Samsung: 40% (South Korea)SK Hynix: 32% (South Korea)Micron: 23% (USA / Japan)Nanya Technology: 5% (Taiwan)
TrendForce Q4 2024 DRAM market share (revenue basis) · Tier 2 · estimated
NAND FlashHHI: 1,968Japan: 19%
Samsung: 33% (South Korea)Kioxia / WD: 19% (Japan)SK Hynix / Solidigm: 18% (South Korea / USA)Micron: 13% (USA / Japan / Singapore)YMTC: 5% (China)
TrendForce Q4 2024 NAND market share (revenue basis) · Tier 2 · estimated
HBM (High Bandwidth Memory)HHI: 4,122Japan: 19%
SK Hynix: 56% (South Korea)Samsung: 25% (South Korea)Micron: 19% (USA / Japan)
Astute Group Q3 2025 HBM market share; Samsung recovered from 17% (Q2 2025) to ~25% after HBM3E NVIDIA qualification · Tier 3 · estimated
Silicon Wafers (300mm)HHI: 2,009Japan: 54%
Shin-Etsu: 30% (Japan)SUMCO: 24% (Japan)Siltronic: 12% (Germany)SK Siltron: 10% (South Korea)Wafer Works: 5% (Taiwan)
Omdia silicon wafer market tracker 2024; Shin-Etsu/SUMCO annual reports · Tier 2 · estimated
Semiconductor Equipment (Coater/Developer)HHI: 8,150Japan: 90%
Tokyo Electron: 90% (Japan)SUSS MicroTec: 5% (Germany)Others: 5% (Various)
Omdia semiconductor equipment market tracker; Tokyo Electron Annual Report 2024 · Tier 2 · estimated
Semiconductor Test Equipment (Memory ATE)HHI: 4,350Japan: 55%
Advantest: 55% (Japan)Teradyne: 35% (USA)Others: 10% (Various)
Omdia ATE market tracker; Advantest Annual Report 2024 · Tier 2 · estimated
Kioxia Yokkaichi (Y6/Y7)NAND
Kioxia / Western Digital JV · Yokkaichi, Mie Prefecture
BiCS Flash (162-layer, 218-layer), 3D NAND for SSDs
Tokyo Electron HQ & Fabequipment
Tokyo Electron (TEL) · Minato-ku, Tokyo
Coater/developers, Etch systems, Deposition systems, Cleaning equipment
Advantest HQequipment
Advantest Corporation · Chiyoda-ku, Tokyo
Semiconductor test systems (SoC, memory), HBM test solutions
SCREEN Holdings (Kyoto)equipment
SCREEN Holdings · Kyoto
Wafer cleaning equipment, Coater/developers