Japan sovereign AI programme

Vendor: NVIDIA

Count: 1,600

Status: Delivered

Scope: Physical hardware

RIKEN (RIKYU, restricted early access)

RIKYU’s 400 GB200 NVL4 nodes; restricted early access through September 2026. Primary source

Vendor: NVIDIA

Count: 540

Status: Operational

Scope: Physical hardware

RIKEN (ROQUO)

ROQUO’s 135 GB200 NVL4 nodes; access initially limited to project participants. Primary source, 19 Jun 2026

~$7.90B

The amount includes an estimate.

~$7.90B

The amount includes an estimate.

Kind: Government

Kind: Government

Amount: $7.90B

Kind: Government

Amount: $740M

Kind: Private

A part of the programme. The ¥10T+ envelope the programme record is named after, set by Cabinet decision in the November 2024 economic package for the seven years FY2024–FY2030 and accounted for separately in the Energy Special Account. It covers METI's AI and semiconductor support (Rapidus included) but not MEXT's FugakuNEXT. The text says '10 兆円以上' (at least ¥10 trillion): about ¥6T of subsidies and contracts plus ¥4T or more of equity and guarantees. It is the primary line because it is the instrument the programme record is named after. No government document found reports execution against the envelope as a whole; its money is paid through the instruments in the other lines, which do not separate framework money from earlier appropriations.

Approved by the government: the AI and semiconductor framework’s envelope of at least ¥10 trillion, April 2024 to March 2031. Printed as “10 兆円以上”. About $64.6B at the reference rate of 22 Nov 2024. 政府は、2030 年度までに、（１）次世代半導体研究開発やパワー半導体量産投資等への補助及び委託等として６兆円程度（補助及び委託等）（２）次世代半導体量産投資やＡＩ利活用に向けた計算基盤整備等への出資や債務保証等として４兆円以上（金融支援） 全体として 10 兆円以上のＡＩ・半導体分野への公的支援を必要な財源を確保しながら行う。 (By FY2030 the government will provide (1) about ¥6 trillion in subsidies and contracts for next-generation semiconductor R&D, power-semiconductor mass-production investment etc., and (2) at least ¥4 trillion in equity, debt guarantees etc. for next-generation semiconductor mass-production investment and computing-infrastructure for AI use (financial support): in total at least ¥10 trillion of public support to AI and semiconductors, while securing the necessary funding.) Cabinet Office (Cabinet decision), hosted by METI, 国民の安心・安全と持続的な成長に向けた総合経済対策 ～全ての世代の現在・将来の賃金・所得を増やす～（令和６年11月22日閣議決定）, 別紙１ ＡＩ・半導体産業基盤強化フレーム (copy hosted by METI), PDF page 65 (printed p.59), 別紙１ １．事業規模; seven-year period on PDF page 39 (printed p.33), 22 Nov 2024

Annual appropriation: ¥1.24 trillion, 30 Apr 2026. Printed as “計12,390億円”. FY2026 budget under the framework (Energy Special Account), as described by MOF's budget examiner; this is the ¥1.239T that the programme record's US$7.9B converts. Includes ¥1,500億 IPA equity and ¥3,873億 for multimodal foundation models. An appropriation, not spending. 「AI・半導体産業基盤強化フレーム」に基づき、次世代半導体の研究開発、AIロボット・フィジカルAIを見据えたAI基盤モデルの開発等、計12,390億円の支援を実施。 (Under the AI and Semiconductor Industrial Base Strengthening Framework, support totalling ¥1,239.0 billion is provided for next-generation semiconductor R&D, development of AI foundation models with AI robotics and physical AI in view, and other items.) Ministry of Finance (Budget Bureau), ファイナンス 令和8年4月号 特集 令和8年度 経済産業省、環境省、裁判所、警察庁、法務省予算について, 〇 経済産業省予算, ２ GX、AI・半導体、エネルギー対策, （２）AI・半導体（AI・半導体産業基盤強化フレーム）, 30 Apr 2026

A part of the programme. The largest single instrument under the programme: the fund through which METI pays for Rapidus's 2 nm R&D and the GENIAC foundation-model programme; since the FY2024 supplementary it also receives the AI-semiconductor framework's own subsidy (先端半導体・人工知能関連技術対策費補助金, ¥917,516m of the fund on 1 May 2026). It is broader than the programme in two ways (post-5G network R&D, and quantum-computer and robotics-software components added in FY2024) and pre-dates the ¥10T framework (first grant March 2020). It excludes IPA's equity in Rapidus, the TSMC/Kioxia/Micron fund (特定半導体基金), the economic-security cloud-compute fund and MEXT's FugakuNEXT, which are separate lines below.

Voted by parliament: the NEDO Post-5G fund’s ¥2.91 trillion in cumulative state grants, March 2020 to March 2030. Printed as “２，９１４，８７６百万円”. About $18.6B at the reference rate of 1 May 2026. ２０２６年５月１日現在 基金の名称 ポスト５Ｇ情報通信システム基盤強化研究開発基金 基金の額 ２，９１４，８７６百万円 … 先端半導体・人工知能関連技術対策費補助金 ９１７，５１６百万円 基金のうち国庫補助金等相当額 ２，９１４，８７６百万円 (As of 1 May 2026. Fund: Post-5G Information and Communication Systems Infrastructure Enhancement R&D Fund. Fund amount ¥2,914,876 million … of which the advanced-semiconductor and AI subsidy ¥917,516 million. National-subsidy share of the fund ¥2,914,876 million.) New Energy and Industrial Technology Development Organization (NEDO), ポスト５Ｇ情報通信システム基盤強化研究開発基金補助金 交付要綱及び実施要領に基づく基本的事項の公表（２０２６年５月１日現在）, page 1, 基金の額 (fund amount), with breakdown by subsidy; 基金事業を終了する時期 ２０２９年度末, 1 May 2026

Paid out: ¥1.97 trillion by 31 Mar 2026. Cumulative 事業費 (R&D contract and grant payments out of the fund; NEDO's own administrative cost excluded) FY2019–FY2025 across all components of the fund. FY2019 printed '－' (nil). FY2020–FY2021 from NEDO's statutory report to the Diet (¥ million, rounded); FY2022–FY2025 from the RS fund sheets in yen. The NEDO report and the fund sheets agree for FY2022–FY2024 to the million. 72 of the budget’s 120 months had passed. About $12.4B at the reference rate of 31 Mar 2026. "beginning_of_the_fund_balance": 1443059828641, "granted_amount_by_the_country": 315356459000, "business_expense": 952092188010, "administrative_expense": 7595455525, "national_equivalent_of_the_balance": 803633193870 (FY2025 record of the chain; the other operands carry their own citations) Cabinet Secretariat Administrative Reform Promotion Office, RS System (行政事業レビュー見える化サイト), RS System FY2026 fund sheet 017338: ポスト５Ｇ情報通信システム基盤強化研究開発事業（AI基盤モデル及び先端半導体関連技術開発事業）, fund ポスト５Ｇ情報通信システム基盤強化研究開発基金 (NEDO), fund_additional_income_and_expenditure chain (see operands), 15 Sep 2026

Paid out: ¥15.2 billion, 31 Mar 2021. Printed as “15,212”. 事業費 (business expenditure paid out of the fund to R&D contractors and grantees) in FY2020; FY2019 shows none ('－'). （単位：百万円） 令和元年度 令和２年度 令和３年度 令和４年度 令和５年度 … 事業費 － 15,212 42,890 73,097 226,747 ((Unit: ¥ million) FY2019 FY2020 FY2021 FY2022 FY2023 … Business expenditure – 15,212 42,890 73,097 226,747) Ministry of Economy, Trade and Industry / NEDO (House of Representatives deposit), 国立研究開発法人新エネルギー・産業技術総合開発機構令和６年度特定公募型研究開発業務（ポスト５Ｇ情報通信システム基盤強化研究開発）に関する報告書及び同報告書に付する経済産業大臣の意見 (NEDO's FY2024 report on the Post-5G fund, with the METI Minister's opinion, submitted to the Diet), PDF page 12 (printed p.8), section 3 table 1) 産業技術・環境・産業標準政策推進研究開発等事業費補助金, row 事業費, column 令和２年度, 21 Nov 2025

Paid out: ¥42.9 billion, 31 Mar 2022. Printed as “42,890”. 事業費 in FY2021 (only the general-account subsidy existed then). （単位：百万円） 令和元年度 令和２年度 令和３年度 令和４年度 令和５年度 … 事業費 － 15,212 42,890 73,097 226,747 ((Unit: ¥ million) FY2019 FY2020 FY2021 FY2022 FY2023 … Business expenditure – 15,212 42,890 73,097 226,747) Ministry of Economy, Trade and Industry / NEDO (House of Representatives deposit), 国立研究開発法人新エネルギー・産業技術総合開発機構令和６年度特定公募型研究開発業務（ポスト５Ｇ情報通信システム基盤強化研究開発）に関する報告書及び同報告書に付する経済産業大臣の意見 (NEDO's FY2024 report on the Post-5G fund, with the METI Minister's opinion, submitted to the Diet), PDF page 12 (printed p.8), table 1), row 事業費, column 令和３年度, 21 Nov 2025

Paid out: ¥73.1 billion, 31 Mar 2023. Printed as “73097261106”. 事業費 for FY2022 in the fund-sheet history (agrees with NEDO's report, ¥73,097m). "beginning_of_the_fund_balance": 250864559097, "granted_amount_by_the_country": 485009192000, "business_expense": 73097261106, "administrative_expense": 832908376, "national_equivalent_of_the_balance": 661968835329 (FY2022: opening balance ¥250,864,559,097; state grant ¥485,009,192,000; business expenditure ¥73,097,261,106; administrative cost ¥832,908,376; closing balance ¥661,968,835,329) Cabinet Secretariat Administrative Reform Promotion Office, RS System (行政事業レビュー見える化サイト), RS System FY2026 fund sheet 017338: ポスト５Ｇ情報通信システム基盤強化研究開発事業（AI基盤モデル及び先端半導体関連技術開発事業）, fund ポスト５Ｇ情報通信システム基盤強化研究開発基金 (NEDO), JSON fund_additional_income_and_expenditure → prior → prior → prior → prior (FY2022 record); page https://rssystem.go.jp/project/71379c84-6656-454a-a0f4-c67c47fede10, 15 Sep 2026

Paid out: ¥230 billion, 31 Mar 2024. Printed as “230341451067”. 事業費 for FY2023 (NEDO's report: ¥226,747m general account + ¥3,595m GX subsidy = ¥230,342m). "beginning_of_the_fund_balance": 661968835329, "granted_amount_by_the_country": 677292895000, "business_expense": 230341451067, "administrative_expense": 1538584555, "national_equivalent_of_the_balance": 1108329319578 (FY2023: opening ¥661,968,835,329; grant ¥677,292,895,000; business expenditure ¥230,341,451,067; admin ¥1,538,584,555; closing ¥1,108,329,319,578) Cabinet Secretariat Administrative Reform Promotion Office, RS System (行政事業レビュー見える化サイト), RS System FY2026 fund sheet 017338: ポスト５Ｇ情報通信システム基盤強化研究開発事業（AI基盤モデル及び先端半導体関連技術開発事業）, fund ポスト５Ｇ情報通信システム基盤強化研究開発基金 (NEDO), JSON fund_additional_income_and_expenditure → prior → prior → prior (FY2023 record), 15 Sep 2026

Paid out: ¥655 billion, 31 Mar 2025. Printed as “654506527128”. 事業費 for FY2024 (NEDO's report: 642,781 + 11,484 + 242 + 0 = ¥654,507m across the four subsidy accounts); the quantum and robotics components paid nothing in FY2024. "beginning_of_the_fund_balance": 1108329319578, "granted_amount_by_the_country": 990178535000, "business_expense": 654506527128, "administrative_expense": 2420865989, "national_equivalent_of_the_balance": 1443059828641 (FY2024: opening ¥1,108,329,319,578; grant ¥990,178,535,000; business expenditure ¥654,506,527,128; admin ¥2,420,865,989; closing ¥1,443,059,828,641) Cabinet Secretariat Administrative Reform Promotion Office, RS System (行政事業レビュー見える化サイト), RS System FY2026 fund sheet 017338: ポスト５Ｇ情報通信システム基盤強化研究開発事業（AI基盤モデル及び先端半導体関連技術開発事業）, fund ポスト５Ｇ情報通信システム基盤強化研究開発基金 (NEDO), JSON fund_additional_income_and_expenditure → prior → prior (FY2024 record), 15 Sep 2026

Paid out: ¥952 billion, 31 Mar 2026. Printed as “952092188010”. 事業費 for FY2025, AI-foundation-model and advanced-semiconductor component (fund sheet 017338). "beginning_of_the_fund_balance": 1443059828641, "granted_amount_by_the_country": 315356459000, "business_expense": 952092188010, "administrative_expense": 7595455525, "national_equivalent_of_the_balance": 803633193870 (FY2025: opening ¥1,443,059,828,641; grant ¥315,356,459,000; business expenditure ¥952,092,188,010; admin ¥7,595,455,525; closing ¥803,633,193,870) Cabinet Secretariat Administrative Reform Promotion Office, RS System (行政事業レビュー見える化サイト), RS System FY2026 fund sheet 017338: ポスト５Ｇ情報通信システム基盤強化研究開発事業（AI基盤モデル及び先端半導体関連技術開発事業）, fund ポスト５Ｇ情報通信システム基盤強化研究開発基金 (NEDO), JSON fund_additional_income_and_expenditure → prior (FY2025 record, project 144b1b7c), 15 Sep 2026

Paid out: ¥4.97 billion, 31 Mar 2026. Printed as “4966991000”. 事業費 for FY2025, quantum-computer industrialisation component of the same NEDO fund (fund sheet 021098). "beginning_of_the_fund_balance": 49498197000, "granted_amount_by_the_country": 77197827000, "business_expense": 4966991000, "administrative_expense": 125749000, "national_equivalent_of_the_balance": 121737547000 (FY2025: opening ¥49,498,197,000; grant ¥77,197,827,000; business expenditure ¥4,966,991,000; admin ¥125,749,000; closing ¥121,737,547,000) Cabinet Secretariat Administrative Reform Promotion Office, RS System (行政事業レビュー見える化サイト), RS System FY2026 fund sheet 021098: ポスト５Ｇ情報通信システム基盤強化研究開発事業(量子コンピュータの産業化に向けた開発), fund ポスト５Ｇ情報通信システム基盤強化研究開発基金, JSON fund_additional_income_and_expenditure → prior (FY2025 record); page https://rssystem.go.jp/project/78bd27aa-2213-43c9-b890-01b2902099cc, 15 Sep 2026

Paid out: ¥1.81 billion, 31 Mar 2026. Printed as “1807484000”. 事業費 for FY2025, robotics-software component of the same NEDO fund (fund sheet 021099). "beginning_of_the_fund_balance": 10340000000, "granted_amount_by_the_country": null, "business_expense": 1807484000, "administrative_expense": 14212000, "national_equivalent_of_the_balance": 8546351000 (FY2025: opening ¥10,340,000,000; no new grant; business expenditure ¥1,807,484,000; admin ¥14,212,000; closing ¥8,546,351,000) Cabinet Secretariat Administrative Reform Promotion Office, RS System (行政事業レビュー見える化サイト), RS System FY2026 fund sheet 021099: ポスト５Ｇ情報通信システム基盤強化研究開発事業(ロボティクス分野におけるソフトウェア開発基盤構築事業), fund ポスト５Ｇ情報通信システム基盤強化研究開発基金, JSON fund_additional_income_and_expenditure → prior (FY2025 record); page https://rssystem.go.jp/project/4606f16f-b6b0-46b3-8184-1216d68e43c0, 15 Sep 2026

Released: ¥315 billion, 31 Mar 2026. Printed as “315356459000”. 執行額 on METI's review sheet 003522 for FY2025: the grant paid into the NEDO fund (payee NEDO), not payments to final recipients. Equals FY2025 initial ¥161.7bn plus supplementary ¥153.66bn. {"name": "ポスト５Ｇ情報通信システム基盤強化研究開発事業（AI基盤モデル及び先端半導体関連技術開発事業）", "fiscal_year": 2025, "amount": 315356459000, "negative_amount_count": 0} (Post-5G R&D programme (AI foundation models and advanced semiconductors), FY2025 execution ¥315,356,459,000) Cabinet Secretariat Administrative Reform Promotion Office, RS System (行政事業レビュー見える化サイト), RS System FY2026 review sheet 003522: ポスト５Ｇ情報通信システム基盤強化研究開発事業（AI基盤モデル及び先端半導体関連技術開発事業）, consecutive executions, consecutive/executions JSON, fiscal_year 2025; page https://rssystem.go.jp/project/fb3b3830-9cdd-47c2-a71b-492d76d77d9d, 1 Sep 2026

Annual appropriation: ¥674 billion, 7 Apr 2026. Printed as “673823792000”. FY2026 initial appropriation for the post-5G line (METI's FY2026 PR sheet prints it as '令和８年度予算 6,738億円'); to be granted into the fund during FY2026, so it is not in the 2026-05-01 fund amount. the figure is dated to the FY2026 budget's enactment (MOF FY2026 budget page: 予算成立 令和８年４月７日; receipt jp/dl-06/index.html). {"fiscal_year": 2026, "budget_type": "initial", "budget_type_name": "当初予算", "finalized_amount": 673823792000, "requested_amount": 392647500000} (FY2026 initial budget ¥673,823,792,000 (request ¥392,647,500,000)) Cabinet Secretariat Administrative Reform Promotion Office, RS System (行政事業レビュー見える化サイト), RS System FY2026 review sheet 003522, consecutive budgets, consecutive/budgets JSON, fiscal_year 2026, 当初予算, 1 Sep 2026

A part of the programme. Grants for certified advanced-semiconductor fabs under the 5G Promotion Act (7 plans certified by March 2025: TSMC/JASM, Kioxia/Western Digital, Micron). Only the FY2024 supplementary tranche (¥471,391m, 'securing domestic production bases for advanced semiconductors') falls under the ¥10T framework; the earlier ¥1,699,200m pre-dates it. Not Rapidus, which is funded through the Post-5G fund and IPA.

Voted by parliament: the Specified Semiconductor Fund’s ¥2.17 trillion in cumulative state grants, April 2021 to March 2031. Printed as “２，１７０，５９１百万円”. About $14.5B at the reference rate of 1 Apr 2025. ２０２５年４月１日現在 基金の名称 特定半導体基金 基金の額 ２，１７０，５９１百万円 基金のうち国庫補助金等相当額 ２，１７０，５９１百万円 (As of 1 April 2025. Fund: Specified Semiconductor Fund. Fund amount ¥2,170,591 million; national-subsidy share ¥2,170,591 million.) New Energy and Industrial Technology Development Organization (NEDO), 先端半導体生産基盤整備基金補助金交付要綱及び実施要領に基づく基本的事項の公表（２０２５年４月１日現在）, page 1, 基金の額, 1 Apr 2025

Paid out: ¥831 billion by 31 Mar 2026. Cumulative 事業費 FY2021–FY2025. FY2021 paid nothing: the FY2022 opening balance equals the FY2021 grant (¥617,000,000,000). 60 of the budget’s 120 months had passed. About $5.2B at the reference rate of 31 Mar 2026. "beginning_of_the_fund_balance": 1562576913945, "granted_amount_by_the_country": 0, "business_expense": 222928562113, "administrative_expense": 324921214, "national_equivalent_of_the_balance": 1345100255183 (FY2025 record; other operands carry their own citations) Cabinet Secretariat Administrative Reform Promotion Office, RS System (行政事業レビュー見える化サイト), RS System FY2026 fund sheet 017018: 特定半導体基金事業 (fund 特定半導体基金, NEDO), fund_additional_income_and_expenditure chain (see operands), 15 Sep 2026

Paid out: ¥60.8 billion, 31 Mar 2023. Printed as “60778374791”. 事業費 (grants paid out of the fund to the certified fab operators) in FY2022. "beginning_of_the_fund_balance": 617000000000, "granted_amount_by_the_country": 450000000000, "business_expense": 60778374791, "administrative_expense": 97422143, "national_equivalent_of_the_balance": 1006131253491 (FY2022: opening ¥617,000,000,000; grant ¥450,000,000,000; business expenditure ¥60,778,374,791; admin ¥97,422,143; closing ¥1,006,131,253,491) Cabinet Secretariat Administrative Reform Promotion Office, RS System (行政事業レビュー見える化サイト), RS System FY2026 fund sheet 017018: 特定半導体基金事業 (fund 特定半導体基金, NEDO), JSON fund_additional_income_and_expenditure → prior → prior → prior → prior (FY2022 record); page https://rssystem.go.jp/project/31d5552c-eb05-4ef1-a21a-60075f176bbb, 15 Sep 2026

Paid out: ¥289 billion, 31 Mar 2024. Printed as “288586326247”. 事業費 (grants paid out of the fund to the certified fab operators) in FY2023. "beginning_of_the_fund_balance": 1006131253491, "granted_amount_by_the_country": 632200000000, "business_expense": 288586326247, "administrative_expense": 119206896, "national_equivalent_of_the_balance": 1349634831569 (FY2023: opening ¥1,006,131,253,491; grant ¥632,200,000,000; business expenditure ¥288,586,326,247; admin ¥119,206,896; closing ¥1,349,634,831,569) Cabinet Secretariat Administrative Reform Promotion Office, RS System (行政事業レビュー見える化サイト), RS System FY2026 fund sheet 017018: 特定半導体基金事業 (fund 特定半導体基金, NEDO), JSON fund_additional_income_and_expenditure → prior → prior → prior (FY2023 record); page https://rssystem.go.jp/project/31d5552c-eb05-4ef1-a21a-60075f176bbb, 15 Sep 2026

Paid out: ¥259 billion, 31 Mar 2025. Printed as “258972186597”. 事業費 (grants paid out of the fund to the certified fab operators) in FY2024. "beginning_of_the_fund_balance": 1349634831569, "granted_amount_by_the_country": 471391197000, "business_expense": 258972186597, "administrative_expense": 227828526, "national_equivalent_of_the_balance": 1562576913945 (FY2024: opening ¥1,349,634,831,569; grant ¥471,391,197,000; business expenditure ¥258,972,186,597; admin ¥227,828,526; closing ¥1,562,576,913,945) Cabinet Secretariat Administrative Reform Promotion Office, RS System (行政事業レビュー見える化サイト), RS System FY2026 fund sheet 017018: 特定半導体基金事業 (fund 特定半導体基金, NEDO), JSON fund_additional_income_and_expenditure → prior → prior (FY2024 record); page https://rssystem.go.jp/project/31d5552c-eb05-4ef1-a21a-60075f176bbb, 15 Sep 2026

Paid out: ¥223 billion, 31 Mar 2026. Printed as “222928562113”. 事業費 (grants paid out of the fund to the certified fab operators) in FY2025. "beginning_of_the_fund_balance": 1562576913945, "granted_amount_by_the_country": 0, "business_expense": 222928562113, "administrative_expense": 324921214, "national_equivalent_of_the_balance": 1345100255183 (FY2025: opening ¥1,562,576,913,945; grant ¥0; business expenditure ¥222,928,562,113; admin ¥324,921,214; closing ¥1,345,100,255,183) Cabinet Secretariat Administrative Reform Promotion Office, RS System (行政事業レビュー見える化サイト), RS System FY2026 fund sheet 017018: 特定半導体基金事業 (fund 特定半導体基金, NEDO), JSON fund_additional_income_and_expenditure → prior (FY2025 record); page https://rssystem.go.jp/project/31d5552c-eb05-4ef1-a21a-60075f176bbb, 15 Sep 2026

Committed: ¥2.16 trillion, 31 Mar 2025. Printed as “計約2兆1,644億円”. Support amounts decided for the 7 certified plans by end-March 2025 ('約', approximate as printed). A commitment, not payment. ５Ｇ促進法に基づき、令和７年３月末までに、計７件の先端半導体の生産施設整備及び生産に関する計画認定を行い、計約2兆1,644億円を支援額として決定済。 (Under the 5G Promotion Act, by end-March 2025 seven plans for advanced-semiconductor production facilities were certified and support of about ¥2,164.4 billion in total was decided.) Cabinet Secretariat Administrative Reform Promotion Office, RS System (行政事業レビュー見える化サイト), RS System FY2026 fund sheet 017018: 特定半導体基金事業 (fund 特定半導体基金, NEDO), fund_additional_attributes.effort_and_result_and_overview, 15 Sep 2026

A part of the programme. The METI subsidies for GPU cloud capacity (Sakura Internet, KDDI, GMO, Highreso, RUTILEA, SoftBank and others) designated under the Economic Security Promotion Act; the fund sheet reports 11 certified plans and about 7.5 EFLOPS installed by end-December 2024. It is the cloud-programme slice of NEDO's 安定供給確保支援基金 (whose ¥2,169,963m total covers all specified critical materials), funded by two supplementary-budget tranches that pre-date the ¥10T framework. No single printed budget total for the slice was found, so budget is null and the tranches are listed.

Paid out: ¥72.5 billion by 31 Mar 2026. Cumulative 事業費 FY2022–FY2025; FY2022 paid nothing (FY2022 record: business expenditure 0). About $456M at the reference rate of 31 Mar 2026. "beginning_of_the_fund_balance": 85425361882, "granted_amount_by_the_country": 0, "business_expense": 21604199931, "administrative_expense": 453880409, "national_equivalent_of_the_balance": 63728779603 (FY2025 record; other operands carry their own citations) Cabinet Secretariat Administrative Reform Promotion Office, RS System (行政事業レビュー見える化サイト), RS System FY2026 fund sheet 017357: 安定供給確保支援事業(クラウドプログラム) (fund 安定供給確保支援基金, NEDO), fund_additional_income_and_expenditure chain (see operands), 15 Sep 2026

Paid out: ¥7.55 billion, 31 Mar 2024. Printed as “7545747631”. 事業費 (grants paid to certified cloud-compute providers) in FY2023. "beginning_of_the_fund_balance": 20000000000, "granted_amount_by_the_country": 116598032000, "business_expense": 7545747631, "administrative_expense": 35335193, "national_equivalent_of_the_balance": 129017193469 (FY2023: opening ¥20,000,000,000; grant ¥116,598,032,000; business expenditure ¥7,545,747,631; admin ¥35,335,193; closing ¥129,017,193,469) Cabinet Secretariat Administrative Reform Promotion Office, RS System (行政事業レビュー見える化サイト), RS System FY2026 fund sheet 017357: 安定供給確保支援事業(クラウドプログラム) (fund 安定供給確保支援基金, NEDO), JSON fund_additional_income_and_expenditure → prior → prior → prior (FY2023 record); page https://rssystem.go.jp/project/a2c4cfd8-2331-4add-bd7c-381cf8617e3e, 15 Sep 2026

Paid out: ¥43.4 billion, 31 Mar 2025. Printed as “43372945077”. 事業費 (grants paid to certified cloud-compute providers) in FY2024. "beginning_of_the_fund_balance": 129017193469, "granted_amount_by_the_country": 0, "business_expense": 43372945077, "administrative_expense": 432926535, "national_equivalent_of_the_balance": 85425361882 (FY2024: opening ¥129,017,193,469; grant ¥0; business expenditure ¥43,372,945,077; admin ¥432,926,535; closing ¥85,425,361,882) Cabinet Secretariat Administrative Reform Promotion Office, RS System (行政事業レビュー見える化サイト), RS System FY2026 fund sheet 017357: 安定供給確保支援事業(クラウドプログラム) (fund 安定供給確保支援基金, NEDO), JSON fund_additional_income_and_expenditure → prior → prior (FY2024 record); page https://rssystem.go.jp/project/a2c4cfd8-2331-4add-bd7c-381cf8617e3e, 15 Sep 2026

Paid out: ¥21.6 billion, 31 Mar 2026. Printed as “21604199931”. 事業費 (grants paid to certified cloud-compute providers) in FY2025. "beginning_of_the_fund_balance": 85425361882, "granted_amount_by_the_country": 0, "business_expense": 21604199931, "administrative_expense": 453880409, "national_equivalent_of_the_balance": 63728779603 (FY2025: opening ¥85,425,361,882; grant ¥0; business expenditure ¥21,604,199,931; admin ¥453,880,409; closing ¥63,728,779,603) Cabinet Secretariat Administrative Reform Promotion Office, RS System (行政事業レビュー見える化サイト), RS System FY2026 fund sheet 017357: 安定供給確保支援事業(クラウドプログラム) (fund 安定供給確保支援基金, NEDO), JSON fund_additional_income_and_expenditure → prior (FY2025 record); page https://rssystem.go.jp/project/a2c4cfd8-2331-4add-bd7c-381cf8617e3e, 15 Sep 2026

Annual appropriation: ¥20 billion, 31 Mar 2023. Printed as “20000000000”. FY2022 second supplementary tranche into the fund for the cloud programme. "budget": "supplementary2", "fiscal_year_of_creation": 2022, "related_review_sheet_name": "経済環境変化に応じた重要物資サプライチェーン強靱化支援事業(クラウドプログラム)", "amount_of_state_expenditure": 20000000000 (FY2022 second supplementary budget, ¥20,000,000,000 of state funds into the fund (critical-materials supply-chain resilience support, cloud programme)) Cabinet Secretariat Administrative Reform Promotion Office, RS System (行政事業レビュー見える化サイト), RS System FY2026 fund sheet 017357: 安定供給確保支援事業(クラウドプログラム) (fund 安定供給確保支援基金, NEDO), fund_additional_attributes.composition_backgrounds[0], 15 Sep 2026

Annual appropriation: ¥117 billion, 31 Mar 2024. Printed as “116598032000”. FY2023 first supplementary tranche into the fund for the cloud programme. "budget": "supplementary1", "fiscal_year_of_creation": 2023, "related_review_sheet_name": "経済環境変化に応じた重要物資サプライチェーン強靱化支援事業(クラウドプログラム)", "amount_of_state_expenditure": 116598032000 (FY2023 first supplementary budget, ¥116,598,032,000 of state funds into the fund (cloud programme)) Cabinet Secretariat Administrative Reform Promotion Office, RS System (行政事業レビュー見える化サイト), RS System FY2026 fund sheet 017357: 安定供給確保支援事業(クラウドプログラム) (fund 安定供給確保支援基金, NEDO), fund_additional_attributes.composition_backgrounds[1], 15 Sep 2026

A part of the programme. Equity support under the 2025 amendment of the Information Processing Promotion Act (amended 4 August 2025 per IPA): the state capitalises IPA, which buys Rapidus shares. Part of the framework's ¥4T+ financial-support leg. No single printed budget total was found for FY2025+FY2026, so budget is null and the two annual appropriations are listed; IPA's release prints the cumulative investment.

Paid out: ¥250 billion by 5 Jun 2026. Printed as “2,500億円”. About $1.6B at the reference rate of 5 Jun 2026. 第三者割当増資による1,500億円の追加出資を行いました。今回の出資と昨年度の1,000億円の出資を合わせると、IPAの出資総額は2,500億円となります。 (IPA made an additional ¥150 billion equity investment by third-party allotment. With last fiscal year's ¥100 billion, IPA's total investment comes to ¥250 billion.) Information-technology Promotion Agency, Japan (IPA), プレス発表「次世代半導体の量産等に向けてRapidus株式会社に追加出資」, 概要, 5 Jun 2026

Annual appropriation: ¥100 billion, 31 Mar 2025. Printed as “100000000000”. FY2025 initial appropriation (Energy Special Account) for the capital contribution to IPA. The FY2026 review sheet records no FY2025 execution amount for this line (consecutive/executions is empty). {"name": "次世代半導体の量産等に向けた出資事業", "fiscal_year": 2025, "budget_type": "initial", "budget_type_name": "当初予算", "finalized_amount": 100000000000} (Equity programme for next-generation semiconductor mass production, FY2025 initial budget ¥100,000,000,000) Cabinet Secretariat Administrative Reform Promotion Office, RS System (行政事業レビュー見える化サイト), RS System FY2026 review sheet 021848: 次世代半導体の量産等に向けた出資事業, consecutive budgets, consecutive/budgets JSON, fiscal_year 2025; page https://rssystem.go.jp/project/2a3a099d-aa7f-46fa-9886-cda20dd13e8b, 1 Sep 2026

Annual appropriation: ¥150 billion, 7 Apr 2026. Printed as “150000000000”. FY2026 initial appropriation (MOF prints it as 1,500億円 within the framework's 12,390億円). the figure is dated to the FY2026 budget's enactment (MOF FY2026 budget page: 予算成立 令和８年４月７日; receipt jp/dl-06/index.html). {"name": "次世代半導体の量産等に向けた出資事業", "fiscal_year": 2026, "budget_type": "initial", "budget_type_name": "当初予算", "finalized_amount": 150000000000} (FY2026 initial budget ¥150,000,000,000) Cabinet Secretariat Administrative Reform Promotion Office, RS System (行政事業レビュー見える化サイト), RS System FY2026 review sheet 021848, consecutive budgets, consecutive/budgets JSON, fiscal_year 2026, 1 Sep 2026

Paid out: ¥100 billion, 27 Feb 2026. Printed as “1,000億円”. First equity payment into Rapidus (FY2025 money), alongside ¥1,676億 from 32 private investors. IPAは、次世代半導体の量産等に向けた金融支援として、選定事業者であるRapidus株式会社に対して、第三者割当増資による1,000億円の出資を行いました。 (As financial support for the mass production of next-generation semiconductors, IPA made a ¥100 billion equity investment, by third-party allotment, in Rapidus Corporation, the selected operator.) Information-technology Promotion Agency, Japan (IPA), プレス発表「次世代半導体の量産等に向けてRapidus株式会社に出資」, 概要, 27 Feb 2026

A part of the programme. MEXT's budget line for Fugaku's shared operation, the HPCI network and, since FY2024–25, RIKEN's development of the successor flagship (FugakuNEXT, operation targeted around 2030). FugakuNEXT is not a separate budget line: its FY2025 supplementary money (¥373億) sits inside this line, and FY2025 payments to RIKEN for the successor's basic design are reported as a separate payee group (kept among the line's figures). The line is MEXT's, outside METI's ¥10T framework. Its 執行額 is paid mainly to RIKEN (the developer and operator) and RIST as subsidies and contracts.

Voted by parliament: the HPCI line’s ¥73 billion FY2025 budget (initial, supplementary and carry-in), April 2025 to March 2026. Printed as “72970192000”. About $462M at the reference rate of 16 Jan 2026. レビューシート,2025,1658,革新的ハイパフォーマンス・コンピューティング・インフラ（ＨＰＣＩ）の構築,…,2025,18118300000,46021598000,8830294000,0,72970192000,0 (Review sheet 2025, project 1658, HPCI: FY2025 initial ¥18,118,300,000; supplementary ¥46,021,598,000; carried in ¥8,830,294,000; reserve 0; total current appropriation ¥72,970,192,000; execution 0 (not yet reported on that sheet)) Cabinet Secretariat Administrative Reform Promotion Office, RS System, RS System CSV 2-1_RS_2025_予算・執行_サマリ (2025 review sheets, budget and execution summary; data criteria date 19 January 2026), row 予算事業ID 1658, 予算年度 2025: 当初予算（合計）, 補正予算（合計）, 前年度からの繰越し（合計）, 計（歳出予算現額合計）

Spent: ¥26.8 billion by 31 Mar 2026. Printed as “26838149000”. 12 of the budget’s 12 months had passed. About $169M at the reference rate of 31 Mar 2026. {"name": "革新的ハイパフォーマンス・コンピューティング・インフラ（ＨＰＣＩ）の構築", "fiscal_year": 2025, "amount": 26838149000, "negative_amount_count": 0} (HPCI, FY2025 execution ¥26,838,149,000 (execution rate 36.8%; ¥46,103,996,000 carried into FY2026)) Cabinet Secretariat Administrative Reform Promotion Office, RS System (行政事業レビュー見える化サイト), RS System FY2026 review sheet 001658: 革新的ハイパフォーマンス・コンピューティング・インフラ（ＨＰＣＩ）の構築, consecutive executions, consecutive/executions JSON, fiscal_year 2025; page https://rssystem.go.jp/project/0b89419e-5872-4b62-86c8-7b6055461c74, 1 Sep 2026

Annual appropriation: ¥37.3 billion, 17 Nov 2025. Printed as “373億円”. FY2025 supplementary budget for developing and installing FugakuNEXT, from MEXT's supplementary-budget proposal (dated 17 Nov 2025 in its URL; this is the proposal, and the enacted HPCI supplementary of ¥46,021,598,000 equals 373 + 76 + 11 億円 for FugakuNEXT, AI-for-Science compute and Fugaku continuity). Mostly carried into FY2026. 「富岳」の次世代となる新たなフラッグシップシステムの 開発・整備 令和7年度補正予算額 373億円 (Development and installation of the new flagship system succeeding Fugaku: FY2025 supplementary budget ¥37.3 billion) Ministry of Education, Culture, Sports, Science and Technology (MEXT), 文部科学省 令和7年度補正予算（案）事業別資料, printed page 73, 「富岳」の次世代となる新たなフラッグシップシステムの開発・整備, 17 Nov 2025

Paid out: ¥7.24 billion, 31 Mar 2026. Printed as “7241694000”. FY2025 payment from this line to RIKEN for FugakuNEXT's basic design (a subsidy to the developer); included in the line's ¥26,838,149,000. "display_code":"B","payment_count":1,"overview":"「富岳」の次世代となる新たなフラッグシップシステムの基本設計の実施" … "amount":7241694000,"contract_method":"subsidy" … "overview":"次世代超高速電子計算機システムの開発・整備等","amount_breakdown":[{"name":"特定先端大型研究施設運営費等補助金","amount":7241694000 (Group B: RIKEN, 'basic design of the new flagship system succeeding Fugaku'; ¥7,241,694,000 paid as a subsidy for 'development and installation of the next-generation ultra-high-speed computer system' (Specified Advanced Large Research Facilities operating subsidy)) Cabinet Secretariat Administrative Reform Promotion Office, RS System (行政事業レビュー見える化サイト), RS System FY2026 review sheet 001658: 革新的ハイパフォーマンス・コンピューティング・インフラ（ＨＰＣＩ）の構築, payee groups (支出先) for FY2025, payment group B (国立研究開発法人理化学研究所); page https://rssystem.go.jp/project/0b89419e-5872-4b62-86c8-7b6055461c74, 1 Sep 2026

Annual appropriation: ¥2.51 million, 31 Mar 2026. Printed as “2506000”. A reserve-fund allocation (予備費等1) to the HPCI line in FY2025 that the FY2026 review sheet records and the 2025 summary (criteria date 19 January 2026) does not; with it the FY2026 sheet’s components for FY2025 come to ¥72,972,698,000 against the summary’s printed ¥72,970,192,000. Both government records are kept. "fiscal_year": 2025, … "budget_type": "reserve", "budget_type_name": "予備費等1", "finalized_amount": 2506000 (FY2025, reserve-fund allocation 1: ¥2,506,000) Cabinet Secretariat, Administrative Reform Promotion Office (RS System), RS System FY2026 review sheet 001658: 革新的ハイパフォーマンス・コンピューティング・インフラ（ＨＰＣＩ）の構築, consecutive budgets, consecutive/budgets JSON, fiscal_year 2025, budget_type_name 予備費等1, 1 Sep 2026

RS System (行政事業レビュー見える化サイト), bulk CSV: 2-1_RS_2025_予算・執行_サマリ.zip (2025 review sheets: budgets FY2021–FY2025 and execution FY2021–FY2024, criteria date 19 Jan 2026); the 2026 CSV is not yet posted (the site says from late September 2026); filtered for AI, semiconductor, HPCI, cloud and Fugaku project names across METI, MEXT, MIC, Cabinet Office and Digital Agency. Budgets and 執行額 for the post-5G line (3522), HPCI (1658), 先端半導体の国内生産拠点の確保 (19958), IPA equity (21848), AIST (21847, 7158) and others; 執行額 of the fund lines are transfers into NEDO funds. RS System (行政事業レビュー見える化サイト), bulk CSV, 2 Nov 2026

RS System public API (/api/projects/), FY2026 review sheets and fund sheets: FY2026 sheets (6,425 published at search time, incl. 328 fund sheets): review sheets 003522, 021848, 023118, 001658, 021847, 021359; fund sheets 017338, 021098, 021099 (Post-5G fund), 017018 (特定半導体基金), 017357 (cloud programme), 021101 (edge-AI); consecutive budgets/executions and payee groups. FY2025 actual fund outflows (事業費) and balances for every fund line; FY2025 執行額 for HPCI; no FY2025 execution recorded on the IPA equity sheet; payee group for FugakuNEXT basic design. RS System public API (/api/projects/), FY2026 review sheets and fund sheets, 2 Nov 2026

House of Representatives deposit of NEDO's statutory report on the Post-5G fund: 令和６年度特定公募型研究開発業務（ポスト５Ｇ）報告書 (FY2024, transmitted 21 Nov 2025): income and expenditure FY2019–FY2024 and FY2025 estimate by subsidy account; implementation decisions by year. Annual 事業費 FY2020–FY2024 by subsidy; the framework's AI-semiconductor subsidy (¥832,563m granted 17 Feb 2025) paid nothing in FY2024; FY2025 figures only as estimates. The FY2025 report (due about November 2026) was not found. House of Representatives deposit of NEDO's statutory report on the Post-5G fund, 2 Nov 2026

NEDO public notices of fund basic matters: Basic-matters notices for the Post-5G fund (as of 1 May 2026), the Specified Semiconductor Fund (as of 1 April 2025) and the Stable Supply Support Fund (as of 21 April 2026). Cumulative fund amounts ¥2,914,876m, ¥2,170,591m and ¥2,169,963m (the last covers all critical materials, not only cloud). NEDO public notices of fund basic matters, 2 Nov 2026

METI AI-semiconductor framework page and budget PR sheets: Framework page (updated 14 May 2026); Cabinet economic package of 22 Nov 2024 with 別紙１; PR sheets for FY2026 initial, FY2025 supplementary and FY2025 initial budgets. The FY2024 supplementary PR sheet returned an AWS WAF challenge (HTTP 202, not bypassed).. The ¥10T+ envelope (¥6T subsidies/contracts, ¥4T+ financial support, FY2024–FY2030); per-project budgets by year; no cumulative execution report for the framework. METI AI-semiconductor framework page and budget PR sheets, 2 Nov 2026

METI quarterly fund disbursement reports (新経済・財政再生計画改革工程表に基づく四半期ごとの支出状況と基金残高): R8_1.pdf (FY2025 Q3, Oct–Dec 2025) downloaded; later files (FY2025 Q4, FY2026 Q1–Q2) could not be fetched: METI's CloudFront WAF answered every further request with a challenge (HTTP 202, x-amzn-waf-action: challenge), which was not bypassed. FY2025 Q3 quarterly outflows: Post-5G fund ¥26,881m, 特定半導体基金 ¥87,831m, cloud programme ¥549m. Not used in the rows because full-year FY2025 actuals are available. METI quarterly fund disbursement reports (新経済・財政再生計画改革工程表に基づく四半期ごとの支出状況と基金残高), 2 Nov 2026

Ministry of Finance, Finance magazine (budget examiner's account of the FY2026 METI budget): ファイナンス 令和8年4月号, FY2026 METI budget article. FY2026 framework budget 計12,390億円 incl. IPA equity 1,500億円 and multimodal foundation models 3,873億円. Ministry of Finance, Finance magazine (budget examiner's account of the FY2026 METI budget), 2 Nov 2026

Ministry of Finance FY2026 budget chronology and FY2026 supplementary budget: FY2026 budget page (enactment dates) and 令和８年度補正予算（第１号）の概要 (3 Jun 2026). FY2026 budget enacted 7 Apr 2026 as proposed; the FY2026 supplementary (enacted 5 Jun 2026) holds energy-price support and reserves only, no AI or semiconductor items. Ministry of Finance FY2026 budget chronology and FY2026 supplementary budget, 2 Nov 2026

IPA press releases: Releases of 27 Feb 2026 and 5 Jun 2026 on equity in Rapidus. ¥1,000億 paid 27 Feb 2026; ¥1,500億 more by 5 Jun 2026; cumulative ¥2,500億. IPA press releases, 2 Nov 2026

MEXT FY2025 supplementary budget documents: 令和7年度補正予算（案）事業別資料 (150 pages). FugakuNEXT development ¥373億; Fugaku continuity ¥11億; AI-for-Science compute ¥76億. MEXT FY2025 supplementary budget documents, 2 Nov 2026

Web search for a METI tally of execution under the AI-semiconductor framework: Queries for 'AI・半導体産業基盤強化フレーム これまでの支援実績 執行' (2024–2026 METI and regional METI bureau materials, METI policy evaluation 2025). Framework descriptions and project lists only; no cumulative execution or payment figure for the framework as a whole. Web search for a METI tally of execution under the AI-semiconductor framework, 2 Nov 2026

Board of Audit of Japan (会計検査院): Web search for 決算検査報告 / 特定検査 items on the Post-5G fund, Rapidus or semiconductor funds (FY2023–FY2025 reports); jbaudit.go.jp itself not crawled. No Board of Audit report on these funds was located; unverified whether one exists. Board of Audit of Japan (会計検査院), 2 Nov 2026

NEDO's FY2025 statutory report on the Post-5G fund (expected around November 2026; the FY2024 report was transmitted 21 Nov 2025) will split FY2025 事業費 by subsidy account, including the framework's own AI-semiconductor subsidy (¥917,516m); not yet found.

METI's quarterly fund reports for FY2025 Q4 and FY2026 Q1–Q2 would extend the fund payments past 31 March 2026; METI's WAF blocked the downloads on 2 Nov 2026 (challenge not bypassed). Retry from a normal browser session.

Whether a Board of Audit report covers the Post-5G fund, Rapidus support or the framework is unverified (jbaudit.go.jp not crawled).

The FY2025 review sheet for IPA's equity line shows no execution amount even though IPA paid ¥1,000億 on 27 Feb 2026; unverified whether the FY2025 appropriation was paid to IPA in FY2025 or carried over.

RIKEN's own spending on FugakuNEXT (its contracts with Fujitsu and NVIDIA) is not in these documents; RIKEN's FY2025 financial statements by segment were not examined.

Cumulative appropriations under the framework (FY2024 supplementary through FY2026 initial) are printed only year by year; no official cumulative total was found.

Accelerators: ~10,800

Model: NVIDIA H100 + NVIDIA HGX B200

Stage: Awarded

Physical hardware. SAKURA’s planned total after Hopper and B200 expansion, described in November 2024. Primary source, 12 Nov 2024

METI approved up to about ¥50.1 billion for its GPU cloud project in April 2024. Data Center Dynamics reported this subsidy ceiling as approximately US$324M on 19 April 2024. NVIDIA’s November 2024 account described an expansion from 2,000 to nearly 4,000 Hopper GPUs, plus HGX B200 systems, toward approximately 10,800 GPUs in total.

Primary source, 19 Apr 2024

Model: NVIDIA HGX + planned NVIDIA GB200 NVL72

Stage: Awarded

METI approved up to about ¥10.24 billion in April 2024. Data Center Dynamics reported this subsidy ceiling as approximately US$66M on 19 April 2024. NVIDIA reported that November that KDDI was building HGX systems and planning a liquid-cooled data centre with GB200 NVL72 racks.

Primary source, 19 Apr 2024

Accelerators: 1,600

Model: NVIDIA H200

Stage: Awarded

Physical hardware. Planned GPUs across Highreso’s two AI data centres, described in November 2024. Primary source, 12 Nov 2024

Highreso and Highreso Kagawa jointly received approval for up to about ¥7.70 billion in April 2024. NVIDIA’s November announcement described a planned 1,600 GPUs across two AI data centres, including H200 systems at Kagawa.

Primary source, 19 Apr 2024

Accelerators: >1,000

Model: NVIDIA Hopper (H100/H200)

Stage: Awarded

Physical hardware. RUTILEA’s Hopper capacity described in November 2024. Primary source, 12 Nov 2024

RUTILEA and AI Fukushima jointly received approval for up to about ¥2.56 billion in April 2024. NVIDIA’s November account described an expansion to more than 1,000 Hopper GPUs; AI Fukushima’s Okuma data centre had begun operating that September.

Primary source, 19 Apr 2024

Model: NVIDIA H200

Stage: Awarded

METI approved up to about ¥1.93 billion in April 2024. NVIDIA’s November announcement described GMO GPU Cloud’s H200 systems with Spectrum-X networking and BlueField-3 processors.

Primary source, 19 Apr 2024

Stage: Empanelled

Selected for GENIAC in February 2024 as one of seven institutions. Sakana’s announcement describes access to a GPU supercomputing cluster for several months in 2024.

The selection announcement gives no GPU count for Sakana’s allocation.

Primary source, 2 Feb 2024

Stage: Empanelled

Selected in GENIAC’s first three rounds, beginning in February 2024. Its July 2025 project develops an in-vehicle foundation model for autonomous driving, following work on the HERON vision-and-language model.

The July 2025 selection announcement gives no GPU allocation for Turing.

Primary source, 15 Jul 2025

Stage: Empanelled

Released PLaMo-100B-Pretrained in October 2024 following GENIAC’s first round. An August technical report described a separate pre-training experiment with a one-trillion-parameter mixture-of-experts model; the team reported stable training but insufficient evaluation of model performance.

The October 2024 release gives no GPU allocation for Preferred Elements.

Primary source, 15 Oct 2024

Stage: Empanelled

Selected for GENIAC twice in 2024. Its October announcement describes Japanese speech-model training with multilingual audio data and the release of the Kotoba SpeechGen beta; earlier Kotoba-Speech work addressed real-time Japanese–English translation.

The company’s October announcement gives no GPU allocation.

Primary source, 29 Oct 2024

Stage: Empanelled

Selected in October 2024 for a GENIAC dataset study with Macromill, Valright Advisory and Nippon Total Telemarketing. Their February 2025 announcement targeted roughly one million question-and-answer dialogue records from around 30,000 participants, alongside research on data management and access.

The cited selection concerns a dataset study; no GPU allocation is specified.

Primary source, 13 Feb 2025

Stage: Empanelled

Selected in February and October 2024 for GENIAC work on smaller language models. Company tests reported in January 2025 placed its 32-billion-parameter model above GPT-4 on mtbench and elyza-tasks.

The model announcement gives no GPU allocation for ABEJA.

Primary source, 27 Jan 2025

Stage: Empanelled

Released Tanuki-8×8B in August 2024 with GENIAC support. The laboratory first ran a seven-team development competition, then continued with the winning team to train the larger model.

The release announcement gives no GPU allocation for the laboratory.

Primary source, 30 Aug 2024

Stage: Empanelled

Selected for GENIAC in February 2024 and released Stockmark-LLM-100b that May. It trained the model on Japanese business information and designed it to withhold answers when it lacked the required knowledge, with planned retrieval-based integration of companies’ internal information.

The release announcement gives no GPU allocation for Stockmark.

Primary source, 16 May 2024

Accelerators: 256

Model: NVIDIA H100

Stage: Empanelled

Project allocation. H100 capacity for a six-month GENIAC project announced in October 2024. Primary source, 11 Oct 2024

Selected for GENIAC in October 2024. Ubitus announced a six-month project using 256 H100 GPUs to adapt Llama 3.1 405B for Chinese, Japanese and Korean tourism content.

Primary source, 11 Oct 2024

Model: NVIDIA H100 (via AWS EC2 P5)

Stage: Empanelled

Selected in October 2024 to develop models that structure unstructured documents, with planned use in DX Suite. AI inside’s CTO later reported using Amazon EC2 P5 instances for this research; AWS’s July 2025 account covers support for 12 GENIAC participants.

The AWS account reports shared programme usage; it gives no GPU count specific to AI inside.

Primary source, 10 Oct 2024

Stage: Empanelled

Selected for GENIAC’s third round in July 2025. Rakuten proposed a Japanese-language foundation model with greater memory of prior interactions, intended for personalised AI agents, alongside work on training and inference efficiency.

The selection announcement gives no GPU allocation for Rakuten.

Primary source, 15 Jul 2025

Stage: Empanelled

Selected for GENIAC’s third round in July 2025. The drug-discovery project combines Alivexis’s ModBind simulation technology with model training to predict the biological activity of small molecules.

The selection announcement gives no GPU allocation for Alivexis.

Primary source, 15 Jul 2025

Blackwell Blackwell-architecture GPUs are manufactured using a custom-built 4NP TSMC process NVIDIA, “NVIDIA Blackwell Platform Arrives to Power a New Era of Computing”, 2026-09-25

Blackwell Ultra Blackwell Ultra is manufactured using TSMC 4NP NVIDIA, “Inside NVIDIA Blackwell Ultra”, 2026-09-25

Hopper The full GH100 GPU that powers the H100 GPU is fabricated using the TSMC 4N process customized for NVIDIA NVIDIA, “NVIDIA Hopper Architecture In-Depth”, 2026-09-25