Supply Chain Interdependence — Named-Entity Bilateral Edges Across the AI Compute Supply Chain

Gringras, David

Supply Chain

2 corrections · latest Jul 15, 20262d

Who supplies whom across the AI compute chain, where the structure concentrates, whether that concentration is tightening, and what is moving through it now. Named-entity bilateral dependencies rather than market-share proxies; the hourglass of single-supplier and single-jurisdiction chokepoints; a four-dimension stress reading with adjustable weights; the semiconductor cycle that sets the near-term ceiling; and the forward supply model of what is buildable.

Dependency Graph

A directed graph of 15,011 deduplicated bilateral edges drawn from 21,037 raw relationship rows — licensed supply-chain pulls, SEC EDGAR and public-registry re-derivations, and CSET entity classification. Search by company; filter by country, category, or relationship type; export the propagation-relevant subgraph. The interactive canvas shows the public-provenance subset the SSR table below enumerates. How the graph is assembled

Entities

5,091

Unique organizations in the graph

Supply Chain Links

15,011

Bilateral supplier-customer relationships

Single-Source ExposuresNo-Alternative Dependencies

54

Relationships with no known alternativeLayer-by-layer concentration → Chokepoint AnatomySupplier relationships with no alternative known in the datasetLayer-by-layer concentration → Chokepoint Anatomy

Exposed EntitiesVulnerable Companies

26

Organizations with at least one sole-source upstream dependencyCompanies that depend on at least one supplier with no known alternative

Countries

84

Distinct countries among the named organizations

Avg. CriticalityAvg. Dependency Risk

3.08

Mean criticality score (1–10 scale)Average risk score across all relationships (higher = harder to replace)

Show top 500 supply-chain edges as a table (alternative to the interactive Cytoscape graph)

Top 500 of 15,011 supply-chain edges — single-source dependencies first, then by disclosed relationship value. This table draws only public-provenance edges — SEC EDGAR segment and >10%-customer disclosures, re-derived company and registry disclosures, and Scrutica research enrichments (chip-deployment chains, BIS cross-reference); licensed-database edges do not appear on this surface. Each row is one supplier → customer relationship between named companies; the fiscal-year column is populated where the underlying disclosure states its period.
Supplier	Customer	Category	Product / service	Fiscal year	Criticality	Sole source
TSMC	HiSilicon	foundry_services	Foundry services — HiSilicon Kirin/Ascend 910 at TSMC N7/N5 (TERMINATED May 2020)	—	10.0	Yes
Ajinomoto Co., Inc.	TSMC	substrates	ABF substrate material for CoWoS and InFO advanced packaging	—	10.0	Yes
TSMC	Apple	foundry_services	Foundry manufacturing of Apple silicon (A-series, M-series processors) at N3/N4 process nodes	—	10.0	Yes
ASML	TSMC	semiconductor_equipment	EUV lithography systems (TWINSCAN NXE/EXE series) for N5 process node patterning	—	10.0	Yes
TSMC	NVIDIA	advanced_packaging	CoWoS-S advanced packaging	—	10.0	Yes
SMIC	HiSilicon	foundry_services	Foundry services — HiSilicon Ascend 910B at SMIC N+2 (~7nm DUV)	—	10.0	Yes
Ajinomoto Co., Inc.	Samsung	substrates	ABF substrate material for I-Cube packaging	—	10.0	Yes
TSMC	Alphabet	foundry_services	Foundry manufacturing of TPU v6e (Trillium) on TSMC N5	—	10.0	Yes
TSMC	NVIDIA	foundry_services	Foundry services — GH100 die at N5 process node	—	10.0	Yes
TSMC	NVIDIA	foundry_services	Foundry services — GH100 die at N5 (5nm) process node (H200 reuses H100 compute die with upgraded HBM3e)	—	10.0	Yes
NVIDIA	NVIDIA Corporation / CoreWeave	gpu_accelerator	NVIDIA H100 SXM5 80GB GPU accelerators — Eos supercomputer deployment	—	10.0	Yes
TSMC	NVIDIA	advanced_packaging	CoWoS-S advanced packaging	—	10.0	Yes
Ajinomoto Co., Inc.	Shinko Electric	substrates	Ajinomoto Build-up Film (ABF) substrate material for FC-BGA packages	—	10.0	Yes
TSMC	NVIDIA	foundry_services	Foundry services — GH100 die at N5 process node	—	10.0	Yes
Ajinomoto Co., Inc.	Amkor	substrates	ABF substrate material for FOWLP	—	10.0	Yes
TSMC	Biren Technology	foundry_services	Foundry services — Biren BR100 at TSMC N7 (TERMINATED Oct 2023)	—	10.0	Yes
TSMC	NVIDIA	advanced_packaging	CoWoS-S advanced packaging for H200 SXM (larger interposer than H100 to accommodate 141GB HBM3e)	—	10.0	Yes
TSMC	NVIDIA	foundry_services	Foundry services — NVIDIA H100 GH100 die at N5 (5nm) process node	—	10.0	Yes
NVIDIA	Amazon.com, Inc.	gpu_accelerator	NVIDIA H100 SXM5 80GB GPU accelerators for EC2 P5 instances	—	10.0	Yes
ASML	TSMC	semiconductor_equipment	EUV lithography systems for N5 patterning	—	10.0	Yes
ASML	TSMC	semiconductor_equipment	EUV lithography systems	—	10.0	Yes
TSMC	NVIDIA	advanced_packaging	CoWoS-S advanced packaging	—	10.0	Yes
TSMC	NVIDIA	foundry_services	GH100 die at N5 foundry	—	10.0	Yes
TSMC	NVIDIA	foundry_services	GH100 die at N5 foundry	—	10.0	Yes
Ajinomoto Co., Inc.	Ibiden	substrates	Ajinomoto Build-up Film (ABF) substrate material for FC-BGA packages	—	10.0	Yes
Ajinomoto Co., Inc.	Unimicron	substrates	Ajinomoto Build-up Film (ABF) substrate material for FC-BGA packages	—	10.0	Yes
ASML	TSMC	semiconductor_equipment	EUV lithography systems for N5	—	10.0	Yes
NVIDIA	Oracle Corporation	gpu_accelerator	NVIDIA H100 SXM5 80GB GPU accelerators for OCI Supercluster	—	10.0	Yes
NVIDIA	Microsoft Corporation	gpu_accelerator	NVIDIA H100 SXM5 80GB GPU accelerators	—	10.0	Yes
TSMC	Alphabet	foundry_services	Foundry manufacturing of TPU v5e silicon (process node unverified)	—	10.0	Yes
TSMC	Moore Threads	foundry_services	Foundry services — Moore Threads Chunxiao GPU (in MTT S80) at TSMC N7 (TERMINATED Oct 2023)	—	10.0	Yes
TSMC	Alphabet	foundry_services	Foundry manufacturing of TPU v4 silicon (process node unverified)	—	10.0	Yes
TSMC	NVIDIA	advanced_packaging	CoWoS-S advanced packaging	—	10.0	Yes
ASML	TSMC	semiconductor_equipment	EUV lithography systems	—	10.0	Yes
ASML	TSMC	semiconductor_equipment	EUV lithography systems	—	10.0	Yes
TSMC	Alphabet	foundry_services	Foundry manufacturing of TPU v5p silicon on TSMC N5	—	10.0	Yes
TSMC	Alibaba	foundry_services	5nm foundry manufacturing for Yitian 710 server CPU (T-Head design)	—	10.0	Yes
ASML	TSMC	semiconductor_equipment	EUV lithography systems for N5	—	10.0	Yes
NVIDIA	CoreWeave	gpu_accelerator	NVIDIA H200 SXM GPU accelerators	—	10.0	Yes
NVIDIA	xAI	gpu_accelerator	NVIDIA H100 SXM5 80GB GPU accelerators	—	10.0	Yes
Ajinomoto Co., Inc.	Intel	substrates	ABF substrate material for EMIB and Foveros packaging	—	10.0	Yes
ASML	SMIC	semiconductor_equipment	DUV ArF immersion lithography (NXT:2000i). EUV blocked by Dutch export controls.	—	10.0	Yes
TSMC	NVIDIA	advanced_packaging	CoWoS-S advanced packaging	—	10.0	Yes
NVIDIA	Meta Platforms, Inc.	gpu_accelerator	NVIDIA H100 SXM5 80GB GPU accelerators — 100,000 unit deployment	—	10.0	Yes
TSMC	NVIDIA	advanced_packaging	CoWoS-S advanced packaging — integrating GH100 compute die with HBM3 stacks	—	10.0	Yes
AMD	Hygon Information Technology Co., Ltd.	other	AMD Zen x86 architecture license via TISC JV (TERMINATED June 2019)	—	10.0	Yes
TSMC	NVIDIA	foundry_services	Foundry services — GH100 die at N5 (5nm) process node	—	10.0	Yes
SMIC	Huawei Technologies	foundry_services	Foundry for Kirin/Ascend chips at N+2 (7nm-class DUV)	—	9.0	Yes
NVIDIA	Meta Platforms, Inc.	gpu_accelerator	NVIDIA A100 GPU accelerators (SXM4 and PCIe variants)	—	9.0	Yes
TSMC	NVIDIA	foundry_services	Foundry services — GA100 die at N7 (7nm) process node	—	9.0	Yes
GlobalFoundries	Enflame Technology (Suiyuan)	foundry_services	Foundry services — Enflame CloudBlazer DTU at GlobalFoundries 12LP FinFET	FY2019	9.0	Yes
TSMC	Alphabet	advanced_packaging	CoWoS advanced packaging for TPU v5p/v6e with HBM stacks	—	9.0	Yes
Alphabet	Alphabet	networking	Inter-Chip Interconnect (ICI) — Google's custom optical/electrical TPU pod network	—	9.0	Yes
Alphabet	Alphabet	networking	ICI (Inter-Chip Interconnect) networking for TPU v5p pods	—	9.0	Yes
TSMC	Iluvatar CoreX	foundry_services	Foundry services — Iluvatar CoreX TianGai-100 7nm GPGPU (first domestic 7nm GPGPU, released Jan 2021; foundry unverified but TSMC inferred from process node)	—	9.0	Yes
Alphabet	Alphabet	gpu_accelerator	Google TPU v4 ASIC — custom AI accelerator designed and deployed by Google	—	8.0	Yes
NVIDIA	xAI	networking	InfiniBand HDR/NDR networking — NVLink switch fabric for H100 SXM5 inter-GPU interconnect	—	8.0	Yes
NVIDIA	Microsoft Corporation	networking	InfiniBand NDR interconnect for Azure Eagle cluster fabric	—	8.0	Yes
NVIDIA	CoreWeave	networking	InfiniBand NDR networking — CoreWeave GPU-native cloud fabric	—	8.0	Yes
NVIDIA	Meta Platforms, Inc.	networking	InfiniBand HDR (200 Gb/s) cluster networking for RSC	—	8.0	Yes
NVIDIA	NVIDIA Corporation / CoreWeave	networking	InfiniBand NDR switching and networking — NVIDIA Quantum-2 InfiniBand	—	8.0	Yes
NVIDIA	Amazon.com, Inc.	networking	Elastic Fabric Adapter (EFA) over InfiniBand NDR — P5 instance networking	—	8.0	Yes
Alphabet	Alphabet	gpu_accelerator	Google TPU v5p ASIC	—	8.0	Yes
Broadcom Inc.	WT Microelectronics	networking	SEC >10% customer disclosure	FY2025	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	FY2021	—	No
Broadcom Inc.	WT Microelectronics	networking	SEC segment disclosure: BROADCOM INC → WT MICROELECTRONICS CO LTD	FY2024	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	FY2020	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	FY2019	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	FY2022	—	No
UNITED PARCEL SERVICE INC	Amazon.com, Inc.	other	SEC segment disclosure: UNITED PARCEL SERVICE INC → AMAZON.COM INC	FY2021	—	No
UNITED PARCEL SERVICE INC	Amazon.com, Inc.	other	SEC segment disclosure: UNITED PARCEL SERVICE INC → AMAZON.COM INC	FY2022	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	FY2018	—	No
UNITED PARCEL SERVICE INC	Amazon.com, Inc.	other	SEC segment disclosure: UNITED PARCEL SERVICE INC → AMAZON.COM INC	FY2020	—	No
UNITED PARCEL SERVICE INC	Amazon.com, Inc.	other	SEC segment disclosure: UNITED PARCEL SERVICE INC → AMAZON.COM INC	FY2024	—	No
UNITED PARCEL SERVICE INC	Amazon.com, Inc.	other	SEC segment disclosure: UNITED PARCEL SERVICE INC → AMAZON.COM INC	FY2023	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	FY2023	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	FY2011	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	FY2024	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	FY2014	—	No
Intel	Dell Technologies	gpu_accelerator	SEC >10% customer disclosure	FY2025	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	FY2017	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	FY2012	—	No
Intel	Lenovo Group	gpu_accelerator	SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD	FY2021	—	No
Intel	Lenovo Group	gpu_accelerator	SEC >10% customer disclosure	FY2019	—	No
Intel	Lenovo Group	gpu_accelerator	SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD	FY2020	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	FY2010	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	FY2013	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	FY2014	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	FY2016	—	No
UNITED PARCEL SERVICE INC	Amazon.com, Inc.	other	SEC segment disclosure: UNITED PARCEL SERVICE INC → AMAZON.COM INC	FY2019	—	No
Intel	Lenovo Group	gpu_accelerator	SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD	FY2018	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	FY2015	—	No
Intel	Lenovo Group	gpu_accelerator	SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD	FY2017	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	FY2011	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	FY2019	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	FY2013	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	FY2021	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	FY2018	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	FY2020	—	No
Intel	Lenovo Group	gpu_accelerator	SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD	FY2022	—	No
Broadcom Inc.	WT Microelectronics	networking	SEC segment disclosure: BROADCOM INC → WT MICROELECTRONICS CO LTD	FY2023	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	FY2008	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	FY2012	—	No
Intel	Lenovo Group	gpu_accelerator	SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD	FY2024	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	FY2010	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	FY2005	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	FY2009	—	No
Intel	Lenovo Group	gpu_accelerator	SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD	FY2015	—	No
Broadcom Inc.	Apple	networking	SEC segment disclosure: BROADCOM INC → APPLE INC	FY2023	—	No
TD SYNNEX Corp	Apple	other	SEC segment disclosure: TD SYNNEX CORP → APPLE INC	FY2024	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	FY2022	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	FY2017	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	FY2007	—	No
TD SYNNEX Corp	Apple	other	SEC segment disclosure: TD SYNNEX CORPORATION → APPLE INC	FY2022	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	FY2008	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	FY2006	—	No
Intel	Lenovo Group	gpu_accelerator	SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD	FY2014	—	No
Broadcom Inc.	WT Microelectronics	networking	SEC segment disclosure: BROADCOM INC → WT MICROELECTRONICS CO LTD	FY2022	—	No
Broadcom Inc.	Apple	networking	SEC segment disclosure: BROADCOM INC → APPLE INC	FY2022	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	FY2007	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	FY2004	—	No
Jabil	Apple	other	SEC segment disclosure: JABIL INC → APPLE INC	FY2021	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	FY2024	—	No
Jabil	Apple	other	SEC segment disclosure: JABIL INC → APPLE INC	FY2022	—	No
Intel	Lenovo Group	gpu_accelerator	SEC >10% customer disclosure	FY2025	—	No
Intel	HP Inc	gpu_accelerator	SEC >10% customer disclosure	FY2025	—	No
TD SYNNEX Corp	Apple	other	SEC segment disclosure: TD SYNNEX CORPORATION → APPLE INC	FY2023	—	No
Intel	Lenovo Group	gpu_accelerator	SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD	FY2013	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	FY2005	—	No
Jabil	Apple	other	SEC segment disclosure: JABIL INC → APPLE INC	FY2018	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	FY2009	—	No
Intel	Lenovo Group	gpu_accelerator	SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD	FY2023	—	No
Tech Data Corp.	Apple	other	SEC segment disclosure: TECH DATA CORP → APPLE INC	FY2019	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	FY2016	—	No
Tech Data Corp.	Apple	other	SEC segment disclosure: TECH DATA CORP → APPLE INC	FY2020	—	No
Jabil	Apple	other	SEC segment disclosure: JABIL INC → APPLE INC	FY2023	—	No
Intel	Lenovo Group	gpu_accelerator	SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD	FY2012	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	FY2003	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	FY2006	—	No
Jabil	Apple	other	SEC segment disclosure: JABIL INC → APPLE INC	FY2019	—	No
Broadcom Inc.	Apple	networking	SEC segment disclosure: BROADCOM INC → APPLE INC	FY2021	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	FY2004	—	No
Jabil	Apple	other	SEC segment disclosure: JABIL INC → APPLE INC	FY2020	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	FY2023	—	No
Sharp	Apple	other	SEC segment disclosure: SHARP CORP → APPLE INC	FY2018	—	No
Micron	HP Inc	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC	FY2006	—	No
Broadcom Inc.	Apple	networking	SEC segment disclosure: BROADCOM INC → APPLE INC	FY2018	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC >10% customer disclosure	FY2022	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	FY2022	—	No
Sharp	Apple	other	SEC segment disclosure: SHARP CORP → APPLE INC	FY2019	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC >10% customer disclosure	FY2023	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	FY2023	—	No
Broadcom Inc.	WT Microelectronics	networking	SEC segment disclosure: BROADCOM INC → WT MICROELECTRONICS CO LTD	FY2021	—	No
Microsoft Corporation	Dell Technologies	software_ip	SEC segment disclosure: MICROSOFT CORP → DELL TECHNOLOGIES INC	FY2006	—	No
Sharp	Apple	other	SEC segment disclosure: SHARP CORP → APPLE INC	FY2020	—	No
Sharp	Apple	other	SEC segment disclosure: SHARP CORP → APPLE INC	FY2021	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD	FY2021	—	No
Jabil	Apple	other	SEC segment disclosure: JABIL INC → APPLE INC	FY2017	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	FY2003	—	No
Broadcom Inc.	Apple	networking	SEC segment disclosure: BROADCOM INC → APPLE INC	FY2019	—	No
Samsung	Qualcomm Inc	other	General Computer Hardware supply	—	8.0	No
Qualcomm Inc	Samsung	other	General Computer Hardware procurement	—	8.0	No
Qualcomm Inc	Xiaomi Corporation	networking	Wireless Mobile Equipment procurement	—	4.0	No
Qualcomm Inc	Apple	gpu_accelerator	Specialized Semiconductors supply	—	3.0	No
Jabil	Apple	other	SEC segment disclosure: JABIL INC → APPLE INC	FY2016	—	No
Intel	COMPAQ COMPUTER CORP	gpu_accelerator	SEC segment disclosure: INTEL CORP → COMPAQ COMPUTER CORP	FY2000	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	FY2000	—	No
Jabil	Apple	other	SEC segment disclosure: JABIL INC → APPLE INC	FY2015	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	FY2002	—	No
Tech Data Corp.	Cisco	other	SEC segment disclosure: TECH DATA CORP → CISCO SYSTEMS INC	FY2019	—	No
Intel	HP Inc	gpu_accelerator	SEC segment disclosure: INTEL CORP → HP INC	FY2002	—	No
Microsoft Corporation	Dell Technologies	software_ip	SEC segment disclosure: MICROSOFT CORP → DELL TECHNOLOGIES INC	FY2005	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC >10% customer disclosure	FY2023	—	No
Broadcom Inc.	WT Microelectronics	networking	SEC segment disclosure: BROADCOM INC → WT MICROELECTRONICS CO LTD	FY2019	—	No
Sharp	Apple	other	SEC segment disclosure: SHARP CORP → APPLE INC	FY2023	—	No
Intel	COMPAQ COMPUTER CORP	gpu_accelerator	SEC segment disclosure: INTEL CORP → COMPAQ COMPUTER CORP	FY1999	—	No
Intel	Dell Technologies	gpu_accelerator	SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC	FY1999	—	No
Tech Data Corp.	Cisco	other	SEC segment disclosure: TECH DATA CORP → CISCO SYSTEMS INC	FY2020	—	No
Micron	Kingston Technology Company, Inc.	memory	SEC >10% customer disclosure	FY2022	—	No
Microsoft Corporation	Dell Technologies	software_ip	SEC segment disclosure: MICROSOFT CORP → DELL TECHNOLOGIES INC	FY2004	—	No
Jabil	Amazon.com, Inc.	other	SEC segment disclosure: JABIL INC → AMAZON.COM INC	FY2022	—	No
Micron	WPG Holding	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → WPG HOLDINGS	FY2021	—	No
Broadcom Inc.	Apple	networking	SEC segment disclosure: BROADCOM INC → APPLE INC	FY2020	—	No
Broadcom Inc.	Apple	networking	SEC segment disclosure: BROADCOM INC → APPLE INC	FY2017	—	No
Sharp	Apple	other	SEC segment disclosure: SHARP CORP → APPLE INC	FY2022	—	No
Jabil	Apple	other	SEC segment disclosure: JABIL INC → APPLE INC	FY2013	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	FY2021	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC >10% customer disclosure	FY2021	—	No
Sharp	Apple	other	SEC segment disclosure: SHARP CORP → APPLE INC	FY2013	—	No
Micron	WPG Holding	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → WPG HOLDINGS	FY2022	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD	FY2017	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD	FY2024	—	No
Skyworks Solutions	Apple	other	SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC	FY2022	—	No
Jabil	Apple	other	SEC segment disclosure: JABIL INC → APPLE INC	FY2024	—	No
Skyworks Solutions	Apple	other	SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC	FY2023	—	No
Broadcom Inc.	WT Microelectronics	networking	SEC segment disclosure: BROADCOM INC → WT MICROELECTRONICS CO LTD	FY2020	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	FY2020	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC >10% customer disclosure	FY2020	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD	FY2020	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD	FY2022	—	No
Skyworks Solutions	Apple	other	SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC	FY2021	—	No
Intel	COMPAQ COMPUTER CORP	gpu_accelerator	SEC segment disclosure: INTEL CORP → COMPAQ COMPUTER CORP	FY1997	—	No
Jabil	Amazon.com, Inc.	other	SEC segment disclosure: JABIL INC → AMAZON.COM INC	FY2020	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC >10% customer disclosure	FY2024	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	FY2024	—	No
Skyworks Solutions	Apple	other	SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC	FY2024	—	No
Sharp	Apple	other	SEC segment disclosure: SHARP CORP → APPLE INC	FY2024	—	No
Jabil	Apple	other	SEC segment disclosure: JABIL INC → APPLE INC	FY2014	—	No
NXP	Avnet	other	Other IT Distributors procurement	—	8.0	No
Micron	Huawei Technologies	memory	SEC >10% customer disclosure	FY2019	—	No
NXP Semiconductors NV	Avnet	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC	FY2023	—	No
NXP Semiconductors NV	Avnet	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC	FY2024	—	No
Skyworks Solutions	Apple	other	Analog and Mixed Signal Semiconductors supply	—	8.0	No
Skyworks Solutions	Apple	other	SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC	FY2025	—	No
STMicroelectronics	Apple	other	SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC	FY2022	—	No
NXP Semiconductors NV	Avnet	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC	FY2022	—	No
STMicroelectronics	Apple	other	SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC	FY2021	—	No
Applied Materials	Intel	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP	FY2022	—	No
Micron	Kingston Technology Company, Inc.	memory	SEC >10% customer disclosure	FY2019	—	No
Broadcom Inc.	Foxconn	networking	SEC segment disclosure: BROADCOM INC → FOXCONN TECHNOLOGY CO LTD	FY2017	—	No
AUO	Samsung	other	SEC segment disclosure: AUO CORPORATION → SAMSUNG ELECTRONICS CO LTD	FY2010	—	No
STMicroelectronics	Apple	other	SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC	FY2020	—	No
Micron	Kingston Technology Company, Inc.	memory	SEC >10% customer disclosure	FY2020	—	No
Arista Networks	Microsoft Corporation	networking	SEC >10% customer disclosure	FY2025	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD	FY2018	—	No
Jabil	Apple	other	SEC segment disclosure: JABIL INC → APPLE INC	FY2012	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	FY2017	—	No
SOLECTRON CORP	Cisco	other	SEC segment disclosure: SOLECTRON CORP → CISCO SYSTEMS INC	FY2001	—	No
Jabil	Cisco	other	SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC	FY2011	—	No
STMicroelectronics	Apple	other	SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC	FY2023	—	No
NOV INC	Samsung Heavy Industries Co., Ltd.	other	SEC segment disclosure: NOV INC → SAMSUNG HEAVY INDUSTRIES CO	FY2010	—	No
NOV INC	Samsung Heavy Industries Co., Ltd.	other	SEC segment disclosure: NOV INC → SAMSUNG HEAVY INDUSTRIES CO	FY2013	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC >10% customer disclosure	FY2019	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	FY2019	—	No
Jabil	Cisco	other	SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC	FY2008	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	FY2013	—	No
Jabil	Cisco	other	SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC	FY2010	—	No
NOV INC	Samsung Heavy Industries Co., Ltd.	other	SEC segment disclosure: NOV INC → SAMSUNG HEAVY INDUSTRIES CO	FY2012	—	No
Amkor	Apple	foundry_services	Semiconductor Manufacturing Services supply	—	3.0	No
NXP Semiconductors NV	Avnet	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC	FY2021	—	No
Marvell Technology	Wintech Digital Systems Technology Corp	networking	SEC >10% customer disclosure	FY2025	—	No
Amkor	Apple	other	SEC segment disclosure: AMKOR TECHNOLOGY INC → APPLE INC	FY2024	—	No
AUO	Samsung	other	SEC segment disclosure: AUO CORPORATION → SAMSUNG ELECTRONICS CO LTD	FY2012	—	No
AUO	Samsung	other	SEC segment disclosure: AUO CORPORATION → SAMSUNG ELECTRONICS CO LTD	FY2013	—	No
STMicroelectronics	Apple	other	SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC	FY2024	—	No
SK Hynix	Essencore Ltd.	other	Semiconductors procurement	—	3.0	No
AUO	Samsung	other	SEC segment disclosure: AUO CORPORATION → SAMSUNG ELECTRONICS CO LTD	FY2008	—	No
Qualcomm Inc	Samsung	gpu_accelerator	SEC segment disclosure: QUALCOMM INC → SAMSUNG ELECTRONICS CO LTD	FY2012	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	FY2014	—	No
Applied Materials	Intel	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP	FY2018	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	FY2018	—	No
AUO	Samsung	other	SEC segment disclosure: AUO CORPORATION → SAMSUNG ELECTRONICS CO LTD	FY2009	—	No
Qualcomm Inc	HTC	gpu_accelerator	SEC segment disclosure: QUALCOMM INC → HTC CORPORATION	FY2011	—	No
Qualcomm Inc	Samsung	gpu_accelerator	SEC segment disclosure: QUALCOMM INC → SAMSUNG ELECTRONICS CO LTD	FY2011	—	No
SOLECTRON CORP	Cisco	other	SEC segment disclosure: SOLECTRON CORP → CISCO SYSTEMS INC	FY2006	—	No
AUO	Samsung	other	SEC segment disclosure: AUO CORPORATION → SAMSUNG ELECTRONICS CO LTD	FY2007	—	No
Skyworks Solutions	Apple	other	SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC	FY2020	—	No
Broadcom Inc.	Foxconn	networking	SEC segment disclosure: BROADCOM INC → FOXCONN TECHNOLOGY CO LTD	FY2018	—	No
Qualcomm Inc	LG Electronics	gpu_accelerator	SEC segment disclosure: QUALCOMM INC → LG ELECTRONICS INC	FY2009	—	No
Jabil	Cisco	other	SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC	FY2007	—	No
Micron	Intel	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP	FY2017	—	No
Skyworks Solutions	Apple	other	SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC	FY2018	—	No
Amkor	Apple	other	SEC segment disclosure: AMKOR TECHNOLOGY INC → APPLE INC	FY2023	—	No
Qualcomm Inc	LG Electronics	gpu_accelerator	SEC segment disclosure: QUALCOMM INC → LG ELECTRONICS INC	FY2008	—	No
Broadcom Inc.	Samsung	networking	SEC segment disclosure: BROADCOM CORP → SAMSUNG ELECTRONICS CO LTD	FY2013	—	No
Applied Materials	Intel	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP	FY2019	—	No
Qorvo	Apple	other	SEC segment disclosure: QORVO INC → APPLE INC	FY2025	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD	FY2012	—	No
Micron	Intel	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP	FY2016	—	No
Qorvo	Apple	other	SEC segment disclosure: QORVO INC → APPLE INC	FY2024	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	FY2016	—	No
Skyworks Solutions	Apple	other	SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC	FY2019	—	No
Jabil	Cisco	other	SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC	FY2012	—	No
STMicroelectronics	Apple	other	Analog and Mixed Signal Semiconductors supply	—	3.0	No
SOLECTRON CORP	Cisco	other	SEC segment disclosure: SOLECTRON CORP → CISCO SYSTEMS INC	FY2000	—	No
Cirrus Logic	Apple	other	SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC	FY2025	—	No
Cirrus Logic	Apple	other	Analog and Mixed Signal Semiconductors supply	—	3.0	No
STMicroelectronics	Apple	other	SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC	FY2019	—	No
Freescale Semiconductor, Inc.	Motorola Solutions	other	SEC segment disclosure: FREESCALE SEMICONDUCTOR INC → MOTOROLA SOLUTIONS INC	FY2006	—	No
Qualcomm Inc	LG Electronics	gpu_accelerator	SEC segment disclosure: QUALCOMM INC → LG ELECTRONICS INC	FY2010	—	No
SOLECTRON CORP	Cisco	other	SEC segment disclosure: SOLECTRON CORP → CISCO SYSTEMS INC	FY2005	—	No
AUO	Samsung	other	SEC segment disclosure: AUO CORPORATION → SAMSUNG ELECTRONICS CO LTD	FY2011	—	No
Freescale Semiconductor, Inc.	Motorola Solutions	other	SEC segment disclosure: FREESCALE SEMICONDUCTOR INC → MOTOROLA SOLUTIONS INC	FY2005	—	No
Cirrus Logic	Apple	other	SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC	FY2023	—	No
Qualcomm Inc	Samsung	gpu_accelerator	SEC segment disclosure: QUALCOMM INC → SAMSUNG ELECTRONICS CO LTD	FY2008	—	No
Cirrus Logic	Apple	other	SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC	FY2024	—	No
FIH Mobile	Foxconn	advanced_packaging	Contract Electronic Manufacturing supply	—	8.0	No
SOLECTRON CORP	Cisco	other	SEC segment disclosure: SOLECTRON CORP → CISCO SYSTEMS INC	FY2004	—	No
Qorvo	Apple	other	SEC segment disclosure: QORVO INC → APPLE INC	FY2022	—	No
Jabil	Cisco	other	SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC	FY2009	—	No
ACTIVISION BLIZZARD INC	Apple	other	SEC segment disclosure: ACTIVISION BLIZZARD INC → APPLE INC	FY2022	—	No
NOV INC	Samsung Heavy Industries Co., Ltd.	other	SEC segment disclosure: NOV INC → SAMSUNG HEAVY INDUSTRIES CO	FY2014	—	No
Match Group	Alphabet	other	SEC segment disclosure: MATCH GROUP INC → ALPHABET INC	FY2013	—	No
ACTIVISION BLIZZARD INC	Alphabet	other	SEC segment disclosure: ACTIVISION BLIZZARD INC → ALPHABET INC	FY2021	—	No
ACTIVISION BLIZZARD INC	Apple	other	SEC segment disclosure: ACTIVISION BLIZZARD INC → APPLE INC	FY2021	—	No
AUO	Samsung	other	SEC segment disclosure: AUO CORPORATION → SAMSUNG ELECTRONICS CO LTD	FY2017	—	No
Micron	HP Inc	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC	FY2014	—	No
NXP Semiconductors NV	Avnet	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC	FY2020	—	No
Amkor	Apple	other	SEC segment disclosure: AMKOR TECHNOLOGY INC → APPLE INC	FY2022	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	FY2015	—	No
AMD	HP Inc	gpu_accelerator	SEC segment disclosure: ADVANCED MICRO DEVICES → HP INC	FY2011	—	No
Arista Networks	Meta Platforms, Inc.	networking	SEC >10% customer disclosure	FY2025	—	No
Texas Instruments	Apple	other	SEC segment disclosure: TEXAS INSTRUMENTS INC → APPLE INC	FY2015	—	No
Cirrus Logic	Apple	other	SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC	FY2022	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD	FY2016	—	No
Arista Networks	Microsoft Corporation	networking	SEC segment disclosure: ARISTA NETWORKS INC → MICROSOFT CORP	FY2024	—	No
ZYNGA INC	Apple	other	SEC segment disclosure: ZYNGA INC → APPLE INC	FY2021	—	No
Match Group	Alphabet	other	SEC segment disclosure: MATCH GROUP INC → ALPHABET INC	FY2014	—	No
AMD	HP Inc	gpu_accelerator	SEC segment disclosure: ADVANCED MICRO DEVICES → HP INC	FY2010	—	No
Match Group	Alphabet	other	SEC segment disclosure: MATCH GROUP INC → ALPHABET INC	FY2012	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	FY2012	—	No
AUO	Samsung	other	SEC segment disclosure: AUO CORPORATION → SAMSUNG ELECTRONICS CO LTD	FY2021	—	No
NXP Semiconductors NV	Avnet	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC	FY2017	—	No
Broadcom Inc.	Samsung	networking	SEC segment disclosure: BROADCOM CORP → SAMSUNG ELECTRONICS CO LTD	FY2012	—	No
Freescale Semiconductor, Inc.	Motorola Solutions	other	SEC segment disclosure: FREESCALE SEMICONDUCTOR INC → MOTOROLA SOLUTIONS INC	FY2007	—	No
ACTIVISION BLIZZARD INC	Alphabet	other	SEC segment disclosure: ACTIVISION BLIZZARD INC → ALPHABET INC	FY2022	—	No
Qualcomm Inc	Samsung	gpu_accelerator	SEC segment disclosure: QUALCOMM INC → SAMSUNG ELECTRONICS CO LTD	FY2009	—	No
SOLECTRON CORP	Cisco	other	SEC segment disclosure: SOLECTRON CORP → CISCO SYSTEMS INC	FY2002	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD	FY2010	—	No
GlobalFoundries	Qualcomm Inc	foundry_services	SEC segment disclosure: GLOBALFOUNDRIES INC → QUALCOMM INC	FY2022	—	No
Marvell Technology	Wintech Digital Systems Technology Corp	networking	SEC >10% customer disclosure	FY2024	—	No
Qorvo	Apple	other	SEC segment disclosure: QORVO INC → APPLE INC	FY2023	—	No
NXP Semiconductors NV	Avnet	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC	FY2018	—	No
Micron	Intel	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP	FY2014	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD	FY2008	—	No
Freescale Semiconductor, Inc.	Motorola Solutions	other	SEC segment disclosure: FREESCALE SEMICONDUCTOR INC → MOTOROLA SOLUTIONS INC	FY2002	—	No
Micron	Intel	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP	FY2015	—	No
ZYNGA INC	Alphabet	other	SEC segment disclosure: ZYNGA INC → ALPHABET INC	FY2021	—	No
GlobalFoundries	Qualcomm Inc	foundry_services	SEC segment disclosure: GLOBALFOUNDRIES INC → QUALCOMM INC	FY2023	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	FY2017	—	No
NEWELL BRANDS INC	Amazon.com, Inc.	other	SEC segment disclosure: NEWELL BRANDS INC → AMAZON.COM INC	FY2021	—	No
ELECTRONIC ARTS INC	Microsoft Corporation	other	SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP	FY2025	—	No
STMicroelectronics	Apple	other	SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC	FY2018	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD	FY2011	—	No
SANDISK CORP -OLD	Apple	other	SEC segment disclosure: SANDISK CORP -OLD → APPLE INC	FY2014	—	No
SOLECTRON CORP	Cisco	other	SEC segment disclosure: SOLECTRON CORP → CISCO SYSTEMS INC	FY2003	—	No
NXP Semiconductors NV	Avnet	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC	FY2019	—	No
Cirrus Logic	Apple	other	SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC	FY2018	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	FY2015	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	FY2022	—	No
NXP Semiconductors NV	Avnet	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC	FY2016	—	No
SANDISK CORP -OLD	Apple	other	SEC segment disclosure: SANDISK CORP -OLD → APPLE INC	FY2013	—	No
Arista Networks	Meta Platforms, Inc.	networking	SEC segment disclosure: ARISTA NETWORKS INC → META PLATFORMS INC	FY2023	—	No
NEWELL BRANDS INC	Amazon.com, Inc.	other	SEC segment disclosure: NEWELL BRANDS INC → AMAZON.COM INC	FY2022	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	FY2016	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	FY2024	—	No
Cirrus Logic	Apple	other	SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC	FY2017	—	No
ACTIVISION BLIZZARD INC	Apple	other	SEC segment disclosure: ACTIVISION BLIZZARD INC → APPLE INC	FY2020	—	No
ELECTRONIC ARTS INC	Microsoft Corporation	other	SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP	FY2024	—	No
Qorvo	Apple	other	SEC segment disclosure: QORVO INC → APPLE INC	FY2021	—	No
Freescale Semiconductor, Inc.	Motorola Solutions	other	SEC segment disclosure: FREESCALE SEMICONDUCTOR INC → MOTOROLA SOLUTIONS INC	FY2008	—	No
Freescale Semiconductor, Inc.	Motorola Solutions	other	SEC segment disclosure: FREESCALE SEMICONDUCTOR INC → MOTOROLA SOLUTIONS INC	FY2004	—	No
NVIDIA	Dell Technologies	gpu_accelerator	SEC segment disclosure: NVIDIA CORP → DELL TECHNOLOGIES INC	FY2020	—	No
AMD	HP Inc	gpu_accelerator	SEC segment disclosure: ADVANCED MICRO DEVICES → HP INC	FY2012	—	No
Applied Materials	Intel	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP	FY2016	—	No
Applied Materials	Micron	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → MICRON TECHNOLOGY INC	FY2016	—	No
ELECTRONIC ARTS INC	Microsoft Corporation	other	SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP	FY2023	—	No
CoreWeave	Microsoft Corporation	other	SEC segment disclosure: COREWEAVE INC → MICROSOFT CORP	FY2024	—	No
Marvell Technology	Wintech Digital Systems Technology Corp	networking	SEC >10% customer disclosure	FY2023	—	No
Broadcom Inc.	Apple	networking	SEC segment disclosure: BROADCOM CORP → APPLE INC	FY2014	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	FY2014	—	No
Broadcom Inc.	Apple	networking	SEC segment disclosure: BROADCOM CORP → APPLE INC	FY2012	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD	FY2007	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	FY2023	—	No
AUO	Samsung	other	SEC segment disclosure: AUO CORPORATION → SAMSUNG ELECTRONICS CO LTD	FY2020	—	No
AUO	Samsung	other	SEC segment disclosure: AUO CORPORATION → SAMSUNG ELECTRONICS CO LTD	FY2018	—	No
AUO	Samsung	other	SEC segment disclosure: AUO CORPORATION → SAMSUNG ELECTRONICS CO LTD	FY2016	—	No
Celestica	Cisco	other	SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC	FY2016	—	No
Arista Networks	Meta Platforms, Inc.	networking	SEC >10% customer disclosure	FY2022	—	No
NEWELL BRANDS INC	Amazon.com, Inc.	other	SEC segment disclosure: NEWELL BRANDS INC → AMAZON.COM INC	FY2024	—	No
Cirrus Logic	Apple	other	SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC	FY2021	—	No
SCI SYSTEMS INC	Apple	other	SEC segment disclosure: SCI SYSTEMS INC → APPLE INC	FY1997	—	No
Micron	HP Inc	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC	FY2015	—	No
ACTIVISION BLIZZARD INC	Alphabet	other	SEC segment disclosure: ACTIVISION BLIZZARD INC → ALPHABET INC	FY2020	—	No
Amdocs Ltd.	T-MOBILE US INC	other	SEC segment disclosure: AMDOCS → T-MOBILE US INC	FY2024	—	No
Amdocs Ltd.	T-MOBILE US INC	other	SEC segment disclosure: AMDOCS → T-MOBILE US INC	FY2023	—	No
NEWELL BRANDS INC	Amazon.com, Inc.	other	SEC segment disclosure: NEWELL BRANDS INC → AMAZON.COM INC	FY2020	—	No
Jabil	Cisco	other	SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC	FY2004	—	No
ACTIVISION BLIZZARD INC	Apple	other	SEC segment disclosure: ACTIVISION BLIZZARD INC → APPLE INC	FY2018	—	No
ACTIVISION BLIZZARD INC	Apple	other	SEC segment disclosure: ACTIVISION BLIZZARD INC → APPLE INC	FY2017	—	No
Kioxia	Sandisk	memory	Data Storage Hardware procurement	—	8.0	No
Sandisk	Kioxia	memory	Data Storage Hardware partnership	—	7.0	No
Freescale Semiconductor, Inc.	Motorola Solutions	other	SEC segment disclosure: FREESCALE SEMICONDUCTOR INC → MOTOROLA SOLUTIONS INC	FY2003	—	No
ELECTRONIC ARTS INC	Microsoft Corporation	other	SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP	FY2022	—	No
Micron	Intel	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP	FY2008	—	No
AUO	Samsung	other	SEC segment disclosure: AUO CORPORATION → SAMSUNG ELECTRONICS CO LTD	FY2019	—	No
Broadcom Inc.	Apple	networking	SEC segment disclosure: BROADCOM CORP → APPLE INC	FY2013	—	No
ACTIVISION BLIZZARD INC	Apple	other	SEC segment disclosure: ACTIVISION BLIZZARD INC → APPLE INC	FY2019	—	No
Micron	HP Inc	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC	FY2010	—	No
Celestica	Cisco	other	SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC	FY2017	—	No
Qualcomm Inc	Samsung	gpu_accelerator	SEC segment disclosure: QUALCOMM INC → SAMSUNG ELECTRONICS CO LTD	FY2010	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	FY2020	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	FY2018	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	FY2021	—	No
Qorvo	Apple	other	SEC segment disclosure: QORVO INC → APPLE INC	FY2018	—	No
Qorvo	Apple	other	SEC segment disclosure: QORVO INC → APPLE INC	FY2020	—	No
GlobalFoundries	Qualcomm Inc	foundry_services	SEC segment disclosure: GLOBALFOUNDRIES INC → QUALCOMM INC	FY2024	—	No
NEWELL BRANDS INC	Amazon.com, Inc.	other	SEC segment disclosure: NEWELL BRANDS INC → AMAZON.COM INC	FY2023	—	No
Arista Networks	Microsoft Corporation	networking	SEC segment disclosure: ARISTA NETWORKS INC → MICROSOFT CORP	FY2023	—	No
Applied Materials	Intel	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP	FY2011	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	FY2011	—	No
Arista Networks	Meta Platforms, Inc.	networking	SEC segment disclosure: ARISTA NETWORKS INC → META PLATFORMS INC	FY2024	—	No
Applied Materials	TSMC	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO	FY2010	—	No
NXP Semiconductors NV	Continental	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → CONTINENTAL AG	FY2018	—	No
Qorvo	Apple	other	SEC segment disclosure: QORVO INC → APPLE INC	FY2017	—	No
NXP Semiconductors NV	Continental	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → CONTINENTAL AG	FY2017	—	No
ELECTRONIC ARTS INC	Microsoft Corporation	other	SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP	FY2021	—	No
Cirrus Logic	Apple	other	SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC	FY2020	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD	FY2006	—	No
AUO	Samsung	other	SEC segment disclosure: AUO CORPORATION → SAMSUNG ELECTRONICS CO LTD	FY2006	—	No
GlobalFoundries	AMD	foundry_services	SEC segment disclosure: GLOBALFOUNDRIES INC → ADVANCED MICRO DEVICES	FY2020	—	No
Jabil	Cisco	other	SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC	FY2001	—	No
GlobalFoundries	Qualcomm Inc	foundry_services	SEC segment disclosure: GLOBALFOUNDRIES INC → QUALCOMM INC	FY2021	—	No
Micron	Intel	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP	FY2012	—	No
Qorvo	Apple	other	SEC segment disclosure: QORVO INC → APPLE INC	FY2019	—	No
Amphenol	Apple	other	SEC segment disclosure: AMPHENOL CORP → APPLE INC	FY2018	—	No
NXP Semiconductors NV	Continental	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → CONTINENTAL AG	FY2019	—	No
Applied Materials	Samsung	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD	FY2013	—	No
Match Group	Alphabet	other	SEC segment disclosure: MATCH GROUP INC → ALPHABET INC	FY2011	—	No
Broadcom Inc.	Apple	networking	SEC segment disclosure: BROADCOM CORP → APPLE INC	FY2011	—	No
ZYNGA INC	Apple	other	SEC segment disclosure: ZYNGA INC → APPLE INC	FY2020	—	No
Micron	Intel	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP	FY2009	—	No
EPLUS INC	Cisco	other	SEC segment disclosure: EPLUS INC → CISCO SYSTEMS INC	FY2024	—	No
Amphenol	Apple	other	SEC segment disclosure: AMPHENOL CORP → APPLE INC	FY2020	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	FY2009	—	No
Fabrinet	NVIDIA	advanced_packaging	Contract Electronic Manufacturing supply	—	4.0	No
ELECTRONIC ARTS INC	Microsoft Corporation	other	SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP	FY2020	—	No
NXP Semiconductors NV	ARROW ELECTRONICS, INC.	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → ARROW ELECTRONICS INC	FY2018	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	FY2019	—	No
Ultra Clean	Lam Research	other	SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → LAM RESEARCH CORP	FY2022	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	FY2013	—	No
TSMC	NVIDIA	foundry_services	SEC segment disclosure: TAIWAN SEMICONDUCTOR MFG CO → NVIDIA CORP	FY2002	—	No
Logitech International	Amazon.com, Inc.	other	SEC segment disclosure: LOGITECH INTERNATIONAL SA → AMAZON.COM INC	FY2022	—	No
Celestica	Cisco	other	SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC	FY2018	—	No
Cirrus Logic	Apple	other	SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC	FY2019	—	No
SOLECTRON CORP	Cisco	other	SEC segment disclosure: SOLECTRON CORP → CISCO SYSTEMS INC	FY1999	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	FY2011	—	No
Amdocs Ltd.	T-MOBILE US INC	other	SEC segment disclosure: AMDOCS → T-MOBILE US INC	FY2022	—	No
ZYNGA INC	Alphabet	other	SEC segment disclosure: ZYNGA INC → ALPHABET INC	FY2020	—	No
Micron	HP Inc	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC	FY2013	—	No
Micron	Intel	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP	FY2013	—	No
TSMC	NVIDIA	foundry_services	SEC segment disclosure: TAIWAN SEMICONDUCTOR MFG CO → NVIDIA CORP	FY2003	—	No
ACTIVISION BLIZZARD INC	Microsoft Corporation	other	SEC segment disclosure: ACTIVISION BLIZZARD INC → MICROSOFT CORP	FY2020	—	No
Celestica	Cisco	other	SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC	FY2007	—	No
NXP Semiconductors NV	ARROW ELECTRONICS, INC.	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → ARROW ELECTRONICS INC	FY2019	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	FY2008	—	No
Celestica	Cisco	other	SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC	FY2006	—	No
Micron	Intel	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP	FY2011	—	No
Intel	IBM	gpu_accelerator	SEC segment disclosure: INTEL CORP → INTL BUSINESS MACHINES CORP	FY1993	—	No
Micron	Dell Technologies	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → DELL TECHNOLOGIES INC	FY2000	—	No
STMicroelectronics	Apple	other	SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC	FY2017	—	No
AMD	Fujitsu	gpu_accelerator	SEC segment disclosure: ADVANCED MICRO DEVICES → FUJITSU LTD	FY2005	—	No
Logitech International	Amazon.com, Inc.	other	Computer Peripherals supply	—	3.0	No
Logitech International	Amazon.com, Inc.	other	SEC segment disclosure: LOGITECH INTERNATIONAL SA → AMAZON.COM INC	FY2025	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	FY2010	—	No
Logitech International	Amazon.com, Inc.	other	SEC segment disclosure: LOGITECH INTERNATIONAL SA → AMAZON.COM INC	FY2023	—	No
ACTIVISION BLIZZARD INC	Apple	other	SEC segment disclosure: ACTIVISION BLIZZARD INC → APPLE INC	FY2016	—	No
NXP Semiconductors NV	Avnet	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC	FY2015	—	No
Qualcomm Inc	LG Electronics	gpu_accelerator	SEC segment disclosure: QUALCOMM INC → LG ELECTRONICS INC	FY2005	—	No
Jabil	Cisco	other	SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC	FY2002	—	No
KLA	Samsung	semiconductor_equipment	SEC segment disclosure: KLA CORP → SAMSUNG ELECTRONICS CO LTD	FY2018	—	No
SK ecoplant	SK Hynix	construction	Infrastructure Construction/Contracting Services supply	—	3.0	No
Ultra Clean	Lam Research	other	SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → LAM RESEARCH CORP	FY2021	—	No
Amdocs Ltd.	AT&T	other	SEC segment disclosure: AMDOCS → AT&T INC	FY2012	—	No
Micron	COMPAQ COMPUTER CORP	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → COMPAQ COMPUTER CORP	FY2000	—	No
ACTIVISION BLIZZARD INC	Alphabet	other	SEC segment disclosure: ACTIVISION BLIZZARD INC → ALPHABET INC	FY2019	—	No
Amkor	Apple	other	SEC segment disclosure: AMKOR TECHNOLOGY INC → APPLE INC	FY2021	—	No
NVIDIA	ASUSTek Computer	gpu_accelerator	SEC segment disclosure: NVIDIA CORP → ASUSTEK COMPUTER INC	FY2017	—	No
Match Group	Alphabet	other	SEC segment disclosure: MATCH GROUP INC → ALPHABET INC	FY2018	—	No
ACTIVISION BLIZZARD INC	Alphabet	other	SEC segment disclosure: ACTIVISION BLIZZARD INC → ALPHABET INC	FY2018	—	No
ELECTRONIC ARTS INC	Microsoft Corporation	other	SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP	FY2018	—	No
ELECTRONIC ARTS INC	Microsoft Corporation	other	SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP	FY2017	—	No
Marvell Technology	Western Digital	networking	SEC segment disclosure: MARVELL TECHNOLOGY INC → WESTERN DIGITAL CORP	FY2014	—	No
Amdocs Ltd.	T-MOBILE US INC	other	SEC segment disclosure: AMDOCS → T-MOBILE US INC	FY2021	—	No
GlobalFoundries	AMD	foundry_services	SEC segment disclosure: GLOBALFOUNDRIES INC → ADVANCED MICRO DEVICES	FY2021	—	No
EPLUS INC	Cisco	other	SEC segment disclosure: EPLUS INC → CISCO SYSTEMS INC	FY2023	—	No
Celestica	Juniper Networks, Inc.	other	SEC segment disclosure: CELESTICA INC → JUNIPER NETWORKS INC	FY2017	—	No
Celestica	Cisco	other	SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC	FY2011	—	No
Qualcomm Inc	GLOBALSTAR TELECOMM LTD	gpu_accelerator	SEC segment disclosure: QUALCOMM INC → GLOBALSTAR TELECOMM LTD	FY1998	—	No
ELECTRONIC ARTS INC	Microsoft Corporation	other	SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP	FY2019	—	No
Micron	HP Inc	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC	FY2011	—	No
SANDISK CORP -OLD	Apple	other	SEC segment disclosure: SANDISK CORP -OLD → APPLE INC	FY2015	—	No
Lam Research	Samsung	semiconductor_equipment	SEC segment disclosure: LAM RESEARCH CORP → SAMSUNG ELECTRONICS CO LTD	FY2011	—	No
Logitech International	Amazon.com, Inc.	other	SEC segment disclosure: LOGITECH INTERNATIONAL SA → AMAZON.COM INC	FY2024	—	No
Cirrus Logic	Apple	other	SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC	FY2016	—	No
NOK	Apple	other	Other Machinery Manufacturing supply	—	3.0	No
Micron	Intel	memory	SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP	FY2010	—	No
Marvell Technology	Western Digital	networking	SEC segment disclosure: MARVELL TECHNOLOGY INC → WESTERN DIGITAL CORP	FY2013	—	No
Marvell Technology	Western Digital	networking	SEC segment disclosure: MARVELL TECHNOLOGY INC → WESTERN DIGITAL CORP	FY2011	—	No
Broadcom Inc.	Apple	networking	SEC segment disclosure: BROADCOM CORP → APPLE INC	FY2010	—	No
Jabil	Cisco	other	SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC	FY2003	—	No
IAC INC	Alphabet	other	SEC segment disclosure: IAC INC → ALPHABET INC	FY2021	—	No
GlobalFoundries	AMD	foundry_services	SEC segment disclosure: GLOBALFOUNDRIES INC → ADVANCED MICRO DEVICES	FY2022	—	No
Amkor	Qualcomm Inc	foundry_services	Semiconductor Manufacturing Services supply	—	8.0	No
Marvell Technology	Western Digital	networking	SEC segment disclosure: MARVELL TECHNOLOGY INC → WESTERN DIGITAL CORP	FY2015	—	No
Broadcom Inc.	Samsung	networking	SEC segment disclosure: BROADCOM CORP → SAMSUNG ELECTRONICS CO LTD	FY2011	—	No
Applied Materials	Intel	semiconductor_equipment	SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP	FY2001	—	No
NXP Semiconductors NV	Avnet	other	SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC	FY2014	—	No
Amkor	Apple	other	SEC segment disclosure: AMKOR TECHNOLOGY INC → APPLE INC	FY2020	—	No
Qualcomm Inc	LG Electronics	gpu_accelerator	SEC segment disclosure: QUALCOMM INC → LG ELECTRONICS INC	FY2004	—	No

Data Provenance

Research100%

15,011 records

Sources

Source	Tier
Licensed supply-chain database (held under subscription; not redistributed)	T2
Epoch AI Facilities	T2

Processing

Supply chain edges from a licensed supply-chain database (held under subscription, not redistributed) merged via max-value deduplication. When both source pulls report the same edge, the higher share_pct is kept and data_source is concatenated. FLOP estimates derived from facility GPU counts via hardware path.

Reading this data

~valueEstimated — derived, modeled, or inferred. Hover for method and source.

valueDerived from another measured field (e.g. power from GPU count).

Source conflict — multiple sources disagree. Click for competing values.

hoverHover any annotated value to see authority tier, method, source, and vintage.

Full methodology

Cascade

Propagate a disruption through this graphControls & Supply

Chokepoint Anatomy

Where this graph concentrates

Neocloud Landscape

This graph filtered to GPU cloud providers