Scrutica
| Layer | Criticality (editorial) — Editorial chokepoint-criticality assessment (moderate / high / extreme) — assessed supply-chain importance, authority tier 4. NOT an HHI band; the measured concentration state is in the next column. | Measured concentration — Herfindahl–Hirschman Index recomputed in code from published market shares (range 0–10,000). "≥" marks lower bounds; "sourced-unavailable" means no tier-1/2 share publication exists; AI labs carry no HHI because they consume rather than supply compute. Never computed from editorial weights. | Basis (metric · source · vintage · tier) | Top nodes (editorial importance order) — Ordered by block-sizing weight — the measured share where the layer’s full charted set is published (HBM, Fabrication), otherwise editorial supply-chain-importance weight. Ordering only; weights are never rendered as market-share percentages. |
|---|---|---|---|---|
| AI Labs · Frontier compute consumers | moderate | NO HHI — consumer layer | No HHI: AI labs are frontier compute consumers, not suppliers in a defined product market. Context stats (hard scope labels — NOT market shares in the HHI sense): US-enterprise LLM API spend Anthropic 40 / OpenAI 27 / Google 21 (Menlo Ventures survey n=495, Nov 2025, tier 3); OpenAI ~10–15% of world operational AI compute and top-five labs combined <50% at end-2025 (Epoch AI estimate, tier 2). | OpenAI · US; Google DeepMind · GB; Anthropic · US |
| Cloud & Infrastructure · Compute deployment | moderate | HHI ≥ 1,421 — top-3 lower bound | LOWER BOUND (top-3 only): 28² + 21² + 14² = 1,421 from Synergy Research Group Q4 2025 worldwide cloud infrastructure revenue shares (tier 2). The remaining ~37% (Oracle, CoreWeave, Alibaba, long tail) is unattributed — the true HHI is strictly higher. | Amazon Web Services · US; Microsoft Azure · US; Google Cloud · US |
| Chip Design · GPU & accelerator designers | high | HHI — sourced-unavailable (tier-1/2) | No HHI at tier-1/2. Share band: NVIDIA ~80–85% of merchant AI accelerators (tier-3 analyst band, 2025). Market-definition note: including captive ASICs (TPU, Trainium) moves NVIDIA toward ~75%; excluding ASICs entirely moves it above 90%. The band-squaring arithmetic appears in methodology text only, with caveats; the OECD "over 80%" line is a disclosed tier-3 citation chain (Farooque via OECD), not an OECD measurement. | NVIDIA Corporation · US; Advanced Micro Devices · US; Broadcom Inc · US |
| Advanced Packaging · CoWoS, InFO, chiplet integration | high | HHI — sourced-unavailable | No tier-1/2 share publication for advanced packaging (CoWoS) — HHI sourced-unavailable. Capacity context (TrendForce, tier 2): ~75K wafers/month end-2025 → ~130K projected end-2026; TSMC dominant with ASE (SPIL) and Amkor as overflow. Capacity is not a market share. | TSMC (CoWoS) · TW; ASE Technology · TW; Amkor Technology · US |
| HBM Memory · AI accelerator memory | high | HHI 4,174 — measured | Measured: 57² + 22² + 21² = 4,174 from Counterpoint Research Q3 2025 HBM revenue shares (SK Hynix / Samsung / Micron — all suppliers named; tier 2, via Semiecosystem). Samsung recovered 15% → 22% Q2→Q3 2025 on HBM3E qualification; refresh on Q4 publication. | SK Hynix · KR; Samsung · KR; Micron Technology · US |
| Fabrication · Semiconductor foundries | extreme | HHI 5,007 — named-share lower bound | Named-share lower bound: 69.9² + 7.2² + 5.32² + 4.35² + 3.87² + 2.6² ≈ 5,007, recomputed in code from TrendForce FY2025 foundry revenue shares (tier 2, via Taipei Times 2026-03-14). Advanced node: Taiwan ~92% of leading-edge pure-play foundry manufacturing (CSET/VerWey 2021, COUNTRY-level incl. UMC + PSMC); no company-level advanced-node HHI exists at tier-1/2. | TSMC · TW; Samsung Foundry · KR; SMIC · CN |
| Equipment · Lithography, deposition, etch | extreme | HHI 10,000 — EUV sub-layer only | EUV sub-layer (tier 1): ASML 100% of EUV lithography systems → HHI 10,000 — the strongest figure in this dataset. Source: ASML 2025 Annual Report, financial-performance section + Q4-2025 investor presentation (Form 6-K, Jan 28, 2026) (48 EUV systems recognized 2025, 4 EXE + 44 NXE; EUV system sales +39% to €11.6B). Broader wafer-fab equipment market: sourced-unavailable — no HHI published. The prior blended equipment figure is retired. | ASML Holding · NL; Applied Materials · US; Lam Research · US |
| Materials & Chemicals · Wafers, photoresists, specialty gases | high | HHI — sourced-unavailable | Sourced-unavailable, split layer: silicon-wafer per-supplier shares have no public locus (Omdia subscription-gated; ledger 2026-06-09) — a wafer HHI does not publish; photoresist/specialty-chemical shares have no tier-1/2 publication. Country-level context: Japan ~56% of global silicon wafers (CSET TechInsights 2024, tier 2). | Shin-Etsu Chemical · JP; SUMCO Corporation · JP; JSR Corporation · JP |