- Alibaba Zhangbei~203 MW operating
- VNET Bayin Ulanqab~252 MW operating
- Huawei Horinger~212 MW operating
- Huawei Wuhu~181 MW operating
China
Supplier relationships, by countryCustomer relationships, by country
Power on record
52,000 accelerators are recorded on 3 operating facility records in China.
Capacity over time
Reported power reached ~848 MW on 18 Aug 2026, across the 4 facilities with a dated reading.
The pale line is a scenario built from the scheduled figures of these same facilities at 4 future construction dates, if the schedule lands.
All 24 capacity snapshots
| Date | Power | Accelerators | Facilities | Revised | Basis and source |
|---|---|---|---|---|---|
| 1 Jan 2025 | ~51 MW | 1 | 1 | Observed. Epoch AI Frontier Data Centers | |
| 1 Mar 2025 | ~137 MW | 1 | 1 | Observed. Epoch AI Frontier Data Centers | |
| 1 Jun 2025 | ~179 MW | 2 | 1 | Observed. Epoch AI Frontier Data Centers | |
| 1 Jul 2025 | ~265 MW | 3 | 2 | Observed. Epoch AI Frontier Data Centers | |
| 1 Aug 2025 | ~265 MW | 3 | 1 | Observed. Epoch AI Frontier Data Centers | |
| 17 Sep 2025 | ~367 MW | 4 | 1 | Observed. Epoch AI Frontier Data Centers | |
| 1 Nov 2025 | ~562 MW | 4 | 2 | Observed. Epoch AI Frontier Data Centers | |
| 1 Dec 2025 | ~620 MW | 4 | 1 | Observed. Epoch AI Frontier Data Centers | |
| 23 Dec 2025 | ~620 MW | 4 | 1 | Observed. Epoch AI Frontier Data Centers | |
| 3 Jan 2026 | ~721 MW | 4 | 1 | Observed. Epoch AI Frontier Data Centers | |
| 24 Jan 2026 | ~721 MW | 4 | 1 | Observed. Epoch AI Frontier Data Centers | |
| 1 Feb 2026 | ~767 MW | 4 | 1 | Observed. Epoch AI Frontier Data Centers | |
| 5 Mar 2026 | ~767 MW | 4 | 2 | Observed. Epoch AI Frontier Data Centers | |
| 6 May 2026 | ~767 MW | 4 | 1 | Observed. Epoch AI Frontier Data Centers | |
| 12 May 2026 | ~767 MW | 4 | 1 | Observed. Epoch AI Frontier Data Centers | |
| 1 Jun 2026 | ~767 MW | 4 | 1 | Observed. Epoch AI Frontier Data Centers | |
| 7 Jun 2026 | ~767 MW | 4 | 1 | Observed. Epoch AI Frontier Data Centers | |
| 1 Jul 2026 | ~848 MW | 4 | 1 | Observed. Epoch AI Frontier Data Centers | |
| 6 Aug 2026 | ~848 MW | 4 | 1 | Observed. Epoch AI Frontier Data Centers | |
| 18 Aug 2026 | ~848 MW | 4 | 1 | Observed. Epoch AI Frontier Data Centers | |
| 31 Dec 2026 | ~1.1 GW | 4 | 1 | Scheduled. Epoch AI Frontier Data Centers | |
| 1 Sep 2027 | ~1.6 GW | 4 | 1 | Scheduled. Epoch AI Frontier Data Centers | |
| 1 Dec 2027 | ~1.7 GW | 4 | 1 | Scheduled. Epoch AI Frontier Data Centers | |
| 14 Feb 2028 | ~1.9 GW | 4 | 1 | Scheduled. Epoch AI Frontier Data Centers |
Facilities
Ownership
23.9% of operating power is traced to a company with an SEC identifier or a linked parent.
Facilities by ownership tier
Open a facility for its ownership relationships and sources.
- Tier 4China Mobile Intelligent Computing Center — HarbinChina MobileCompany identified; parent unrecorded—view →
- Tier 4China Mobile Smart Computing Center — Hohhot (Horinger Campus)China MobileCompany identified; parent unrecorded—view →
- Tier 4China Telecom Guizhou Information Park (Gui'an Cloud Computing Base)China TelecomCompany identified; parent unrecorded—view →
- Tier 4China Telecom Cloud Computing Inner Mongolia Information ParkChina TelecomCompany identified; parent unrecorded—view →
- Tier 4Huawei Dongguan Cloud Data Center (Songshan Lake)Huawei TechnologiesCompany identified; parent unrecorded—view →
- Tier 4Huawei Cloud Gui'an Data CenterHuawei TechnologiesCompany identified; parent unrecorded—view →
- Tier 4Huawei Cloud Ulanqab Data CenterHuawei TechnologiesCompany identified; parent unrecorded—view →
- Tier 4JD Cloud North China (Langfang) Cloud Data CenterJD.com, Inc.Company identified; parent unrecorded—view →
- Tier 4JD Cloud East China Data Center (Suqian)JD.com, Inc.Company identified; parent unrecorded—view →
- Tier 4Kingsoft Cloud Tianjin Yixianyuan Cloud Computing Data CenterKingsoft Cloud Holdings LimitedCompany identified; parent unrecorded—view →
- Data GapAgricultural Bank of China (Data Center)—No operator, site owner or hardware owner linked—view →
- Data Gap醫院管理局支援服務中心 Hospital Authority Supporting Services Centre—No operator, site owner or hardware owner linked—view →
- Tier 4Shenzhen Baiwangxinyun DatacenterShenzhen Yixin Technology Co., Ltd.Company identified; parent unrecorded—view →
- Tier 3Telehouse - Beijing BDATelehouse - Global Data CentersParent linked through other sources—view →
- Tier 3Telehouse - Beijing BEZTelehouse - Global Data CentersParent linked through other sources—view →
- Tier 3Telehouse - Shanghai ZhangjiangTelehouse - Global Data CentersParent linked through other sources—view →
- Tier 4Tencent Gui'an Seven Star Data CenterTencent Holdings Ltd.Company identified; parent unrecorded—view →
- Tier 4Tencent Tianjin Cloud Data CenterTencent Holdings Ltd.Company identified; parent unrecorded—view →
- Tier 4ByteDance Volcano Cloud Taihang Computing Centre II (Datong)ByteDanceCompany identified; parent unrecorded—view →
Ownership tiers over time
Operating-capacity-weighted shares at each recorded snapshot. Dates are when the distribution was captured; the ownership evidence can be older.
43 snapshots weighted by operating capacity, from 2026-09-23 to 2026-11-04. 144 earlier snapshots weighted every recorded power figure and are listed under Snapshot values.
Snapshots from 11 July 2026 to 23 September 2026 count Epoch’s records at IT power, which Epoch derives by dividing facility power by a peak PUE of 1.2 or 1.4; the snapshots on either side count facility power. The steps at those dates are that change of basis, not a change in capacity. A dashed line marks the step.
- Tier 1 — company has an SEC identifier or a parent linked through filing, registry or supply-chain data
- Tier 2 — parent linked through licensed ownership data
- Tier 3 — parent linked through other sources
- Tier 4 — company identified; parent unrecorded
- Data Gap — no company linked
Snapshot values
Displayed MW are rounded to two decimal places. Operating capacity counts operational records only; a snapshot taken before operating weighting began lists only the figure it recorded, every status summed. Download values (JSON) for the full inputs used to calculate the shares. Consecutive snapshots showing the same figures are listed once, under their first and last dates; the download keeps every date.
2026-04-25
221.8 MW recorded, every status · 22 facilities
- Tier 1 — company has an SEC identifier or a parent linked through filing, registry or supply-chain data
- 203 MW · 3 facilities · 91.5%
- Tier 2 — parent linked through licensed ownership data
- 0 MW · 0 facilities · 0.0%
- Tier 3 — parent linked through other sources
- 0 MW · 3 facilities · 0.0%
- Tier 4 — company identified; parent unrecorded
- 18.8 MW · 6 facilities · 8.5%
- Data Gap — no company linked
- 0 MW · 10 facilities · 0.0%
2026-04-27 – 2026-05-05 · 9 snapshots
221.8 MW recorded, every status · 22 facilities
- Tier 1 — company has an SEC identifier or a parent linked through filing, registry or supply-chain data
- 221.8 MW · 4 facilities · 100.0%
- Tier 2 — parent linked through licensed ownership data
- 0 MW · 0 facilities · 0.0%
- Tier 3 — parent linked through other sources
- 0 MW · 3 facilities · 0.0%
- Tier 4 — company identified; parent unrecorded
- 0 MW · 5 facilities · 0.0%
- Data Gap — no company linked
- 0 MW · 10 facilities · 0.0%
2026-05-06 – 2026-05-16 · 11 snapshots
221.8 MW recorded, every status · 22 facilities
- Tier 1 — company has an SEC identifier or a parent linked through filing, registry or supply-chain data
- 221.8 MW · 4 facilities · 100.0%
- Tier 2 — parent linked through licensed ownership data
- 0 MW · 0 facilities · 0.0%
- Tier 3 — parent linked through other sources
- 0 MW · 3 facilities · 0.0%
- Tier 4 — company identified; parent unrecorded
- 0 MW · 3 facilities · 0.0%
- Data Gap — no company linked
- 0 MW · 12 facilities · 0.0%
2026-05-17
221.8 MW recorded, every status · 34 facilities
- Tier 1 — company has an SEC identifier or a parent linked through filing, registry or supply-chain data
- 221.8 MW · 16 facilities · 100.0%
- Tier 2 — parent linked through licensed ownership data
- 0 MW · 0 facilities · 0.0%
- Tier 3 — parent linked through other sources
- 0 MW · 3 facilities · 0.0%
- Tier 4 — company identified; parent unrecorded
- 0 MW · 3 facilities · 0.0%
- Data Gap — no company linked
- 0 MW · 12 facilities · 0.0%
2026-05-18 – 2026-06-02 · 16 snapshots
221.8 MW recorded, every status · 55 facilities
- Tier 1 — company has an SEC identifier or a parent linked through filing, registry or supply-chain data
- 221.8 MW · 21 facilities · 100.0%
- Tier 2 — parent linked through licensed ownership data
- 0 MW · 0 facilities · 0.0%
- Tier 3 — parent linked through other sources
- 0 MW · 7 facilities · 0.0%
- Tier 4 — company identified; parent unrecorded
- 0 MW · 15 facilities · 0.0%
- Data Gap — no company linked
- 0 MW · 12 facilities · 0.0%
2026-06-03 – 2026-06-30 · 22 snapshots
203 MW recorded, every status · 54 facilities
- Tier 1 — company has an SEC identifier or a parent linked through filing, registry or supply-chain data
- 203 MW · 22 facilities · 100.0%
- Tier 2 — parent linked through licensed ownership data
- 0 MW · 0 facilities · 0.0%
- Tier 3 — parent linked through other sources
- 0 MW · 5 facilities · 0.0%
- Tier 4 — company identified; parent unrecorded
- 0 MW · 15 facilities · 0.0%
- Data Gap — no company linked
- 0 MW · 12 facilities · 0.0%
2026-07-01 – 2026-07-10 · 10 snapshots
203 MW recorded, every status · 54 facilities
- Tier 1 — company has an SEC identifier or a parent linked through filing, registry or supply-chain data
- 203 MW · 20 facilities · 100.0%
- Tier 2 — parent linked through licensed ownership data
- 0 MW · 0 facilities · 0.0%
- Tier 3 — parent linked through other sources
- 0 MW · 7 facilities · 0.0%
- Tier 4 — company identified; parent unrecorded
- 0 MW · 15 facilities · 0.0%
- Data Gap — no company linked
- 0 MW · 12 facilities · 0.0%
2026-07-11 – 2026-09-22 · 74 snapshots
631.8 MW recorded, every status · 56 facilities
- Tier 1 — company has an SEC identifier or a parent linked through filing, registry or supply-chain data
- 169 MW · 20 facilities · 26.7%
- Tier 2 — parent linked through licensed ownership data
- 0 MW · 0 facilities · 0.0%
- Tier 3 — parent linked through other sources
- 0 MW · 3 facilities · 0.0%
- Tier 4 — company identified; parent unrecorded
- 462.8 MW · 21 facilities · 73.3%
- Data Gap — no company linked
- 0 MW · 12 facilities · 0.0%
2026-09-23
631.8 MW operating · 56 facilities
- Tier 1 — company has an SEC identifier or a parent linked through filing, registry or supply-chain data
- 169 MW · 20 facilities · 26.7%
- Tier 2 — parent linked through licensed ownership data
- 0 MW · 0 facilities · 0.0%
- Tier 3 — parent linked through other sources
- 0 MW · 3 facilities · 0.0%
- Tier 4 — company identified; parent unrecorded
- 462.8 MW · 21 facilities · 73.3%
- Data Gap — no company linked
- 0 MW · 12 facilities · 0.0%
2026-09-24 – 2026-10-22 · 29 snapshots
733 MW operating · 56 facilities
- Tier 1 — company has an SEC identifier or a parent linked through filing, registry or supply-chain data
- 203 MW · 20 facilities · 27.7%
- Tier 2 — parent linked through licensed ownership data
- 0 MW · 0 facilities · 0.0%
- Tier 3 — parent linked through other sources
- 0 MW · 3 facilities · 0.0%
- Tier 4 — company identified; parent unrecorded
- 530 MW · 21 facilities · 72.3%
- Data Gap — no company linked
- 0 MW · 12 facilities · 0.0%
2026-10-23 – 2026-10-31 · 9 snapshots
667 MW operating · 56 facilities
- Tier 1 — company has an SEC identifier or a parent linked through filing, registry or supply-chain data
- 203 MW · 20 facilities · 30.4%
- Tier 2 — parent linked through licensed ownership data
- 0 MW · 0 facilities · 0.0%
- Tier 3 — parent linked through other sources
- 0 MW · 3 facilities · 0.0%
- Tier 4 — company identified; parent unrecorded
- 464 MW · 21 facilities · 69.6%
- Data Gap — no company linked
- 0 MW · 12 facilities · 0.0%
2026-11-01 – 2026-11-04 · 4 snapshots
848 MW operating · 58 facilities
- Tier 1 — company has an SEC identifier or a parent linked through filing, registry or supply-chain data
- 203 MW · 20 facilities · 23.9%
- Tier 2 — parent linked through licensed ownership data
- 0 MW · 0 facilities · 0.0%
- Tier 3 — parent linked through other sources
- 0 MW · 3 facilities · 0.0%
- Tier 4 — company identified; parent unrecorded
- 645 MW · 22 facilities · 76.1%
- Data Gap — no company linked
- 0 MW · 13 facilities · 0.0%
Sovereign programme
National AI Programs / Big Fund III / Eastern Data Western Computing
China’s national compute plans combine regional data-centre development with investment in domestic chips and AI companies. Big Fund III has RMB344B in registered capital and helped establish the RMB60B National AI Industry Investment Fund. Its contribution to the latter is not separately disclosed, so the two fund sizes have no additive total here.
Partners: Huawei, Biren Technology, Alibaba, ByteDance, Tencent, Baidu, MIIT.
Export controls
1,067 Entity List designations against organisations located here.
Advanced-chip exports face extensive restrictions. Chinese-designed alternatives require their own legal assessment.
Chip-specific conditions and sources
- A100
- Licence required since the October 2022 rule (87 FR 62186). Under the January 2026 rule, qualifying US exports to China or Macau are reviewed case by case: its TPP of 4,992 and memory bandwidth of 2,039 GB/s are below the rule’s ceilings of 21,000 and 6,500 GB/s. Subject to the same aggregate-TPP cap and additional application requirements as H200; see the cited rule.
- A800
- October 2023 rule (88 FR 73458): revised TPP and performance-density criteria under ECCN 3A090. Its TPP and memory bandwidth are below the January 2026 rule’s ceilings, but BIS limits that rule to chips commercially available in the United States when it was published, and caps exports to China at half of the same chip’s US shipments; this variant was built to pass the October 2022 rule for export to China, and no US sales of it are recorded here, so the presumption of denial stands.
- H100
- Licence required since the October 2022 rule (87 FR 62186). Under the January 2026 rule, qualifying US exports to China or Macau are reviewed case by case: its TPP of 15,832 and memory bandwidth of 3,350 GB/s are below the rule’s ceilings of 21,000 and 6,500 GB/s. Subject to the same aggregate-TPP cap and additional application requirements as H200; see the cited rule.
- H800 SXM5
- October 2023 rule (88 FR 73458): revised TPP and performance-density criteria under ECCN 3A090. Its TPP and memory bandwidth are below the January 2026 rule’s ceilings, but BIS limits that rule to chips commercially available in the United States when it was published, and caps exports to China at half of the same chip’s US shipments; this variant was built to pass the October 2022 rule for export to China, and no US sales of it are recorded here, so the presumption of denial stands.
- H800 PCIe
- October 2023 rule (88 FR 73458): revised TPP and performance-density criteria under ECCN 3A090. Its TPP and memory bandwidth are below the January 2026 rule’s ceilings, but BIS limits that rule to chips commercially available in the United States when it was published, and caps exports to China at half of the same chip’s US shipments; this variant was built to pass the October 2022 rule for export to China, and no US sales of it are recorded here, so the presumption of denial stands.
- H200
- January 2026 rule: case-by-case review for qualifying US exports to China or Macau. Conditions include a cap on aggregate TPP exported to China/Macau: at most 50% of TPP shipped to US customers for US end-use for the same commodities, from first commercial US shipment through application. Supply, end-use, security and independent US testing requirements also apply.
- B200
- Exceeds TPP threshold (21,000) and DRAM bandwidth threshold (6,500 GB/s). No case-by-case pathway for Blackwell-class.
- B300
- Exceeds all BIS advanced computing thresholds (ECCN 3A090/4A090)
- NVIDIA Rubin GPU
- Preliminary NVIDIA individual-GPU specifications yield TPP 140,000 (17,500 dense FP8 TFLOPS × 8 bits, tied by 35,000 dense FP4 TFLOPS × 4 bits), above the 4,800 3A090.a parameter.
- B30A
- Designed to fall below BIS Performance Density thresholds. No formal BIS ruling as of Q3 2025. Jensen Huang (Aug 2025): "That's not our decision to make. It's up to the United States government."
- MI300X
- Licence required under ECCN 3A090.a as revised by the October 2023 rule (88 FR 73458). Under the January 2026 rule, qualifying US exports to China or Macau are reviewed case by case: its TPP of 20,919 and memory bandwidth of 5,300 GB/s are below the rule’s ceilings of 21,000 and 6,500 GB/s. Subject to the same aggregate-TPP cap and additional application requirements as H200; see the cited rule.
- MI325X
- January 2026 rule: case-by-case review for qualifying US exports to China or Macau. Subject to the same aggregate-TPP cap and additional application requirements as H200; see the cited rule.
- MI350X
- At 8,000 GB/s, memory bandwidth exceeds the 6,500 GB/s ceiling for conditional case-by-case review of US exports to China or Macau under the January 2026 rule.
- MI355X
- Exceeds BIS advanced computing thresholds
- MI400
- The announced 19,600 GB/s memory bandwidth exceeds the 6,500 GB/s ceiling for conditional case-by-case review of US exports to China or Macau under the January 2026 rule.
- Ascend 910B
- Named in BIS’s May 2025 guidance on chips presumptively subject to General Prohibition 10.
- Ascend 910C
- Named in BIS’s May 2025 guidance on chips presumptively subject to General Prohibition 10.
- Ascend 910D
- Named in BIS’s May 2025 guidance on chips presumptively subject to General Prohibition 10.
- Ascend 920
- Chinese-designed accelerator. The cited reporting does not establish whether particular items or transactions are subject to the EAR.
The January 2026 pathway applies to qualifying US exports to China or Macau below 21,000 TPP and 6,500 GB/s total DRAM bandwidth. H200 and MI325X are examples, not an exhaustive eligibility list.
The rule caps aggregate TPP exported to China and Macau against 50% of TPP shipped to US customers for US end-use for the same commodities, from first commercial US shipment through application. Supply, end-use, security and testing conditions also apply.
BIS’s May 2025 guidance lists Ascend 910B, 910C and 910D as PRC advanced-computing chips subject to the presumption that General Prohibition 10 applies: they “were likely developed or produced in violation of U.S. export controls”, so using them without BIS authorization risks violating those controls.
Access routes and alternatives
- Domestic production
- Huawei’s Ascend 910C provides a Chinese-designed accelerator alternative.SemiAnalysis estimated CloudMatrix 384 at 300 PFLOPS of dense BF16 in April 2025: about 1.7 times GB200 NVL72 throughput at 4.1 times all-in system power, including networking and storage. These are analyst estimates of system specifications.SemiAnalysis, 16 Apr 2025
- Cloud routing
- March 2026 reporting described plans for ByteDance to access 36,000 Blackwell GPUs through Aolani Cloud in Malaysia.The report concerns planned remote access to overseas hardware. It does not establish that the full cluster was operational.Tom’s Hardware, 13 Mar 2026, citing the Wall Street Journal
- Compliant variant
- TrendForce reported a proposed China-focused B30A Blackwell variant in August 2025.Its report described possible September 2025 test samples. This announcement does not establish later product availability or BIS approval.TrendForce, 19 Aug 2025
- Stockpile
- The sources recorded in this profile do not establish the size or composition of pre-control accelerator stockpiles.
Chip industry. Huawei designs the Ascend family. SemiAnalysis’s April 2025 review of Ascend 910C described continued reliance on foreign memory and fabrication.
Chinese company chip observations
| Chip class / organisation | Quantity | Scope | Evidence |
|---|---|---|---|
| NVIDIA H20 | Unknown | Reported procurement Disputed report Quantity withheld; ByteDance denied the reported transaction. Period: 2025-Q1 | Source 2025-04-28 Tier 4 · quantity not established Evidence scopeSCMP on April 28, 2025 relays Caijing reporting about Tencent GPU purchases worth about 2 billion yuan, primarily H20. That amount does not establish an H20 unit count. The article also records ByteDance denying the report. Procurement report is disputed. No unit-price conversion or deployment quantity is inferred. |
| NVIDIA H20 | Unknown | Reported procurement Pending orders; company quantity unknown. Period: 2025-Q1 | Source 2025-04-15 Tier 3 · source reporting Evidence scopeIFP on April 15, 2025 discusses pending H20 exports across ByteDance, Alibaba and Tencent. It does not allocate the collective order to Alibaba or establish delivery. Company quantity unknown; orders do not establish installation. |
| NVIDIA H20 | Unknown | Deployment status unknown Disputed report Disputed press report; stock quantity, deployment and regulatory-freeze status unestablished. | Source 2025-04-28 Tier 4 · quantity not established Evidence scopeSCMP reports H20 holdings and proposed sales involving ByteDance, while also recording ByteDance’s denial of the report. No unit count, installed inventory or September regulatory freeze is established here. No inference of frozen or deployed inventory is made from the checked source. |
| NVIDIA H20 | Unknown | Reported procurement Orders only; quantity, delivery and aggregate membership unestablished. Period: 2025-01 | Source 2025-01-31 Tier 4 · quantity not established Evidence scopeH20 orders are mentioned; no H20-specific quantity is established by the checked article. The article mentions H20 orders without a quantity. These orders are not assigned to the 50,000-chip access aggregate. |
| Baidu Kunlun (generation unspecified) | ~30,000 | Reported deployed Press-reported cluster; generation and physical site unverified. Period: 2025-Q2 | Source 2026-01-06 Tier 3 · source reporting Evidence scopeThe cited January 6, 2026 article reports that Baidu brought a 30,000-chip Kunlun training cluster online in April 2025. Its cluster passage does not specify a Kunlun generation. This remains a press-reported cluster count. No building location or chip generation is inferred; a direct Baidu disclosure has not been verified. |
| Huawei AI chips (model unspecified) | Unknown | Planned use Planned inference use; chip model, quantity and deployment unestablished. | Source 2025-07-26 Tier 3 · source reporting Evidence scopeFootnote 19 of the July 26, 2025 Epoch article reports ByteDance planning to use Huawei chips for inference. It does not identify 100,000 Ascend 910B chips or an installed fleet. Retained only at the source-supported planned-use scope. The original 100,000-unit assertion is withheld. |
| NVIDIA Hopper (shared-access aggregate) | ~50,000 | Reported access (shared resources) Period: 2025-01 | Source 2025-01-31 Tier 3 · source reporting Evidence scopeSemiAnalysis estimates access to around 50,000 Hopper GPUs shared by DeepSeek and High-Flyer. Its H100/H800 observations describe parts of this shared aggregate. Shared resources across DeepSeek and High-Flyer, geographically distributed and used for several workloads. Component rows are nonadditive with the aggregate. |
| NVIDIA H100 | ~10,000 Component of shared aggregate; excluded from sums. | Reported access (shared resources) Period: 2025-01 | Source 2025-01-31 Tier 3 · source reporting Evidence scopeSemiAnalysis estimates access to around 10,000 H100 GPUs within the shared Hopper aggregate. This is not a per-run allocation or proof of exclusive ownership. Shared resources across DeepSeek and High-Flyer, geographically distributed and used for several workloads. Component rows are nonadditive with the aggregate. |
| NVIDIA H800 | ~10,000 Component of shared aggregate; excluded from sums. | Reported access (shared resources) Period: 2025-01 | Source 2025-01-31 Tier 3 · source reporting Evidence scopeSemiAnalysis estimates access to around 10,000 H800 GPUs within the shared Hopper aggregate. This is not a per-run allocation or proof of exclusive ownership. Shared resources across DeepSeek and High-Flyer, geographically distributed and used for several workloads. Component rows are nonadditive with the aggregate. |
Sums of recorded estimates, by scope
- Reported deployed
- ~30,000 recorded sum · 1 of 1 observations quantified
- Reported procurement
- Unknown · quantities unavailable for 3 observations
- Reported access (shared resources)
- ~50,000 recorded sum · 1 of 1 observations quantified
- Planned use
- Unknown · quantities unavailable for 1 observation
- Deployment status unknown
- Unknown · quantities unavailable for 1 observation
5 source records withheld: company–hardware association unestablished
Tencent / Huawei Ascend 910C: The recorded citations have not established this operator-specific hardware association. Product specifications or industry production do not establish a customer deployment.
Alibaba / Huawei Ascend 910C: The recorded citations have not established this operator-specific hardware association. Product specifications or industry production do not establish a customer deployment.
Baidu / NVIDIA H20: No source is recorded for a Baidu–H20 association. Absence from a report about other buyers does not establish Baidu’s hardware strategy.
No source citation was recorded.
Huawei Cloud / Huawei Ascend 910B: The recorded citations have not established this operator-specific hardware association. Product specifications or industry production do not establish a customer deployment.
Huawei Cloud / Huawei Ascend 910C: The recorded citations have not established this operator-specific hardware association. Product specifications or industry production do not establish a customer deployment.
These observations cover selected organisations and different source dates. Sums cover recorded quantities only; they are not a census of current inventory. Purchases and shared access remain separate from deployed stock. Component observations remain visible but are excluded from sums when their reviewed aggregate is present.
5 organisations with publishable observations · 6 chip categories. Source dates: 2025-01-31–2026-01-06.
Sources: January 2026 export-review criteria; BIS GP10 guidance on Ascend chips; Ascend production analysis, April 2025.
Suppliers and customers
The United States is the largest customer country, with 17 relationships, and the largest supplier country, with 19.
Organisations
All 107 organisations
Related pages
Sources
4 sources
- Epoch AI frontier data centers and GPU clusters: https://epoch.ai/data/data-centers
- Export-control rules (US EAR, Dutch and Japanese regimes): https://scrutica.com/export-controls/countries
- BIS Entity List via the Consolidated Screening List and the Federal Register: https://www.federalregister.gov/
- Sovereign AI programme register: https://scrutica.com/sovereign-ai
How the figures were made
Geography. Outlines use Natural Earth de facto boundaries. Distant parts may be omitted; located records outside the drawing are counted in its caption. Power circles use the same scale across countries.
Counts. Counts retrieved 4 Nov 2026. Operating capacity and ownership shares include estimated capacity; a campus figure recorded as its full build-out, earlier phases and second records are shown apart rather than counted. Sovereign programme ratios use government-only announced amounts where available; each ratio lists its numerator and denominator.
Corporate traceability. No company linked means no operator, site owner or hardware owner has been linked to the facility. The tiers do not verify property ownership or facility operation. Announced and under-construction figures are not counted here. Tiers classify the available sources for a company linked to each facility. A linked company’s SEC identifier can qualify it for the first tier without establishing a parent. Ownership relationships and their sources are listed on the facility and company pages.
Export-control posture. Recipient and end-use conditions can change the outcome of a transaction. Classification review: 17 Jul 2026. Access basis: ~0.35. A dated comparison of dense BF16 peak throughput: SemiAnalysis reported 780 TFLOPS per Ascend 910C chip/package in April 2025; NVIDIA lists 2,250 TFLOPS for B200 without sparsity. The quotient, 780 ÷ 2,250, rounds to 0.35. Country-level compute availability is not quantified by this chip comparison. Ascend 910C: 780 dense BF16 TFLOPS, April 2025. B200: 2,250 non-sparse BF16 TFLOPS.
Capacity over time. Records not yet operating, campus build-out figures and earlier phases of operating clusters are not in the line. Changes can reflect new capacity, revised estimates or additional sources. 20 historical snapshots from 1 Jan 2025 to 18 Aug 2026. Each point sums the latest available power figure for every facility operating today with a snapshot by that date (4 facilities in the latest historical total). These are the timeline’s own readings, which can differ from a facility record’s current figure; the operating capacity stated above sums the records.
Bilateral supply-chain partners. Counts include every tracked relationship; no dollar amounts are published for them.
Organisations headquartered here. Across all industries; multiple identifiers may refer to the same company. The record lists 107 distinct organisations with qualifying market-capitalisation or linked-record evidence, after reviewing all public organisation rows for China; the source holds 2,603 organisation rows, including duplicate identities and rows without qualifying evidence, and the company register applies its own evidence scope. A type is shown only where the classification has been reviewed.
Corrections to this page, 3
Identifiers
- ISO country code
- CN