Entities
Facilities, companies, and countries — the who and where of compute — each with its full filter, sort, export, and provenance toolkit, plus the Investigator to resolve any identifier into its documented ownership chain. The map plots the same universe in space.
Companies
75,821 organizations have passed through the substrate; the 1,518 listed here are the ones with something to show — a named supplier or customer relationship, a BIS Entity List cross-reference, or a licensed financial record. The remainder are SEC Exhibit-21 subsidiary shells and name-only references whose pages still resolve but carry nothing to rank. Filter by signal, type, or headquarters; sort any column; export the current view with provenance.
Signal
Type
| Company | Type | HQ Country | Signal | Updated |
|---|---|---|---|---|
| Zhen Ding Technology Hldg | Other | TW | Jun 2026 | |
| Zhuhai Bojay Electronics A | Equipment Maker | CN | Jun 2026 | |
| ZingSEMI | Equipment Maker | CN | Apr 2026 | |
| ZIX CORP | Other | — | Jul 2026 | |
| ZOMAX INC/MN | Other | — | Jul 2026 | |
| Zones LLC | Other | US | Jun 2026 | |
| Zoom | Other | JP | Jun 2026 | |
| Zoom Communications | Other | US | Jul 2026 | |
| ZORAN CORP | Other | — | Jul 2026 | |
| Zuken | EPC | JP | Jun 2026 | |
| ZYNGA INC | Other | — | Jul 2026 | |
| 4paradigm | Other | — | Apr 2026 | |
| Advantest | Equipment Maker | JP | Apr 2026 | |
| Alphabet | Equipment Maker | US | Jul 2026 | |
| Amazon.com, Inc. | Cloud Provider | US | Jul 2026 | |
| AMD | Chip Designer | US | Jul 2026 | |
| Apple | Other | US | May 2026 | |
| Applied Materials | Equipment Maker | US | Jul 2026 | |
| ASML | Other | GB | Jul 2026 | |
| Beijing Lingxin Intelligent Technology Co | Other | — | Apr 2026 | |
| Beijing University of Posts and Telecommunications | AI Lab | — | Apr 2026 | |
| Biren Technology | Chip Designer | CN | Apr 2026 | |
| Broadcom Inc. | Chip Designer | US | Jul 2026 | |
| Cambricon | Equipment Maker | CN | Apr 2026 | |
| Cisco | Other | US | Apr 2026 | |
| CloudWalk Technology A | Equipment Maker | CN | Jun 2026 | |
| CoreWeave | Cloud Provider | US | May 2026 | |
| Dahua Technology | Other | — | Apr 2026 | |
| Dongfang Jingyuan Electron Ltd. | Equipment Maker | CN | Apr 2026 | |
| Equinix, Inc. | Colocation Provider | US | Jul 2026 | |
| GuoSheng | Equipment Maker | CN | Apr 2026 | |
| Hangzhou Hikvision Digital Technology Co., Ltd. | Other | — | Jul 2026 | |
| Harbin Institute of Technology | AI Lab | — | Apr 2026 | |
| HiSilicon | Equipment Maker | CN | Apr 2026 | |
| HPE | Chip Designer | US | Jul 2026 | |
| Huada Empyrean | Equipment Maker | CN | Jul 2026 | |
| Huawei Investment & Holding Co., Ltd | Other | — | Jul 2026 | |
| Huawei Technologies | Other | CN | May 2026 | |
| Iflytek Research | Other | — | Apr 2026 | |
| Inspur | AI Lab | HK | Apr 2026 | |
| INTEGRATED CIRCUIT SYSTEMS | Other | — | Jul 2026 | |
| Intel | Fab Operator | US | Jul 2026 | |
| Intellifusion | Equipment Maker | CN | Apr 2026 | |
| Lam Research | Equipment Maker | US | Jul 2026 | |
| Loongson | Equipment Maker | CN | Apr 2026 | |
| Marvell Technology | Chip Designer | US | Jul 2026 | |
| Megvii Inc | AI Lab | — | May 2026 | |
| Meta Platforms, Inc. | AI Lab | US | Apr 2026 | |
| Micron | Fab Operator | US | Jul 2026 | |
| Microsoft Corporation | Cloud Provider | US | Jul 2026 |