc | foundry_services | SEC segment disclosure: GLOBALFOUNDRIES INC → QUALCOMM INC | FY2021 | — | No |
| Micron | Intel | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP | FY2012 | — | No |
| Qorvo | Apple | other | SEC segment disclosure: QORVO INC → APPLE INC | FY2019 | — | No |
| NXP Semiconductors NV | Continental | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → CONTINENTAL AG | FY2019 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD | FY2013 | — | No |
| Match Group | Alphabet | other | SEC segment disclosure: MATCH GROUP INC → ALPHABET INC | FY2011 | — | No |
| Micron | Intel | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP | FY2009 | — | No |
| EPLUS INC | Cisco | other | SEC segment disclosure: EPLUS INC → CISCO SYSTEMS INC | FY2024 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2009 | — | No |
| ELECTRONIC ARTS INC | Microsoft Corporation | other | SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP | FY2020 | — | No |
| NXP Semiconductors NV | ARROW ELECTRONICS, INC. | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → ARROW ELECTRONICS INC | FY2018 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2019 | — | No |
| Ultra Clean | Lam Research | other | SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → LAM RESEARCH CORP | FY2022 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2013 | — | No |
| TSMC | NVIDIA | foundry_services | SEC segment disclosure: TAIWAN SEMICONDUCTOR MFG CO → NVIDIA CORP | FY2002 | — | No |
| Logitech International | Amazon.com, Inc. | other | SEC segment disclosure: LOGITECH INTERNATIONAL SA → AMAZON.COM INC | FY2022 | — | No |
| Celestica | Cisco | other | SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC | FY2018 | — | No |
| Cirrus Logic | Apple | other | SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC | FY2019 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2011 | — | No |
| Amdocs Ltd. | T-MOBILE US INC | other | SEC segment disclosure: AMDOCS → T-MOBILE US INC | FY2022 | — | No |
| Micron | Intel | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP | FY2013 | — | No |
| Micron | HP Inc | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC | FY2013 | — | No |
| TSMC | NVIDIA | foundry_services | SEC segment disclosure: TAIWAN SEMICONDUCTOR MFG CO → NVIDIA CORP | FY2003 | — | No |
| NXP Semiconductors NV | ARROW ELECTRONICS, INC. | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → ARROW ELECTRONICS INC | FY2019 | — | No |
| Celestica | Cisco | other | SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC | FY2007 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2008 | — | No |
| Celestica | Cisco | other | SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC | FY2006 | — | No |
| Micron | Intel | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP | FY2011 | — | No |
| Micron | Dell Technologies | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → DELL TECHNOLOGIES INC | FY2000 | — | No |
| STMicroelectronics | Apple | other | SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC | FY2017 | — | No |
| AMD | Fujitsu | gpu_accelerator | SEC segment disclosure: ADVANCED MICRO DEVICES → FUJITSU LTD | FY2005 | — | No |
| Logitech International | Amazon.com, Inc. | other | Computer Peripherals supply | — | 3.0 | No |
| Logitech International | Amazon.com, Inc. | other | SEC segment disclosure: LOGITECH INTERNATIONAL SA → AMAZON.COM INC | FY2025 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2010 | — | No |
| Logitech International | Amazon.com, Inc. | other | SEC segment disclosure: LOGITECH INTERNATIONAL SA → AMAZON.COM INC | FY2023 | — | No |
| ACTIVISION BLIZZARD INC | Apple | other | SEC segment disclosure: ACTIVISION BLIZZARD INC → APPLE INC | FY2016 | — | No |
| NXP Semiconductors NV | Avnet | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC | FY2015 | — | No |
| Qualcomm Inc | LG Electronics | gpu_accelerator | SEC segment disclosure: QUALCOMM INC → LG ELECTRONICS INC | FY2005 | — | No |
| Jabil | Cisco | other | SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC | FY2002 | — | No |
| KLA | Samsung | semiconductor_equipment | SEC segment disclosure: KLA CORP → SAMSUNG ELECTRONICS CO LTD | FY2018 | — | No |
| SK ecoplant | SK Hynix | construction | Infrastructure Construction/Contracting Services supply | — | 3.0 | No |
| Ultra Clean | Lam Research | other | SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → LAM RESEARCH CORP | FY2021 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2012 | — | No |
| Micron | COMPAQ COMPUTER CORP | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → COMPAQ COMPUTER CORP | FY2000 | — | No |
| Amkor | Apple | other | SEC segment disclosure: AMKOR TECHNOLOGY INC → APPLE INC | FY2021 | — | No |
| NVIDIA | ASUSTek Computer | gpu_accelerator | SEC segment disclosure: NVIDIA CORP → ASUSTEK COMPUTER INC | FY2017 | — | No |
| Match Group | Alphabet | other | SEC segment disclosure: MATCH GROUP INC → ALPHABET INC | FY2018 | — | No |
| ELECTRONIC ARTS INC | Microsoft Corporation | other | SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP | FY2018 | — | No |
| ELECTRONIC ARTS INC | Microsoft Corporation | other | SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP | FY2017 | — | No |
| Amdocs Ltd. | T-MOBILE US INC | other | SEC segment disclosure: AMDOCS → T-MOBILE US INC | FY2021 | — | No |
| GlobalFoundries | AMD | foundry_services | SEC segment disclosure: GLOBALFOUNDRIES INC → ADVANCED MICRO DEVICES | FY2021 | — | No |
| EPLUS INC | Cisco | other | SEC segment disclosure: EPLUS INC → CISCO SYSTEMS INC | FY2023 | — | No |
| Celestica | Juniper Networks, Inc. | other | SEC segment disclosure: CELESTICA INC → JUNIPER NETWORKS INC | FY2017 | — | No |
| Celestica | Cisco | other | SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC | FY2011 | — | No |
| ELECTRONIC ARTS INC | Microsoft Corporation | other | SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP | FY2019 | — | No |
| Qualcomm Inc | GLOBALSTAR TELECOMM LTD | gpu_accelerator | SEC segment disclosure: QUALCOMM INC → GLOBALSTAR TELECOMM LTD | FY1998 | — | No |
| Micron | HP Inc | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC | FY2011 | — | No |
| Lam Research | Samsung | semiconductor_equipment | SEC segment disclosure: LAM RESEARCH CORP → SAMSUNG ELECTRONICS CO LTD | FY2011 | — | No |
| Logitech International | Amazon.com, Inc. | other | SEC segment disclosure: LOGITECH INTERNATIONAL SA → AMAZON.COM INC | FY2024 | — | No |
| Cirrus Logic | Apple | other | SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC | FY2016 | — | No |
| NOK | Apple | other | Other Machinery Manufacturing supply | — | 3.0 | No |
| Micron | Intel | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP | FY2010 | — | No |
| Broadcom Inc. | Apple | networking | SEC segment disclosure: BROADCOM CORP → APPLE INC | FY2010 | — | No |
| Jabil | Cisco | other | SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC | FY2003 | — | No |
| IAC INC | Alphabet | other | SEC segment disclosure: IAC INC → ALPHABET INC | FY2021 | — | No |
| GlobalFoundries | AMD | foundry_services | SEC segment disclosure: GLOBALFOUNDRIES INC → ADVANCED MICRO DEVICES | FY2022 | — | No |
| Amkor | Qualcomm Inc | foundry_services | Semiconductor Manufacturing Services supply | — | 8.0 | No |
| Applied Materials | Intel | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP | FY2001 | — | No |
| NXP Semiconductors NV | Avnet | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC | FY2014 | — | No |
| Amkor | Apple | other | SEC segment disclosure: AMKOR TECHNOLOGY INC → APPLE INC | FY2020 | — | No |
| Qualcomm Inc | LG Electronics | gpu_accelerator | SEC segment disclosure: QUALCOMM INC → LG ELECTRONICS INC | FY2004 | — | No |
| Match Group | Alphabet | other | SEC segment disclosure: MATCH GROUP INC → ALPHABET INC | FY2010 | — | No |
| Synopsys | Intel | other | SEC segment disclosure: SYNOPSYS INC → INTEL CORP | FY2023 | — | No |
| GlobalFoundries | AMD | foundry_services | SEC segment disclosure: GLOBALFOUNDRIES INC → ADVANCED MICRO DEVICES | FY2024 | — | No |
| Amkor | Qualcomm Inc | other | SEC segment disclosure: AMKOR TECHNOLOGY INC → QUALCOMM INC | FY2022 | — | No |
| Celestica | Cisco | other | SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC | FY2012 | — | No |
| Analog Devices | Apple | other | SEC segment disclosure: ANALOG DEVICES INC → APPLE INC | FY2017 | — | No |
| IAC INC | Alphabet | other | SEC segment disclosure: IAC INC → ALPHABET INC | FY2023 | — | No |
| Jabil | Cisco | other | SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC | FY2000 | — | No |
| WARNER MUSIC GROUP CORP | Apple | other | SEC segment disclosure: WARNER MUSIC GROUP CORP → APPLE INC | FY2024 | — | No |
| Celestica | Cisco | other | SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC | FY2019 | — | No |
| HASBRO INC | Amazon.com, Inc. | other | SEC segment disclosure: HASBRO INC → AMAZON.COM INC | FY2021 | — | No |
| ACTIVISION BLIZZARD INC | Alphabet | other | SEC segment disclosure: ACTIVISION BLIZZARD INC → ALPHABET INC | FY2017 | — | No |
| IAC INC | Alphabet | other | SEC segment disclosure: IAC INC → ALPHABET INC | FY2022 | — | No |
| Arista Networks | Microsoft Corporation | networking | SEC segment disclosure: ARISTA NETWORKS INC → MICROSOFT CORP | FY2022 | — | No |
| WARNER MUSIC GROUP CORP | Apple | other | SEC segment disclosure: WARNER MUSIC GROUP CORP → APPLE INC | FY2021 | — | No |
| KLA | TSMC | semiconductor_equipment | SEC >10% customer disclosure | FY2019 | — | No |
| KLA | TSMC | semiconductor_equipment | SEC segment disclosure: KLA CORP → TAIWAN SEMICONDUCTOR MFG CO | FY2019 | — | No |
| Logitech International | Amazon.com, Inc. | other | SEC segment disclosure: LOGITECH INTERNATIONAL SA → AMAZON.COM INC | FY2021 | — | No |
| EPLUS INC | Cisco | other | SEC segment disclosure: EPLUS INC → CISCO SYSTEMS INC | FY2022 | — | No |
| ARM | Arm Technology (China) Co. Limited | software_ip | SEC >10% customer disclosure | FY2024 | — | No |
| ARM | Arm Technology (China) Co. Limited | software_ip | SEC >10% customer disclosure | FY2025 | — | No |
| Marvell Technology | Wintech Digital Systems Technology Corp | networking | SEC >10% customer disclosure | FY2022 | — | No |
| Ultra Clean | Lam Research | other | SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → LAM RESEARCH CORP | FY2024 | — | No |
| WARNER MUSIC GROUP CORP | Apple | other | SEC segment disclosure: WARNER MUSIC GROUP CORP → APPLE INC | FY2023 | — | No |
| Cirrus Logic | Apple | other | SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC | FY2013 | — | No |
| Micron | HP Inc | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC | FY2012 | — | No |
| Celestica | Juniper Networks, Inc. | other | SEC segment disclosure: CELESTICA INC → JUNIPER NETWORKS INC | FY2016 | — | No |
| Cirrus Logic | Apple | other | SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC | FY2015 | — | No |
| SANDISK CORP -OLD | Apple | other | SEC segment disclosure: SANDISK CORP -OLD → APPLE INC | FY2012 | — | No |
| WARNER MUSIC GROUP CORP | Apple | other | SEC segment disclosure: WARNER MUSIC GROUP CORP → APPLE INC | FY2022 | — | No |
| Amkor | Qualcomm Inc | other | SEC segment disclosure: AMKOR TECHNOLOGY INC → QUALCOMM INC | FY2024 | — | No |
| EPLUS INC | Cisco | other | SEC segment disclosure: EPLUS INC → CISCO SYSTEMS INC | FY2025 | — | No |
| AOL INC | Alphabet | other | SEC segment disclosure: AOL INC → ALPHABET INC | FY2007 | — | No |
| WARNER MUSIC GROUP CORP | Apple | other | SEC segment disclosure: WARNER MUSIC GROUP CORP → APPLE INC | FY2020 | — | No |
| Qualcomm Inc | Motorola Solutions | gpu_accelerator | SEC segment disclosure: QUALCOMM INC → MOTOROLA SOLUTIONS INC | FY2005 | — | No |
| Fabrinet | Cisco | other | SEC segment disclosure: FABRINET → CISCO SYSTEMS INC | FY2025 | — | No |
| Fabrinet | Cisco | advanced_packaging | Contract Electronic Manufacturing supply | — | 3.0 | No |
| GlobalFoundries | AMD | foundry_services | SEC segment disclosure: GLOBALFOUNDRIES INC → ADVANCED MICRO DEVICES | FY2023 | — | No |
| Apple | Ingram Micro Holding | other | SEC segment disclosure: APPLE INC → INGRAM MICRO INC | FY2001 | — | No |
| Ichor Holdings | Lam Research | other | SEC segment disclosure: ICHOR HOLDINGS LTD → LAM RESEARCH CORP | FY2022 | — | No |
| ELECTRONIC ARTS INC | Microsoft Corporation | other | SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP | FY2016 | — | No |
| Amphenol | Apple | other | SEC segment disclosure: AMPHENOL CORP → APPLE INC | FY2015 | — | No |
| EPLUS INC | Cisco | other | SEC segment disclosure: EPLUS INC → CISCO SYSTEMS INC | FY2020 | — | No |
| Match Group | Alphabet | other | SEC segment disclosure: MATCH GROUP INC → ALPHABET INC | FY2008 | — | No |
| Ultra Clean | Lam Research | other | SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → LAM RESEARCH CORP | FY2018 | — | No |
| Applied Materials | Intel | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP | FY2009 | — | No |
| Ultra Clean | Lam Research | other | SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → LAM RESEARCH CORP | FY2020 | — | No |
| Synopsys | Intel | other | SEC segment disclosure: SYNOPSYS INC → INTEL CORP | FY2022 | — | No |
| MULTI-FINELINE ELECTRON INC | Apple | other | SEC segment disclosure: MULTI-FINELINE ELECTRON INC → APPLE INC | FY2013 | — | No |
| Ultra Clean | Lam Research | other | SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → LAM RESEARCH CORP | FY2023 | — | No |
| EPLUS INC | Cisco | other | SEC segment disclosure: EPLUS INC → CISCO SYSTEMS INC | FY2018 | — | No |
| ENTRAVISION COMMUNICATIONS | Meta Platforms, Inc. | other | SEC segment disclosure: ENTRAVISION COMMUNICATIONS → META PLATFORMS INC | FY2023 | — | No |
| HASBRO INC | Amazon.com, Inc. | other | SEC segment disclosure: HASBRO INC → AMAZON.COM INC | FY2022 | — | No |
| Applied Materials | Intel | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP | FY2003 | — | No |
| WARNER MUSIC GROUP CORP | Apple | other | SEC segment disclosure: WARNER MUSIC GROUP CORP → APPLE INC | FY2019 | — | No |
| SOLECTRON CORP | Cisco | other | SEC segment disclosure: SOLECTRON CORP → CISCO SYSTEMS INC | FY1998 | — | No |
| Arista Networks | Microsoft Corporation | networking | SEC segment disclosure: ARISTA NETWORKS INC → MICROSOFT CORP | FY2018 | — | No |
| Ichor Holdings | Lam Research | other | SEC segment disclosure: ICHOR HOLDINGS LTD → LAM RESEARCH CORP | FY2021 | — | No |
| Fabrinet | Cisco | other | SEC segment disclosure: FABRINET → CISCO SYSTEMS INC | FY2022 | — | No |
| Micron | HP Inc | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC | FY2007 | — | No |
| SYSTEM1 INC | Alphabet | other | SEC segment disclosure: SYSTEM1 INC → ALPHABET INC | FY2022 | — | No |
| Cirrus Logic | Apple | other | SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC | FY2014 | — | No |
| Match Group | Alphabet | other | SEC segment disclosure: MATCH GROUP INC → ALPHABET INC | FY2009 | — | No |
| EPLUS INC | Cisco | other | SEC segment disclosure: EPLUS INC → CISCO SYSTEMS INC | FY2019 | — | No |
| IAC INC | Alphabet | other | SEC segment disclosure: IAC INC → ALPHABET INC | FY2020 | — | No |
| Arista Networks | Microsoft Corporation | networking | SEC segment disclosure: ARISTA NETWORKS INC → MICROSOFT CORP | FY2019 | — | No |
| Prologis | Amazon.com, Inc. | other | Equity REITs supply | — | 3.0 | No |
| Ultra Clean | Lam Research | other | SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → LAM RESEARCH CORP | FY2017 | — | No |
| NVIDIA | ASUSTek Computer | gpu_accelerator | SEC segment disclosure: NVIDIA CORP → ASUSTEK COMPUTER INC | FY2016 | — | No |
| Ultra Clean | Applied Materials | other | SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → APPLIED MATERIALS INC | FY2022 | — | No |
Relationships arrive from four families: 13,498 rows from a licensed supply-chain database held under subscription and not redistributed; 3,170 re-sourced to primary SEC filings — 10-K and 20-F segment and greater-than-ten-per-cent-customer disclosures; 2,128 independently re-derived from a public primary source, each carrying a verbatim quote; and 203 from BIS cross-reference, CSET classification, and Scrutica research enrichment.
Every count above is a count of ROWS, not of relationships. Only the licensed family is withheld from rendering; the rest publish with their source links intact.
Both sides of every row resolve through the canonical organization map, which merges the same real-world company across id namespaces before anything is counted. Rows then collapse on the resolved pair plus the product or service, so a relationship two sources both report counts once and the higher-quality values survive the merge.
Single-source dependencies are the rows the substrate flags as sole-source, collapsed on the same key. All 54 of them are public-provenance, which is why the plate above can name every one.