Supply Chain
Supplier–customer relationships between named firms, and the layers with only one supplier.
Supplier–customer relationships between named firms, and the layers with only one supplier.
48 single-source dependencies among all 14,937 relationships on file · one cell per relationship
single-source dependencies drawn: every relationship on file with no second supplier recorded, one mark each. 7 companies are the sole source across all of them; Taiwan accounts for 20.
companies on the buying side, counted once each across the 48 single-source dependencies above.
companies across the relationship data, in 72 countries.
Single-source dependencies, one mark each. Every mark is a relationship recorded as sole-source: a named supplier, a named customer, a named input, and no second supplier on file. The flag describes the recorded relationship; alternative suppliers may exist outside this corpus.
Columns group by the supplier’s recorded home jurisdiction and company, highest assessed criticality first. Mark form encodes that criticality on a 1–10 scale and the legend names each form with its count; a struck amber mark has a recorded end date.
The band at the foot draws the same 48 at one cell each among all 14,937 relationships on file, the solid block at its head being their share of the corpus.
The underlying corpus is drawn from licensed supply-chain pulls, SEC EDGAR and public-registry re-derivations, and CSET entity classification. The 48 relationships with no alternative supplier trace back to 7 companies in 5 jurisdictions, and 4 of them carry a recorded end date. How the graph is assembled
Search by company; filter by country, category or relationship type; export the whole public-provenance graph, or the one hop of suppliers and customers around a selected company. The canvas and the table beneath it draw that same subset; licensed relationships enter the totals above and are not redistributed.
| Supplier | Customer | Category | Product / service | Fiscal year | Criticality | Sole source |
|---|---|---|---|---|---|---|
| Ajinomoto Co., Inc. | Samsung | substrates | ABF substrate material for I-Cube packaging | — | 10.0 | Yes |
| Ajinomoto Co., Inc. | Intel | substrates | ABF substrate material for EMIB and Foveros packaging | — | 10.0 | Yes |
| ASML | SMIC | semiconductor_equipment | DUV ArF immersion lithography (NXT:2000i). EUV blocked by Dutch export controls. | — | 10.0 | Yes |
| Ajinomoto Co., Inc. | Amkor | substrates | ABF substrate material for FOWLP | — | 10.0 | Yes |
| TSMC | Alibaba | foundry_services | 5nm foundry manufacturing for Yitian 710 server CPU (T-Head design) | — | 10.0 | Yes |
| Ajinomoto Co., Inc. | TSMC | substrates | ABF substrate material for CoWoS and InFO advanced packaging | — | 10.0 | Yes |
| NVIDIA | xAI | gpu_accelerator | NVIDIA H100 SXM5 80GB GPU accelerators | — | 10.0 | Yes |
| TSMC | NVIDIA | foundry_services | Foundry services — NVIDIA H100 GH100 die at N5 (5nm) process node | — | 10.0 | Yes |
| ASML | TSMC | semiconductor_equipment | EUV lithography systems (TWINSCAN NXE/EXE series) for N5 process node patterning | — | 10.0 | Yes |
| TSMC | NVIDIA | advanced_packaging | CoWoS-S advanced packaging — integrating GH100 compute die with HBM3 stacks | — | 10.0 | Yes |
| NVIDIA | Microsoft Corporation | gpu_accelerator | NVIDIA H100 SXM5 80GB GPU accelerators | — | 10.0 | Yes |
| TSMC | NVIDIA | foundry_services | Foundry services — GH100 die at N5 (5nm) process node | — | 10.0 | Yes |
| ASML | TSMC | semiconductor_equipment | EUV lithography systems for N5 patterning | — | 10.0 | Yes |
| TSMC | NVIDIA | advanced_packaging | CoWoS-S advanced packaging | — | 10.0 | Yes |
| NVIDIA | Meta Platforms, Inc. | gpu_accelerator | NVIDIA H100 SXM5 80GB GPU accelerators — 100,000 unit deployment | — | 10.0 | Yes |
| TSMC | NVIDIA | foundry_services | Foundry services — GH100 die at N5 process node | — | 10.0 | Yes |
| ASML | TSMC | semiconductor_equipment | EUV lithography systems | — | 10.0 | Yes |
| TSMC | NVIDIA | advanced_packaging | CoWoS-S advanced packaging | — | 10.0 | Yes |
| NVIDIA | Amazon.com, Inc. | gpu_accelerator | NVIDIA H100 SXM5 80GB GPU accelerators for EC2 P5 instances | — | 10.0 | Yes |
| TSMC | NVIDIA | foundry_services | Foundry services — GH100 die at N5 process node | — | 10.0 | Yes |
| ASML | TSMC | semiconductor_equipment | EUV lithography systems for N5 | — | 10.0 | Yes |
| TSMC | NVIDIA | advanced_packaging | CoWoS-S advanced packaging | — | 10.0 | Yes |
| TSMC | NVIDIA | foundry_services | GH100 die at N5 foundry | — | 10.0 | Yes |
| ASML | TSMC | semiconductor_equipment | EUV lithography systems | — | 10.0 | Yes |
| TSMC | NVIDIA | advanced_packaging | CoWoS-S advanced packaging | — | 10.0 | Yes |
| NVIDIA | Oracle Corporation | gpu_accelerator | NVIDIA H100 SXM5 80GB GPU accelerators for OCI Supercluster | — | 10.0 | Yes |
| TSMC | NVIDIA | foundry_services | GH100 die at N5 foundry | — | 10.0 | Yes |
| ASML | TSMC | semiconductor_equipment | EUV lithography systems | — | 10.0 | Yes |
| TSMC | NVIDIA | advanced_packaging | CoWoS-S advanced packaging | — | 10.0 | Yes |
| NVIDIA | CoreWeave | gpu_accelerator | NVIDIA H200 SXM GPU accelerators | — | 10.0 | Yes |
| TSMC | NVIDIA | foundry_services | Foundry services — GH100 die at N5 (5nm) process node (H200 reuses H100 compute die with upgraded HBM3e) | — | 10.0 | Yes |
| ASML | TSMC | semiconductor_equipment | EUV lithography systems for N5 | — | 10.0 | Yes |
| TSMC | NVIDIA | advanced_packaging | CoWoS-S advanced packaging for H200 SXM (larger interposer than H100 to accommodate 141GB HBM3e) | — | 10.0 | Yes |
| TSMC | Alphabet | foundry_services | Foundry manufacturing of TPU v4 silicon (process node unverified) | — | 10.0 | Yes |
| TSMC | Alphabet | foundry_services | Foundry manufacturing of TPU v5e silicon (process node unverified) | — | 10.0 | Yes |
| TSMC | Alphabet | foundry_services | Foundry manufacturing of TPU v5p silicon on TSMC N5 | — | 10.0 | Yes |
| TSMC | Alphabet | foundry_services | Foundry manufacturing of TPU v6e (Trillium) on TSMC N5 | — | 10.0 | Yes |
| SMIC | HiSilicon | foundry_services | Foundry services — HiSilicon Ascend 910B at SMIC N+2 (~7nm DUV) | — | 10.0 | Yes |
| TSMC | HiSilicon | foundry_services | Foundry services — HiSilicon Kirin/Ascend 910 at TSMC N7/N5 (TERMINATED May 2020) | — | 10.0 | Yes |
| AMD | Hygon Information Technology Co., Ltd. | other | AMD Zen x86 architecture license via TISC JV (TERMINATED June 2019) | — | 10.0 | Yes |
| TSMC | Biren Technology | foundry_services | Foundry services — Biren BR100 at TSMC N7 (TERMINATED Oct 2023) | — | 10.0 | Yes |
| TSMC | Moore Threads | foundry_services | Foundry services — Moore Threads Chunxiao GPU (in MTT S80) at TSMC N7 (TERMINATED Oct 2023) | — | 10.0 | Yes |
| TSMC | Apple | foundry_services | Foundry manufacturing of Apple silicon (A-series, M-series processors) at N3/N4 process nodes | — | 10.0 | Yes |
| Ajinomoto Co., Inc. | Ibiden | substrates | Ajinomoto Build-up Film (ABF) substrate material for FC-BGA packages | — | 10.0 | Yes |
| Ajinomoto Co., Inc. | Shinko Electric | substrates | Ajinomoto Build-up Film (ABF) substrate material for FC-BGA packages | — | 10.0 | Yes |
| Ajinomoto Co., Inc. | Unimicron | substrates | Ajinomoto Build-up Film (ABF) substrate material for FC-BGA packages | — | 10.0 | Yes |
| SMIC | Huawei Technologies | foundry_services | Foundry for Kirin/Ascend chips at N+2 (7nm-class DUV) | — | 9.0 | Yes |
| NVIDIA | Meta Platforms, Inc. | gpu_accelerator | NVIDIA A100 GPU accelerators (SXM4 and PCIe variants) | — | 9.0 | Yes |
| TSMC | NVIDIA | foundry_services | Foundry services — GA100 die at N7 (7nm) process node | — | 9.0 | Yes |
| TSMC | Alphabet | advanced_packaging | CoWoS advanced packaging for TPU v5p/v6e with HBM stacks | — | 9.0 | Yes |
| TSMC | Iluvatar CoreX | foundry_services | Foundry services — Iluvatar CoreX TianGai-100 7nm GPGPU (first domestic 7nm GPGPU, released Jan 2021; foundry unverified but TSMC inferred from process node) | — | 9.0 | Yes |
| GlobalFoundries | Enflame Technology (Suiyuan) | foundry_services | Foundry services — Enflame CloudBlazer DTU at GlobalFoundries 12LP FinFET | FY2019 | 9.0 | Yes |
| NVIDIA | xAI | networking | InfiniBand HDR/NDR networking — inter-node fabric for H100 SXM5 clusters | — | 8.0 | Yes |
| NVIDIA | Microsoft Corporation | networking | InfiniBand NDR interconnect for Azure Eagle cluster fabric | — | 8.0 | Yes |
| NVIDIA | Meta Platforms, Inc. | networking | InfiniBand HDR (200 Gb/s) cluster networking for RSC | — | 8.0 | Yes |
| NVIDIA | Amazon.com, Inc. | networking | Elastic Fabric Adapter (EFA) over InfiniBand NDR — P5 instance networking | — | 8.0 | Yes |
| NVIDIA | CoreWeave | networking | InfiniBand NDR networking — CoreWeave GPU-native cloud fabric | — | 8.0 | Yes |
| Broadcom Inc. | WT Microelectronics | networking | SEC >10% customer disclosure | FY2025 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2021 | — | No |
| Broadcom Inc. | WT Microelectronics | networking | SEC segment disclosure: BROADCOM INC → WT MICROELECTRONICS CO LTD | FY2024 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2020 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2019 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2022 | — | No |
| UNITED PARCEL SERVICE INC | Amazon.com, Inc. | other | SEC segment disclosure: UNITED PARCEL SERVICE INC → AMAZON.COM INC | FY2021 | — | No |
| UNITED PARCEL SERVICE INC | Amazon.com, Inc. | other | SEC segment disclosure: UNITED PARCEL SERVICE INC → AMAZON.COM INC | FY2022 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2018 | — | No |
| UNITED PARCEL SERVICE INC | Amazon.com, Inc. | other | SEC segment disclosure: UNITED PARCEL SERVICE INC → AMAZON.COM INC | FY2020 | — | No |
| UNITED PARCEL SERVICE INC | Amazon.com, Inc. | other | SEC segment disclosure: UNITED PARCEL SERVICE INC → AMAZON.COM INC | FY2024 | — | No |
| UNITED PARCEL SERVICE INC | Amazon.com, Inc. | other | SEC segment disclosure: UNITED PARCEL SERVICE INC → AMAZON.COM INC | FY2023 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2023 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2011 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2024 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2014 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC >10% customer disclosure | FY2025 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2017 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2012 | — | No |
| Intel | Lenovo Group | gpu_accelerator | SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD | FY2021 | — | No |
| Intel | Lenovo Group | gpu_accelerator | SEC >10% customer disclosure | FY2019 | — | No |
| Intel | Lenovo Group | gpu_accelerator | SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD | FY2020 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2010 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2013 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2014 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2016 | — | No |
| UNITED PARCEL SERVICE INC | Amazon.com, Inc. | other | SEC segment disclosure: UNITED PARCEL SERVICE INC → AMAZON.COM INC | FY2019 | — | No |
| Intel | Lenovo Group | gpu_accelerator | SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD | FY2018 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2015 | — | No |
| Intel | Lenovo Group | gpu_accelerator | SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD | FY2017 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2011 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2019 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2013 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2021 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2018 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2020 | — | No |
| Intel | Lenovo Group | gpu_accelerator | SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD | FY2022 | — | No |
| Broadcom Inc. | WT Microelectronics | networking | SEC segment disclosure: BROADCOM INC → WT MICROELECTRONICS CO LTD | FY2023 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2008 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2012 | — | No |
| Intel | Lenovo Group | gpu_accelerator | SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD | FY2024 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2010 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2009 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2005 | — | No |
| Intel | Lenovo Group | gpu_accelerator | SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD | FY2015 | — | No |
| Broadcom Inc. | Apple | networking | SEC segment disclosure: BROADCOM INC → APPLE INC | FY2023 | — | No |
| TD SYNNEX Corp | Apple | other | SEC segment disclosure: TD SYNNEX CORP → APPLE INC | FY2024 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2022 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2017 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2007 | — | No |
| TD SYNNEX Corp | Apple | other | SEC segment disclosure: TD SYNNEX CORPORATION → APPLE INC | FY2022 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2008 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2006 | — | No |
| Intel | Lenovo Group | gpu_accelerator | SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD | FY2014 | — | No |
| Broadcom Inc. | Apple | networking | SEC segment disclosure: BROADCOM INC → APPLE INC | FY2022 | — | No |
| Broadcom Inc. | WT Microelectronics | networking | SEC segment disclosure: BROADCOM INC → WT MICROELECTRONICS CO LTD | FY2022 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2007 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2004 | — | No |
| Jabil | Apple | other | SEC segment disclosure: JABIL INC → APPLE INC | FY2021 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2024 | — | No |
| Jabil | Apple | other | SEC segment disclosure: JABIL INC → APPLE INC | FY2022 | — | No |
| Intel | Lenovo Group | gpu_accelerator | SEC >10% customer disclosure | FY2025 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC >10% customer disclosure | FY2025 | — | No |
| TD SYNNEX Corp | Apple | other | SEC segment disclosure: TD SYNNEX CORPORATION → APPLE INC | FY2023 | — | No |
| Intel | Lenovo Group | gpu_accelerator | SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD | FY2013 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2005 | — | No |
| Jabil | Apple | other | SEC segment disclosure: JABIL INC → APPLE INC | FY2018 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2009 | — | No |
| Intel | Lenovo Group | gpu_accelerator | SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD | FY2023 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2016 | — | No |
| Jabil | Apple | other | SEC segment disclosure: JABIL INC → APPLE INC | FY2023 | — | No |
| Intel | Lenovo Group | gpu_accelerator | SEC segment disclosure: INTEL CORP → LENOVO GROUP LTD | FY2012 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2003 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2006 | — | No |
| Jabil | Apple | other | SEC segment disclosure: JABIL INC → APPLE INC | FY2019 | — | No |
| Broadcom Inc. | Apple | networking | SEC segment disclosure: BROADCOM INC → APPLE INC | FY2021 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2004 | — | No |
| Jabil | Apple | other | SEC segment disclosure: JABIL INC → APPLE INC | FY2020 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2023 | — | No |
| Micron | HP Inc | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC | FY2006 | — | No |
| Broadcom Inc. | Apple | networking | SEC segment disclosure: BROADCOM INC → APPLE INC | FY2018 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC >10% customer disclosure | FY2022 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2022 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC >10% customer disclosure | FY2023 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2023 | — | No |
| Broadcom Inc. | WT Microelectronics | networking | SEC segment disclosure: BROADCOM INC → WT MICROELECTRONICS CO LTD | FY2021 | — | No |
| Microsoft Corporation | Dell Technologies | software_ip | SEC segment disclosure: MICROSOFT CORP → DELL TECHNOLOGIES INC | FY2006 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD | FY2021 | — | No |
| Jabil | Apple | other | SEC segment disclosure: JABIL INC → APPLE INC | FY2017 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2003 | — | No |
| Broadcom Inc. | Apple | networking | SEC segment disclosure: BROADCOM INC → APPLE INC | FY2019 | — | No |
| Jabil | Apple | other | SEC segment disclosure: JABIL INC → APPLE INC | FY2016 | — | No |
| Intel | COMPAQ COMPUTER CORP | gpu_accelerator | SEC segment disclosure: INTEL CORP → COMPAQ COMPUTER CORP | FY2000 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2000 | — | No |
| Jabil | Apple | other | SEC segment disclosure: JABIL INC → APPLE INC | FY2015 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY2002 | — | No |
| Intel | HP Inc | gpu_accelerator | SEC segment disclosure: INTEL CORP → HP INC | FY2002 | — | No |
| Microsoft Corporation | Dell Technologies | software_ip | SEC segment disclosure: MICROSOFT CORP → DELL TECHNOLOGIES INC | FY2005 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC >10% customer disclosure | FY2023 | — | No |
| Broadcom Inc. | WT Microelectronics | networking | SEC segment disclosure: BROADCOM INC → WT MICROELECTRONICS CO LTD | FY2019 | — | No |
| Intel | COMPAQ COMPUTER CORP | gpu_accelerator | SEC segment disclosure: INTEL CORP → COMPAQ COMPUTER CORP | FY1999 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY1999 | — | No |
| Micron | Kingston Technology Company, Inc. | memory | SEC >10% customer disclosure | FY2022 | — | No |
| Microsoft Corporation | Dell Technologies | software_ip | SEC segment disclosure: MICROSOFT CORP → DELL TECHNOLOGIES INC | FY2004 | — | No |
| Jabil | Amazon.com, Inc. | other | SEC segment disclosure: JABIL INC → AMAZON.COM INC | FY2022 | — | No |
| Micron | WPG Holding | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → WPG HOLDINGS | FY2021 | — | No |
| Broadcom Inc. | Apple | networking | SEC segment disclosure: BROADCOM INC → APPLE INC | FY2020 | — | No |
| Jabil | Apple | other | SEC segment disclosure: JABIL INC → APPLE INC | FY2013 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC >10% customer disclosure | FY2021 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2021 | — | No |
| Micron | WPG Holding | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → WPG HOLDINGS | FY2022 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD | FY2017 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD | FY2024 | — | No |
| Skyworks Solutions | Apple | other | SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC | FY2022 | — | No |
| Jabil | Apple | other | SEC segment disclosure: JABIL INC → APPLE INC | FY2024 | — | No |
| Skyworks Solutions | Apple | other | SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC | FY2023 | — | No |
| Broadcom Inc. | WT Microelectronics | networking | SEC segment disclosure: BROADCOM INC → WT MICROELECTRONICS CO LTD | FY2020 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC >10% customer disclosure | FY2020 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD | FY2020 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2020 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD | FY2022 | — | No |
| Skyworks Solutions | Apple | other | SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC | FY2021 | — | No |
| Intel | COMPAQ COMPUTER CORP | gpu_accelerator | SEC segment disclosure: INTEL CORP → COMPAQ COMPUTER CORP | FY1997 | — | No |
| Jabil | Amazon.com, Inc. | other | SEC segment disclosure: JABIL INC → AMAZON.COM INC | FY2020 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC >10% customer disclosure | FY2024 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2024 | — | No |
| Skyworks Solutions | Apple | other | SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC | FY2024 | — | No |
| Jabil | Apple | other | SEC segment disclosure: JABIL INC → APPLE INC | FY2014 | — | No |
| Micron | Huawei Technologies | memory | SEC >10% customer disclosure | FY2019 | — | No |
| NXP Semiconductors NV | Avnet | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC | FY2023 | — | No |
| NXP Semiconductors NV | Avnet | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC | FY2024 | — | No |
| Skyworks Solutions | Apple | other | SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC | FY2025 | — | No |
| STMicroelectronics | Apple | other | SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC | FY2022 | — | No |
| NXP Semiconductors NV | Avnet | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC | FY2022 | — | No |
| STMicroelectronics | Apple | other | SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC | FY2021 | — | No |
| Applied Materials | Intel | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP | FY2022 | — | No |
| Micron | Kingston Technology Company, Inc. | memory | SEC >10% customer disclosure | FY2019 | — | No |
| STMicroelectronics | Apple | other | SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC | FY2020 | — | No |
| Micron | Kingston Technology Company, Inc. | memory | SEC >10% customer disclosure | FY2020 | — | No |
| Arista Networks | Microsoft Corporation | networking | SEC >10% customer disclosure | FY2025 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD | FY2018 | — | No |
| Jabil | Apple | other | SEC segment disclosure: JABIL INC → APPLE INC | FY2012 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2017 | — | No |
| Jabil | Cisco | other | SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC | FY2011 | — | No |
| STMicroelectronics | Apple | other | SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC | FY2023 | — | No |
| NOV INC | Samsung Heavy Industries Co., Ltd. | other | SEC segment disclosure: NOV INC → SAMSUNG HEAVY INDUSTRIES CO | FY2010 | — | No |
| NOV INC | Samsung Heavy Industries Co., Ltd. | other | SEC segment disclosure: NOV INC → SAMSUNG HEAVY INDUSTRIES CO | FY2013 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC >10% customer disclosure | FY2019 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2019 | — | No |
| Jabil | Cisco | other | SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC | FY2008 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2013 | — | No |
| Jabil | Cisco | other | SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC | FY2010 | — | No |
| NOV INC | Samsung Heavy Industries Co., Ltd. | other | SEC segment disclosure: NOV INC → SAMSUNG HEAVY INDUSTRIES CO | FY2012 | — | No |
| NXP Semiconductors NV | Avnet | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC | FY2021 | — | No |
| Marvell Technology | Wintech Digital Systems Technology Corp | networking | SEC >10% customer disclosure | FY2025 | — | No |
| Amkor | Apple | other | SEC segment disclosure: AMKOR TECHNOLOGY INC → APPLE INC | FY2024 | — | No |
| STMicroelectronics | Apple | other | SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC | FY2024 | — | No |
| Qualcomm Inc | Samsung | gpu_accelerator | SEC segment disclosure: QUALCOMM INC → SAMSUNG ELECTRONICS CO LTD | FY2012 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2014 | — | No |
| Applied Materials | Intel | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP | FY2018 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2018 | — | No |
| Qualcomm Inc | Samsung | gpu_accelerator | SEC segment disclosure: QUALCOMM INC → SAMSUNG ELECTRONICS CO LTD | FY2011 | — | No |
| Qualcomm Inc | HTC | gpu_accelerator | SEC segment disclosure: QUALCOMM INC → HTC CORPORATION | FY2011 | — | No |
| Skyworks Solutions | Apple | other | SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC | FY2020 | — | No |
| Broadcom Inc. | Foxconn | networking | SEC segment disclosure: BROADCOM INC → FOXCONN TECHNOLOGY CO LTD | FY2018 | — | No |
| Qualcomm Inc | LG Electronics | gpu_accelerator | SEC segment disclosure: QUALCOMM INC → LG ELECTRONICS INC | FY2009 | — | No |
| Jabil | Cisco | other | SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC | FY2007 | — | No |
| Micron | Intel | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP | FY2017 | — | No |
| Skyworks Solutions | Apple | other | SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC | FY2018 | — | No |
| Amkor | Apple | other | SEC segment disclosure: AMKOR TECHNOLOGY INC → APPLE INC | FY2023 | — | No |
| Qualcomm Inc | LG Electronics | gpu_accelerator | SEC segment disclosure: QUALCOMM INC → LG ELECTRONICS INC | FY2008 | — | No |
| Applied Materials | Intel | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP | FY2019 | — | No |
| Qorvo | Apple | other | SEC segment disclosure: QORVO INC → APPLE INC | FY2025 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD | FY2012 | — | No |
| Micron | Intel | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP | FY2016 | — | No |
| Qorvo | Apple | other | SEC segment disclosure: QORVO INC → APPLE INC | FY2024 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2016 | — | No |
| Skyworks Solutions | Apple | other | SEC segment disclosure: SKYWORKS SOLUTIONS INC → APPLE INC | FY2019 | — | No |
| Jabil | Cisco | other | SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC | FY2012 | — | No |
| Cirrus Logic | Apple | other | SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC | FY2025 | — | No |
| STMicroelectronics | Apple | other | SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC | FY2019 | — | No |
| Qualcomm Inc | LG Electronics | gpu_accelerator | SEC segment disclosure: QUALCOMM INC → LG ELECTRONICS INC | FY2010 | — | No |
| Cirrus Logic | Apple | other | SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC | FY2023 | — | No |
| Qualcomm Inc | Samsung | gpu_accelerator | SEC segment disclosure: QUALCOMM INC → SAMSUNG ELECTRONICS CO LTD | FY2008 | — | No |
| Cirrus Logic | Apple | other | SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC | FY2024 | — | No |
| Qorvo | Apple | other | SEC segment disclosure: QORVO INC → APPLE INC | FY2022 | — | No |
| Jabil | Cisco | other | SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC | FY2009 | — | No |
| NOV INC | Samsung Heavy Industries Co., Ltd. | other | SEC segment disclosure: NOV INC → SAMSUNG HEAVY INDUSTRIES CO | FY2014 | — | No |
| Match Group | Alphabet | other | SEC segment disclosure: MATCH GROUP INC → ALPHABET INC | FY2013 | — | No |
| Micron | HP Inc | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC | FY2014 | — | No |
| NXP Semiconductors NV | Avnet | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC | FY2020 | — | No |
| Amkor | Apple | other | SEC segment disclosure: AMKOR TECHNOLOGY INC → APPLE INC | FY2022 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2015 | — | No |
| AMD | HP Inc | gpu_accelerator | SEC segment disclosure: ADVANCED MICRO DEVICES → HP INC | FY2011 | — | No |
| Arista Networks | Meta Platforms, Inc. | networking | SEC >10% customer disclosure | FY2025 | — | No |
| Texas Instruments | Apple | other | SEC segment disclosure: TEXAS INSTRUMENTS INC → APPLE INC | FY2015 | — | No |
| Cirrus Logic | Apple | other | SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC | FY2022 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD | FY2016 | — | No |
| Arista Networks | Microsoft Corporation | networking | SEC segment disclosure: ARISTA NETWORKS INC → MICROSOFT CORP | FY2024 | — | No |
| AMD | HP Inc | gpu_accelerator | SEC segment disclosure: ADVANCED MICRO DEVICES → HP INC | FY2010 | — | No |
| Match Group | Alphabet | other | SEC segment disclosure: MATCH GROUP INC → ALPHABET INC | FY2012 | — | No |
| Match Group | Alphabet | other | SEC segment disclosure: MATCH GROUP INC → ALPHABET INC | FY2014 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2012 | — | No |
| NXP Semiconductors NV | Avnet | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC | FY2017 | — | No |
| Qualcomm Inc | Samsung | gpu_accelerator | SEC segment disclosure: QUALCOMM INC → SAMSUNG ELECTRONICS CO LTD | FY2009 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD | FY2010 | — | No |
| GlobalFoundries | Qualcomm Inc | foundry_services | SEC segment disclosure: GLOBALFOUNDRIES INC → QUALCOMM INC | FY2022 | — | No |
| Marvell Technology | Wintech Digital Systems Technology Corp | networking | SEC >10% customer disclosure | FY2024 | — | No |
| Qorvo | Apple | other | SEC segment disclosure: QORVO INC → APPLE INC | FY2023 | — | No |
| NXP Semiconductors NV | Avnet | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC | FY2018 | — | No |
| Micron | Intel | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP | FY2014 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD | FY2008 | — | No |
| Micron | Intel | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP | FY2015 | — | No |
| GlobalFoundries | Qualcomm Inc | foundry_services | SEC segment disclosure: GLOBALFOUNDRIES INC → QUALCOMM INC | FY2023 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2017 | — | No |
| NEWELL BRANDS INC | Amazon.com, Inc. | other | SEC segment disclosure: NEWELL BRANDS INC → AMAZON.COM INC | FY2021 | — | No |
| ELECTRONIC ARTS INC | Microsoft Corporation | other | SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP | FY2025 | — | No |
| STMicroelectronics | Apple | other | SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC | FY2018 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD | FY2011 | — | No |
| NXP Semiconductors NV | Avnet | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC | FY2019 | — | No |
| Cirrus Logic | Apple | other | SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC | FY2018 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2015 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2022 | — | No |
| NXP Semiconductors NV | Avnet | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC | FY2016 | — | No |
| Arista Networks | Meta Platforms, Inc. | networking | SEC segment disclosure: ARISTA NETWORKS INC → META PLATFORMS INC | FY2023 | — | No |
| NEWELL BRANDS INC | Amazon.com, Inc. | other | SEC segment disclosure: NEWELL BRANDS INC → AMAZON.COM INC | FY2022 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2016 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2024 | — | No |
| Cirrus Logic | Apple | other | SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC | FY2017 | — | No |
| ELECTRONIC ARTS INC | Microsoft Corporation | other | SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP | FY2024 | — | No |
| Qorvo | Apple | other | SEC segment disclosure: QORVO INC → APPLE INC | FY2021 | — | No |
| NVIDIA | Dell Technologies | gpu_accelerator | SEC segment disclosure: NVIDIA CORP → DELL TECHNOLOGIES INC | FY2020 | — | No |
| AMD | HP Inc | gpu_accelerator | SEC segment disclosure: ADVANCED MICRO DEVICES → HP INC | FY2012 | — | No |
| Applied Materials | Intel | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP | FY2016 | — | No |
| Applied Materials | Micron | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → MICRON TECHNOLOGY INC | FY2016 | — | No |
| ELECTRONIC ARTS INC | Microsoft Corporation | other | SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP | FY2023 | — | No |
| Marvell Technology | Wintech Digital Systems Technology Corp | networking | SEC >10% customer disclosure | FY2023 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2014 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD | FY2007 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2023 | — | No |
| Celestica | Cisco | other | SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC | FY2016 | — | No |
| Arista Networks | Meta Platforms, Inc. | networking | SEC >10% customer disclosure | FY2022 | — | No |
| NEWELL BRANDS INC | Amazon.com, Inc. | other | SEC segment disclosure: NEWELL BRANDS INC → AMAZON.COM INC | FY2024 | — | No |
| Cirrus Logic | Apple | other | SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC | FY2021 | — | No |
| Micron | HP Inc | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC | FY2015 | — | No |
| Amdocs Ltd. | T-MOBILE US INC | other | SEC segment disclosure: AMDOCS → T-MOBILE US INC | FY2024 | — | No |
| Amdocs Ltd. | T-MOBILE US INC | other | SEC segment disclosure: AMDOCS → T-MOBILE US INC | FY2023 | — | No |
| NEWELL BRANDS INC | Amazon.com, Inc. | other | SEC segment disclosure: NEWELL BRANDS INC → AMAZON.COM INC | FY2020 | — | No |
| Jabil | Cisco | other | SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC | FY2004 | — | No |
| ELECTRONIC ARTS INC | Microsoft Corporation | other | SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP | FY2022 | — | No |
| Micron | Intel | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP | FY2008 | — | No |
| Micron | HP Inc | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC | FY2010 | — | No |
| Celestica | Cisco | other | SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC | FY2017 | — | No |
| Qualcomm Inc | Samsung | gpu_accelerator | SEC segment disclosure: QUALCOMM INC → SAMSUNG ELECTRONICS CO LTD | FY2010 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2020 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2018 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2021 | — | No |
| Qorvo | Apple | other | SEC segment disclosure: QORVO INC → APPLE INC | FY2018 | — | No |
| Qorvo | Apple | other | SEC segment disclosure: QORVO INC → APPLE INC | FY2020 | — | No |
| GlobalFoundries | Qualcomm Inc | foundry_services | SEC segment disclosure: GLOBALFOUNDRIES INC → QUALCOMM INC | FY2024 | — | No |
| NEWELL BRANDS INC | Amazon.com, Inc. | other | SEC segment disclosure: NEWELL BRANDS INC → AMAZON.COM INC | FY2023 | — | No |
| Arista Networks | Microsoft Corporation | networking | SEC segment disclosure: ARISTA NETWORKS INC → MICROSOFT CORP | FY2023 | — | No |
| Applied Materials | Intel | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP | FY2011 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2011 | — | No |
| Arista Networks | Meta Platforms, Inc. | networking | SEC segment disclosure: ARISTA NETWORKS INC → META PLATFORMS INC | FY2024 | — | No |
| Applied Materials | TSMC | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2010 | — | No |
| NXP Semiconductors NV | Continental | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → CONTINENTAL AG | FY2018 | — | No |
| Qorvo | Apple | other | SEC segment disclosure: QORVO INC → APPLE INC | FY2017 | — | No |
| NXP Semiconductors NV | Continental | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → CONTINENTAL AG | FY2017 | — | No |
| ELECTRONIC ARTS INC | Microsoft Corporation | other | SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP | FY2021 | — | No |
| Cirrus Logic | Apple | other | SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC | FY2020 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD | FY2006 | — | No |
| Jabil | Cisco | other | SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC | FY2001 | — | No |
| GlobalFoundries | Qualcomm Inc | foundry_services | SEC segment disclosure: GLOBALFOUNDRIES INC → QUALCOMM INC | FY2021 | — | No |
| Micron | Intel | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP | FY2012 | — | No |
| Qorvo | Apple | other | SEC segment disclosure: QORVO INC → APPLE INC | FY2019 | — | No |
| NXP Semiconductors NV | Continental | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → CONTINENTAL AG | FY2019 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD | FY2013 | — | No |
| Match Group | Alphabet | other | SEC segment disclosure: MATCH GROUP INC → ALPHABET INC | FY2011 | — | No |
| Micron | Intel | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP | FY2009 | — | No |
| EPLUS INC | Cisco | other | SEC segment disclosure: EPLUS INC → CISCO SYSTEMS INC | FY2024 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2009 | — | No |
| ELECTRONIC ARTS INC | Microsoft Corporation | other | SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP | FY2020 | — | No |
| NXP Semiconductors NV | ARROW ELECTRONICS, INC. | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → ARROW ELECTRONICS INC | FY2018 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2019 | — | No |
| Ultra Clean | Lam Research | other | SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → LAM RESEARCH CORP | FY2022 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2013 | — | No |
| TSMC | NVIDIA | foundry_services | SEC segment disclosure: TAIWAN SEMICONDUCTOR MFG CO → NVIDIA CORP | FY2002 | — | No |
| Logitech International | Amazon.com, Inc. | other | SEC segment disclosure: LOGITECH INTERNATIONAL SA → AMAZON.COM INC | FY2022 | — | No |
| Celestica | Cisco | other | SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC | FY2018 | — | No |
| Cirrus Logic | Apple | other | SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC | FY2019 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2011 | — | No |
| Amdocs Ltd. | T-MOBILE US INC | other | SEC segment disclosure: AMDOCS → T-MOBILE US INC | FY2022 | — | No |
| Micron | HP Inc | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC | FY2013 | — | No |
| Micron | Intel | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP | FY2013 | — | No |
| TSMC | NVIDIA | foundry_services | SEC segment disclosure: TAIWAN SEMICONDUCTOR MFG CO → NVIDIA CORP | FY2003 | — | No |
| Celestica | Cisco | other | SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC | FY2007 | — | No |
| NXP Semiconductors NV | ARROW ELECTRONICS, INC. | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → ARROW ELECTRONICS INC | FY2019 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2008 | — | No |
| Celestica | Cisco | other | SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC | FY2006 | — | No |
| Micron | Intel | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP | FY2011 | — | No |
| Micron | Dell Technologies | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → DELL TECHNOLOGIES INC | FY2000 | — | No |
| STMicroelectronics | Apple | other | SEC segment disclosure: STMICROELECTRONICS NV → APPLE INC | FY2017 | — | No |
| AMD | Fujitsu | gpu_accelerator | SEC segment disclosure: ADVANCED MICRO DEVICES → FUJITSU LTD | FY2005 | — | No |
| Logitech International | Amazon.com, Inc. | other | SEC segment disclosure: LOGITECH INTERNATIONAL SA → AMAZON.COM INC | FY2025 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2010 | — | No |
| Logitech International | Amazon.com, Inc. | other | SEC segment disclosure: LOGITECH INTERNATIONAL SA → AMAZON.COM INC | FY2023 | — | No |
| NXP Semiconductors NV | Avnet | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC | FY2015 | — | No |
| Qualcomm Inc | LG Electronics | gpu_accelerator | SEC segment disclosure: QUALCOMM INC → LG ELECTRONICS INC | FY2005 | — | No |
| Jabil | Cisco | other | SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC | FY2002 | — | No |
| KLA | Samsung | semiconductor_equipment | SEC segment disclosure: KLA CORP → SAMSUNG ELECTRONICS CO LTD | FY2018 | — | No |
| Ultra Clean | Lam Research | other | SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → LAM RESEARCH CORP | FY2021 | — | No |
| Amdocs Ltd. | AT&T | other | SEC segment disclosure: AMDOCS → AT&T INC | FY2012 | — | No |
| Micron | COMPAQ COMPUTER CORP | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → COMPAQ COMPUTER CORP | FY2000 | — | No |
| Amkor | Apple | other | SEC segment disclosure: AMKOR TECHNOLOGY INC → APPLE INC | FY2021 | — | No |
| NVIDIA | ASUSTek Computer | gpu_accelerator | SEC segment disclosure: NVIDIA CORP → ASUSTEK COMPUTER INC | FY2017 | — | No |
| Match Group | Alphabet | other | SEC segment disclosure: MATCH GROUP INC → ALPHABET INC | FY2018 | — | No |
| ELECTRONIC ARTS INC | Microsoft Corporation | other | SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP | FY2018 | — | No |
| ELECTRONIC ARTS INC | Microsoft Corporation | other | SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP | FY2017 | — | No |
| Amdocs Ltd. | T-MOBILE US INC | other | SEC segment disclosure: AMDOCS → T-MOBILE US INC | FY2021 | — | No |
| GlobalFoundries | AMD | foundry_services | SEC segment disclosure: GLOBALFOUNDRIES INC → ADVANCED MICRO DEVICES | FY2021 | — | No |
| EPLUS INC | Cisco | other | SEC segment disclosure: EPLUS INC → CISCO SYSTEMS INC | FY2023 | — | No |
| Celestica | Juniper Networks, Inc. | other | SEC segment disclosure: CELESTICA INC → JUNIPER NETWORKS INC | FY2017 | — | No |
| Celestica | Cisco | other | SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC | FY2011 | — | No |
| ELECTRONIC ARTS INC | Microsoft Corporation | other | SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP | FY2019 | — | No |
| Qualcomm Inc | GLOBALSTAR TELECOMM LTD | gpu_accelerator | SEC segment disclosure: QUALCOMM INC → GLOBALSTAR TELECOMM LTD | FY1998 | — | No |
| Micron | HP Inc | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC | FY2011 | — | No |
| Lam Research | Samsung | semiconductor_equipment | SEC segment disclosure: LAM RESEARCH CORP → SAMSUNG ELECTRONICS CO LTD | FY2011 | — | No |
| Logitech International | Amazon.com, Inc. | other | SEC segment disclosure: LOGITECH INTERNATIONAL SA → AMAZON.COM INC | FY2024 | — | No |
| Cirrus Logic | Apple | other | SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC | FY2016 | — | No |
| Micron | Intel | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → INTEL CORP | FY2010 | — | No |
| Jabil | Cisco | other | SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC | FY2003 | — | No |
| IAC INC | Alphabet | other | SEC segment disclosure: IAC INC → ALPHABET INC | FY2021 | — | No |
| GlobalFoundries | AMD | foundry_services | SEC segment disclosure: GLOBALFOUNDRIES INC → ADVANCED MICRO DEVICES | FY2022 | — | No |
| Applied Materials | Intel | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP | FY2001 | — | No |
| NXP Semiconductors NV | Avnet | other | SEC segment disclosure: NXP SEMICONDUCTORS NV → AVNET INC | FY2014 | — | No |
| Amkor | Apple | other | SEC segment disclosure: AMKOR TECHNOLOGY INC → APPLE INC | FY2020 | — | No |
| Qualcomm Inc | LG Electronics | gpu_accelerator | SEC segment disclosure: QUALCOMM INC → LG ELECTRONICS INC | FY2004 | — | No |
| Match Group | Alphabet | other | SEC segment disclosure: MATCH GROUP INC → ALPHABET INC | FY2010 | — | No |
| Synopsys | Intel | other | SEC segment disclosure: SYNOPSYS INC → INTEL CORP | FY2023 | — | No |
| GlobalFoundries | AMD | foundry_services | SEC segment disclosure: GLOBALFOUNDRIES INC → ADVANCED MICRO DEVICES | FY2024 | — | No |
| Amkor | Qualcomm Inc | other | SEC segment disclosure: AMKOR TECHNOLOGY INC → QUALCOMM INC | FY2022 | — | No |
| Celestica | Cisco | other | SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC | FY2012 | — | No |
| Analog Devices | Apple | other | SEC segment disclosure: ANALOG DEVICES INC → APPLE INC | FY2017 | — | No |
| IAC INC | Alphabet | other | SEC segment disclosure: IAC INC → ALPHABET INC | FY2023 | — | No |
| Jabil | Cisco | other | SEC segment disclosure: JABIL INC → CISCO SYSTEMS INC | FY2000 | — | No |
| WARNER MUSIC GROUP CORP | Apple | other | SEC segment disclosure: WARNER MUSIC GROUP CORP → APPLE INC | FY2024 | — | No |
| Celestica | Cisco | other | SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC | FY2019 | — | No |
| HASBRO INC | Amazon.com, Inc. | other | SEC segment disclosure: HASBRO INC → AMAZON.COM INC | FY2021 | — | No |
| IAC INC | Alphabet | other | SEC segment disclosure: IAC INC → ALPHABET INC | FY2022 | — | No |
| Arista Networks | Microsoft Corporation | networking | SEC segment disclosure: ARISTA NETWORKS INC → MICROSOFT CORP | FY2022 | — | No |
| WARNER MUSIC GROUP CORP | Apple | other | SEC segment disclosure: WARNER MUSIC GROUP CORP → APPLE INC | FY2021 | — | No |
| KLA | TSMC | semiconductor_equipment | SEC >10% customer disclosure | FY2019 | — | No |
| KLA | TSMC | semiconductor_equipment | SEC segment disclosure: KLA CORP → TAIWAN SEMICONDUCTOR MFG CO | FY2019 | — | No |
| Logitech International | Amazon.com, Inc. | other | SEC segment disclosure: LOGITECH INTERNATIONAL SA → AMAZON.COM INC | FY2021 | — | No |
| EPLUS INC | Cisco | other | SEC segment disclosure: EPLUS INC → CISCO SYSTEMS INC | FY2022 | — | No |
| ARM | Arm Technology (China) Co. Limited | software_ip | SEC >10% customer disclosure | FY2024 | — | No |
| ARM | Arm Technology (China) Co. Limited | software_ip | SEC >10% customer disclosure | FY2025 | — | No |
| Marvell Technology | Wintech Digital Systems Technology Corp | networking | SEC >10% customer disclosure | FY2022 | — | No |
| Ultra Clean | Lam Research | other | SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → LAM RESEARCH CORP | FY2024 | — | No |
| WARNER MUSIC GROUP CORP | Apple | other | SEC segment disclosure: WARNER MUSIC GROUP CORP → APPLE INC | FY2023 | — | No |
| Cirrus Logic | Apple | other | SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC | FY2013 | — | No |
| Micron | HP Inc | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC | FY2012 | — | No |
| Celestica | Juniper Networks, Inc. | other | SEC segment disclosure: CELESTICA INC → JUNIPER NETWORKS INC | FY2016 | — | No |
| Cirrus Logic | Apple | other | SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC | FY2015 | — | No |
| WARNER MUSIC GROUP CORP | Apple | other | SEC segment disclosure: WARNER MUSIC GROUP CORP → APPLE INC | FY2022 | — | No |
| Amkor | Qualcomm Inc | other | SEC segment disclosure: AMKOR TECHNOLOGY INC → QUALCOMM INC | FY2024 | — | No |
| EPLUS INC | Cisco | other | SEC segment disclosure: EPLUS INC → CISCO SYSTEMS INC | FY2025 | — | No |
| WARNER MUSIC GROUP CORP | Apple | other | SEC segment disclosure: WARNER MUSIC GROUP CORP → APPLE INC | FY2020 | — | No |
| Qualcomm Inc | Motorola Solutions | gpu_accelerator | SEC segment disclosure: QUALCOMM INC → MOTOROLA SOLUTIONS INC | FY2005 | — | No |
| Fabrinet | Cisco | other | SEC segment disclosure: FABRINET → CISCO SYSTEMS INC | FY2025 | — | No |
| GlobalFoundries | AMD | foundry_services | SEC segment disclosure: GLOBALFOUNDRIES INC → ADVANCED MICRO DEVICES | FY2023 | — | No |
| Ichor Holdings | Lam Research | other | SEC segment disclosure: ICHOR HOLDINGS LTD → LAM RESEARCH CORP | FY2022 | — | No |
| ELECTRONIC ARTS INC | Microsoft Corporation | other | SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP | FY2016 | — | No |
| EPLUS INC | Cisco | other | SEC segment disclosure: EPLUS INC → CISCO SYSTEMS INC | FY2020 | — | No |
| Match Group | Alphabet | other | SEC segment disclosure: MATCH GROUP INC → ALPHABET INC | FY2008 | — | No |
| Ultra Clean | Lam Research | other | SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → LAM RESEARCH CORP | FY2018 | — | No |
| Applied Materials | Intel | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP | FY2009 | — | No |
| Ultra Clean | Lam Research | other | SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → LAM RESEARCH CORP | FY2020 | — | No |
| Synopsys | Intel | other | SEC segment disclosure: SYNOPSYS INC → INTEL CORP | FY2022 | — | No |
| Ultra Clean | Lam Research | other | SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → LAM RESEARCH CORP | FY2023 | — | No |
| EPLUS INC | Cisco | other | SEC segment disclosure: EPLUS INC → CISCO SYSTEMS INC | FY2018 | — | No |
| ENTRAVISION COMMUNICATIONS | Meta Platforms, Inc. | other | SEC segment disclosure: ENTRAVISION COMMUNICATIONS → META PLATFORMS INC | FY2023 | — | No |
| HASBRO INC | Amazon.com, Inc. | other | SEC segment disclosure: HASBRO INC → AMAZON.COM INC | FY2022 | — | No |
| Applied Materials | Intel | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP | FY2003 | — | No |
| WARNER MUSIC GROUP CORP | Apple | other | SEC segment disclosure: WARNER MUSIC GROUP CORP → APPLE INC | FY2019 | — | No |
| Arista Networks | Microsoft Corporation | networking | SEC segment disclosure: ARISTA NETWORKS INC → MICROSOFT CORP | FY2018 | — | No |
| Ichor Holdings | Lam Research | other | SEC segment disclosure: ICHOR HOLDINGS LTD → LAM RESEARCH CORP | FY2021 | — | No |
| Fabrinet | Cisco | other | SEC segment disclosure: FABRINET → CISCO SYSTEMS INC | FY2022 | — | No |
| Micron | HP Inc | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → HP INC | FY2007 | — | No |
| SYSTEM1 INC | Alphabet | other | SEC segment disclosure: SYSTEM1 INC → ALPHABET INC | FY2022 | — | No |
| Cirrus Logic | Apple | other | SEC segment disclosure: CIRRUS LOGIC INC → APPLE INC | FY2014 | — | No |
| Match Group | Alphabet | other | SEC segment disclosure: MATCH GROUP INC → ALPHABET INC | FY2009 | — | No |
| EPLUS INC | Cisco | other | SEC segment disclosure: EPLUS INC → CISCO SYSTEMS INC | FY2019 | — | No |
| IAC INC | Alphabet | other | SEC segment disclosure: IAC INC → ALPHABET INC | FY2020 | — | No |
| Arista Networks | Microsoft Corporation | networking | SEC segment disclosure: ARISTA NETWORKS INC → MICROSOFT CORP | FY2019 | — | No |
| Ultra Clean | Lam Research | other | SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → LAM RESEARCH CORP | FY2017 | — | No |
| NVIDIA | ASUSTek Computer | gpu_accelerator | SEC segment disclosure: NVIDIA CORP → ASUSTEK COMPUTER INC | FY2016 | — | No |
| Ultra Clean | Applied Materials | other | SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → APPLIED MATERIALS INC | FY2022 | — | No |
| HASBRO INC | Amazon.com, Inc. | other | SEC segment disclosure: HASBRO INC → AMAZON.COM INC | FY2023 | — | No |
| HASBRO INC | Amazon.com, Inc. | other | SEC segment disclosure: HASBRO INC → AMAZON.COM INC | FY2020 | — | No |
| EPLUS INC | Cisco | other | SEC segment disclosure: EPLUS INC → CISCO SYSTEMS INC | FY2021 | — | No |
| TTM TECHNOLOGIES INC | Apple | other | SEC segment disclosure: TTM TECHNOLOGIES INC → APPLE INC | FY2017 | — | No |
| Lumentum Holdings | Apple | other | SEC segment disclosure: LUMENTUM HOLDINGS INC → APPLE INC | FY2021 | — | No |
| Intel | COMPAQ COMPUTER CORP | gpu_accelerator | SEC segment disclosure: INTEL CORP → COMPAQ COMPUTER CORP | FY1998 | — | No |
| Celestica | Cisco | other | SEC segment disclosure: CELESTICA INC → CISCO SYSTEMS INC | FY2020 | — | No |
| Qualcomm Inc | Motorola Solutions | gpu_accelerator | SEC segment disclosure: QUALCOMM INC → MOTOROLA SOLUTIONS INC | FY2003 | — | No |
| Qualcomm Inc | LG Electronics | gpu_accelerator | SEC segment disclosure: QUALCOMM INC → LG ELECTRONICS INC | FY2003 | — | No |
| Lam Research | Samsung | semiconductor_equipment | SEC segment disclosure: LAM RESEARCH CORP → SAMSUNG ELECTRONICS CO LTD | FY2010 | — | No |
| Applied Materials | Intel | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → INTEL CORP | FY2002 | — | No |
| Qorvo | Samsung | other | SEC segment disclosure: QORVO INC → SAMSUNG ELECTRONICS CO LTD | FY2022 | — | No |
| Corsair Gaming | Amazon.com, Inc. | other | SEC segment disclosure: CORSAIR GAMING INC → AMAZON.COM INC | FY2021 | — | No |
| Entegris | TSMC | other | SEC segment disclosure: ENTEGRIS INC → TAIWAN SEMICONDUCTOR MFG CO | FY2024 | — | No |
| IAC INC | Alphabet | other | SEC segment disclosure: IAC INC → ALPHABET INC | FY2024 | — | No |
| Applied Materials | Samsung | semiconductor_equipment | SEC segment disclosure: APPLIED MATERIALS INC → SAMSUNG ELECTRONICS CO LTD | FY2009 | — | No |
| Ultra Clean | Applied Materials | other | SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → APPLIED MATERIALS INC | FY2021 | — | No |
| Garmin | Amazon.com, Inc. | other | SEC segment disclosure: GARMIN LTD → AMAZON.COM INC | FY2021 | — | No |
| Arista Networks | Microsoft Corporation | networking | SEC segment disclosure: ARISTA NETWORKS INC → MICROSOFT CORP | FY2020 | — | No |
| Lumentum Holdings | Apple | other | SEC segment disclosure: LUMENTUM HOLDINGS INC → APPLE INC | FY2022 | — | No |
| Qualcomm Inc | Motorola Solutions | gpu_accelerator | SEC segment disclosure: QUALCOMM INC → MOTOROLA SOLUTIONS INC | FY2004 | — | No |
| Synopsys | Intel | other | SEC segment disclosure: SYNOPSYS INC → INTEL CORP | FY2017 | — | No |
| ORGANON & CO | SAMSUNG BIOLOGICS Co., Ltd. | other | SEC segment disclosure: ORGANON & CO → SAMSUNG BIOLOGICS CO LTD | FY2022 | — | No |
| Synopsys | Intel | other | SEC segment disclosure: SYNOPSYS INC → INTEL CORP | FY2018 | — | No |
| Ichor Holdings | Lam Research | other | SEC segment disclosure: ICHOR HOLDINGS LTD → LAM RESEARCH CORP | FY2020 | — | No |
| Ultra Clean | Applied Materials | other | SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → APPLIED MATERIALS INC | FY2024 | — | No |
| Lam Research | Samsung | semiconductor_equipment | SEC segment disclosure: LAM RESEARCH CORP → SAMSUNG ELECTRONICS CO LTD | FY2008 | — | No |
| ENTRAVISION COMMUNICATIONS | Meta Platforms, Inc. | other | SEC segment disclosure: ENTRAVISION COMMUNICATIONS → META PLATFORMS INC | FY2022 | — | No |
| Teradyne | TSMC | semiconductor_equipment | SEC >10% customer disclosure | FY2020 | — | No |
| Teradyne | TSMC | semiconductor_equipment | SEC segment disclosure: TERADYNE INC → TAIWAN SEMICONDUCTOR MFG CO | FY2020 | — | No |
| Ichor Holdings | Lam Research | other | SEC segment disclosure: ICHOR HOLDINGS LTD → LAM RESEARCH CORP | FY2018 | — | No |
| Meta Platforms, Inc. | ZYNGA INC | other | SEC segment disclosure: META PLATFORMS INC → ZYNGA INC | FY2012 | — | No |
| Synopsys | Intel | other | SEC segment disclosure: SYNOPSYS INC → INTEL CORP | FY2020 | — | No |
| HASBRO INC | Amazon.com, Inc. | other | SEC segment disclosure: HASBRO INC → AMAZON.COM INC | FY2024 | — | No |
| DUOLINGO INC | Apple | other | SEC segment disclosure: DUOLINGO INC → APPLE INC | FY2024 | — | No |
| AMD | HP Inc | gpu_accelerator | SEC segment disclosure: ADVANCED MICRO DEVICES → HP INC | FY2018 | — | No |
| Qorvo | Samsung | other | SEC segment disclosure: QORVO INC → SAMSUNG ELECTRONICS CO LTD | FY2024 | — | No |
| Micron | Dell Technologies | memory | SEC segment disclosure: MICRON TECHNOLOGY INC → DELL TECHNOLOGIES INC | FY1998 | — | No |
| ELECTRONIC ARTS INC | Microsoft Corporation | other | SEC segment disclosure: ELECTRONIC ARTS INC → MICROSOFT CORP | FY2015 | — | No |
| Corsair Gaming | Amazon.com, Inc. | other | SEC segment disclosure: CORSAIR GAMING INC → AMAZON.COM INC | FY2023 | — | No |
| Intel | Dell Technologies | gpu_accelerator | SEC segment disclosure: INTEL CORP → DELL TECHNOLOGIES INC | FY1998 | — | No |
| Ultra Clean | Lam Research | other | SEC segment disclosure: ULTRA CLEAN HOLDINGS INC → LAM RESEARCH CORP | FY2019 | — | No |
| Teradyne | TSMC | semiconductor_equipment | SEC >10% customer disclosure | FY2021 | — | No |
| Teradyne | TSMC | semiconductor_equipment | SEC segment disclosure: TERADYNE INC → TAIWAN SEMICONDUCTOR MFG CO | FY2021 | — | No |
Two counts describe the graph. 18,980 is the count of rows in the relationship table: every observation as filed, one row per source statement. 14,937 is the count of relationships: what remains after rows recording an unnamed counterparty are set aside and every surviving row is collapsed onto its canonical supplier, canonical customer, and product or service, so two sources reporting the same relationship count once.
Relationships arrive from four families: 13,490 rows from a licensed supply-chain database held under subscription and not redistributed; 3,170 re-sourced to primary SEC filings (10-K and 20-F segment and greater-than-ten-per-cent-customer disclosures); 2,128 independently re-derived from a public primary source, each with a verbatim quote; and 192 from BIS cross-reference, CSET classification, and Scrutica research enrichment.
Every count above counts rows as filed. Licensed-only relationships are withheld from display.
Both sides of every row resolve through the canonical organization map, which merges the same real-world company across the different identifier schemes its sources use before anything is counted. Rows then collapse on the resolved pair plus the product or service, so a relationship two sources both report counts once. A citation attests the relationship; where the source carries nothing further, the criticality, value and sole-source fields stay unknown.
Single-source dependencies are the rows flagged sole-source, collapsed on that same resolved pair and product. All 48 come from public sources, and the figure at the top of this page names every one.